Ansys cloud-native solutions provide unparalleled capacity to speed up completion times for even the largest finFET integrated circuits (IC) and 3D/2.5D multi-die systems. These powerful multiphysics analysis and verification tools reduce power consumption, improve performance and reliability, and lower project risk with foundry-certified golden signoff verification.
Cloud-native elastic compute architecture for full-chip capacity
JANUARY 2021
Ansys Semiconductor products lead the industry in power integrity, signal integrity, reliability and thermal signoff for all advanced process nodes down to 5nm and for advanced 3D multi-die system integrations.
Enhancements include:
Ansys Semiconductor products provide a comprehensive suite of multiphysics EM/IR, thermal and electromagnetic simulation engines designed to support third-party IC implementation flows for digital and transistor-level design.
The core products are built on the ultra-high capacity, cloud-native SeaScape™ platform, which uses an elastic-compute big-data machine learning architecture to deliver near-linear scalability over thousands of CPU cores.
Ansys RedHawk-SC (digital) and Ansys Totem (analog) are the world’s leading solutions for SoC power integrity analysis. You can model supply voltage variations with foundry-verified signoff accuracy and reduce the overall power noise impact through the package and board. Current density and electromigration analysis are thermal-aware for both power supply metal and signal interconnect on chip or package layers.
Ansys RedHawk-SC’s diagnostics capabilities identify the sources of dynamic power supply noise through vectored and vectorless activity that give comprehensive coverage and eliminate voltage escapes and potential frequency loss. Ansys Path FX provides a variation-aware static timing analysis of critical paths to SPICE accuracy across all voltages with just a single timing library file.
Ansys RedHawk-SC Electrothermal provides multiphysics analysis for stacked multi-die packages for power integrity, thermal analysis, and mechanical stress/warpage – all the way from early prototyping to final signoff. This high-capacity multiphysics analysis is in full context of the entire 2.5D/3D system for maximum accuracy and to ensure system reliability. The co-simulation analysis integrates to system-level tools including Ansys Icepak and Ansys SIwave.
Identify power hotspots and debug their root cause interactively with a powerful graphical interface and custom queries. Reduce clock, memory, and logic power with high-impact block- and instance-level RTL techniques based on production-proven physically-aware power analysis. Profile power of real workloads rapidly and qualify coverage.
Ansys RaptorH has the capacity capacity to model power grids, full custom blocks, spiral inductors, and clock trees. Its high-speed distributed processing delivers accurate, silicon-proven S-parameter and RLCk models. RaptorH makes it easy to use either the general purpose HFSS engine or the silicon-optimized RaptorX engine.
Ansys PathFinder simulates human body model (HBM) and charge device model (CDM) events for static and transient silicon-correlated accuracy. It ensures ESD integrity and reduces debugging turnaround time.
Ansys Totem is a comprehensive co-simulation framework for analog, mixed-signal and custom circuit designs and provides a comprehensive full-chip solution for modeling and simulating noise injection, propagation and coupling through the on-die power grid RLC, substrate RC, and package RLC networks.
ANSYS SeaScape infrastructure provides per-core scalability, flexible design data access, instantaneous design bring-up, MapReduce-enabled analytics, and many other revolutionary capabilities. With unparalleled scalability across thousands of cores using big data techniques, ANSYS RedHawk-SC helps you sign off billion+ instance designs within a few hours on commodity hardware. No dedicated machines are needed.
