The use of Ansys Electronics solution suite minimizes the testing costs, ensures regulatory compliance, improves reliability and drastically reduces your product development time. All this while helping you build the best-in-class and cutting-edge products. Leverage the simulation capability from Ansys to solve the most critical aspects of your designs
Electronics Design Simulation
With our solutions, we help you solve the most critical aspects of your product designs through simulation. If you work with antenna, RF, microwave, PCB, package, IC design or even an electromechanical device, we provide you with the industry gold standard simulators. These solutions help you solve any electromagnetic, temperature, SI, PI, parasitic, cabling and vibration challenges in your designs. We build on this with complete product simulation, allowing you to achieve first pass success designing an airplane, car, cellphone, laptop, wireless charger, or any other system.
The Ansys Electronics Desktop (AEDT) is a platform that enables true electronics system design. AEDT provides access to the Ansys gold-standard electromagnetics simulation solutions such as Ansys HFSS, Ansys Maxwell, Ansys Q3D Extractor, Ansys SIwave, and Ansys Icepak using electrical CAD (ECAD) and mechanical CAD (MCAD) workflows. In addition, it also includes direct links to the complete Ansys portfolio of thermal, fluid, and mechanical solvers for comprehensive Multiphysics analysis. Tight integration among these solutions provides the user with unprecedented ease of use for setup and faster resolution of complex simulations for design and optimization. For more information on the AEDT platform, contact us here.
February 2022
The Ansys 2022 R1 update grows the capabilities and functionality of its electronics solver products in both breadth and depth.
A 3D electromagnetic field solver to design high-frequency and high-speed electronic components. Its FEM, IE, asymptotic and hybrid solvers address RF, microwave, IC, PCB and EMI problems.
A computational fluid dynamics (CFD) solver for electronics thermal management. It predicts airflow, temperature and heat transfer in IC packages, PCBs, electronic assemblies, enclosures and power electronics.
Ansys EMA3D Cable is a cable EMC modelling tool that specializes in analyzing lightning-induced electromagnetic (EM) effects on large platforms.
電気機械および電気機械機器のための電磁界シミュレーションソルバーです。静的、周波数ドメイン、時間的に変化する電場を解くことができます。
A template-based design tool for multiphysics analyses of electric motors across the full torque-speed operating range to optimize EV performance, efficiency and size.
効率的でわかりやすいプロセスで、RF、マイクロ波、デジタルフィルターの設計、合成、最適化を自動化します。
Ansys Q3D Extractorは、エレクトロニクス製品の周波数依存の抵抗、インダクタンス、キャパシタンス、コンダクタンス（RLCG）の寄生パラメータを計算することができます。
3D modeling solution of charging, discharging and charge carrier transport across a wide range of applications, in one streamlined workflow.
Reduce your design-cycle and time-to-market by ensuring your electronics design is validated, cost-effective, operable and certification-ready.
These integrated electromagnetics (EM) and circuit simulation tools essential for designing high-speed serial channels, parallel buses and complete power delivery systems found in modern high-speed electronic devices.
Multiple EM solvers intended to address diverse electromagnetic problems ranging from radiated and conducted emissions, susceptibility, crosstalk, RF desense, RF coexistence, cosite, electrostatic discharge, electric fast transients (EFT), burst, lightning strike effects, high intensity fields (HIRF), radiation hazards (RADHAZ), electromagnetic environmental effects (EEE), electromagnetic pulse (EMP) to shielding effectiveness and other EMC applications. Diagnose, isolate and eliminate EMI and radio-frequency issues (RFI) early in the design cycle.
By leveraging advanced electromagnetic-field simulators dynamically linked to powerful harmonic-balance and transient circuit simulation, engineering teams consistently achieve best-in-class design in a broad range of applications including antennas, phased arrays, passive RF/mW components, integrated multi-chip modules, advanced packaging, and RF PCBs.
Perform electronics cooling simulation and thermal analysis for chip-package, PCB and systems, as well as conduct thermomechanical stress analysis and airflow analysis to select the ideal heat sink or fan solution
Ansys software simulates the interactions between these components, and the design flow incorporates thermal and mechanical analysis for evaluating cooling strategies and analyzing critical mechanical effects like noise-vibration-harshness (NVH).
Manage material information, optimize CAD geometries, perform complex multiphysics analysis, predict time-to-failure, and implement automation across the lifetime of your design.
"After a 2 year extensive evaluation and measurement correlation of the ANSYS products against multiple industry products, the measurement comparisons from DC to 50 GHz of multiple package and PCB custom test structures have shown that the ANSYS solutions are robust and accurate across the widest range of applications and structures."
Learn about two new RF/microwave filter design and analysis solutions that will help engineers increase the efficiency of filter design.
2021 R2 introduces significant improvements to electronics thermal management analyses. From native Joule heating to significant improvements in MCAD geometry handling, mesh and solution processing lead to productivity gains for Icepak.
Learn how the new features in Ansys EMA3D Cable can help you tackle electromagnetic interference (EMI) challenges including radiated emissions, radiated immunity, electrostatic discharge (ESD) and interference between systems integrated on a platform.
