Ansys cloud-native solutions provide unparalleled capacity to speed up completion times for even the largest finFET integrated circuits (IC) and 3D/2.5D multi-die systems. These powerful multiphysics analysis and verification tools reduce power consumption, improve performance and reliability, and lower project risk with foundry-certified golden signoff verification.
Cloud-native elastic compute architecture for full-chip capacity
This video briefly overviews the challenges and solutions addressed by Ansys Semiconductor software products for the Electronic Design Automation (EDA) market. Semiconductor design is going through an inflection point as designers face two significant challenges rooted in manufacturing advances: The first is the ongoing march of Moore’s Law into advanced finFET process technology below 5nm. We see newtransistor architectures like nanosheet gate-all-around (GAA) and back-side power delivery.The second set of challenges facing semiconductor designers relates to multi-die design, 2.5D/3D-IC packaging, and heterogeneous integration. Leading design teams have adopted these advances as they face various novel multiphysics challenges to succeed with 3D-IC. New multiphysics challenges include
"Analyzing the dynamic voltage drop in highly complex chips has always been a challenge. Using sigmaDVD simulation technique by Ansys, it is possible to generate tens of thousands of unique switching scenarios and a higher coverage of IR-drop hotspots."
"Using Ansys RedHawk-SC and OptisLang, we could speed up the Power Distribution Network (PDN) exploration process by a factor of 10, taking it from weeks to hours."
"Using sigmaDVD technique by Ansys, NXP achieved a significant reduction by 4X in the overall time required for voltage drop analysis across the Power Distribution Network (PDN) ."
"Illuvatar maximized the power efficiency of GPGPU by 10X (10 times) by optimizing the RTL power, using Ansys PowerArtist."
"Ansys RedHawk-SC Security enabled us to verify the full-chip resiliency against Laser Fault Injection (LFI) and allowed us to make precise layout-level design fixes for critical cells that failed the LFI threshold."
The semiconductor product line delivers significant advances in performance and capacity for advanced node chips, introducing new features for multi-die design's thermal and Multiphysics analysis.
Ansys Semiconductor products provide a comprehensive suite of multiphysics EM/IR, thermal and electromagnetic simulation engines designed to support third-party IC implementation flows for digital and transistor-level design.
The core products are built on the ultra-high capacity, cloud-native SeaScape™ platform, which uses an elastic-compute big-data machine learning architecture to deliver near-linear scalability over thousands of CPU cores.
Ansys RedHawk-SC (digital) and Ansys Totem (analog) are the world’s leading solutions for SoC power integrity analysis. You can model supply voltage variations with foundry-verified signoff accuracy and reduce the overall power noise impact through the package and board. Current density and electromigration analysis are thermal-aware for both power supply metal and signal interconnect on chip or package layers.
Ansys RedHawk-SC’s diagnostics capabilities identify the sources of dynamic power supply noise through vectored and vectorless activity that give comprehensive coverage and eliminate voltage escapes and potential frequency loss. Ansys Path FX provides a variation-aware static timing analysis of critical paths to SPICE accuracy across all voltages with just a single timing library file.
Ansys RedHawk-SC Electrothermal provides multiphysics analysis for stacked multi-die packages for power integrity, thermal analysis, and mechanical stress/warpage – all the way from early prototyping to final signoff. This high-capacity multiphysics analysis is in full context of the entire 2.5D/3D system for maximum accuracy and to ensure system reliability. The co-simulation analysis integrates to system-level tools including Ansys Icepak and Ansys SIwave.
Identify power hotspots and debug their root cause interactively with a powerful graphical interface and custom queries. Reduce clock, memory, and logic power with high-impact block- and instance-level RTL techniques based on production-proven physically-aware power analysis. Profile power of real workloads rapidly and qualify coverage.
Ansys RaptorH has the capacity capacity to model power grids, full custom blocks, spiral inductors, and clock trees. Its high-speed distributed processing delivers accurate, silicon-proven S-parameter and RLCk models. RaptorH makes it easy to use either the general purpose HFSS engine or the silicon-optimized RaptorX engine.
Ansys PathFinder simulates human body model (HBM) and charge device model (CDM) events for static and transient silicon-correlated accuracy. It ensures ESD integrity and reduces debugging turnaround time.
Ansys Totem is a comprehensive co-simulation framework for analog, mixed-signal and custom circuit designs and provides a comprehensive full-chip solution for modeling and simulating noise injection, propagation and coupling through the on-die power grid RLC, substrate RC, and package RLC networks.
Ansys SeaScape infrastructure provides per-core scalability, flexible design data access, instantaneous design bring-up, MapReduce-enabled analytics, and many other revolutionary capabilities. With unparalleled scalability across thousands of cores using big data techniques, Ansys RedHawk-SC helps you sign off billion+ instance designs within a few hours on commodity hardware. No dedicated machines are needed.
