Product Specs
HFSS’s unmatched capacity, coupled with indisputable accuracy, enables engineers to address RF, microwave, IC, PCB and EMI problems for most complex systems.
*only available with Electronics Enterprise
Multipurpose, full wave 3D electromagnetic (EM) simulation software for designing and simulating high-frequency electronic products such as antennas, components, interconnects, connectors, ICs and PCBs.
Ansys HFSS is a 3D electromagnetic (EM) simulation software for designing and simulating high-frequency electronic products such as antennas, antenna arrays, RF or microwave components, high-speed interconnects, filters, connectors, IC packages and printed circuit boards. Engineers worldwide use Ansys HFSS software to design high-frequency, high-speed electronics found in communications systems, advanced driver assistance systems (ADAS), satellites, and internet-of-things (IoT) products.
HFSS’s unmatched capacity, coupled with indisputable accuracy, enables engineers to address RF, microwave, IC, PCB and EMI problems for most complex systems.
*only available with Electronics Enterprise
How Ansys HFSS Mesh Fusion solves much larger designs than ever thought possible
HFSS Mesh Fusion’s patented technology enables much more complex designs to be simulated with the same rigor, accuracy and reliability of Ansys HFSS. It accomplishes this by applying targeted meshing technologies within the same design, appropriate to the local geometry.
HFSS Mesh Fusion continues to use the same “electromagnetically aware” adaptive meshing technology as before without compromising accuracy because a fully coupled electromagnetic matrix is solved with each adaptive mesh step and for each point in a frequency sweep.
July 2021
In Ansys 2021 R2, Ansys HFSS continues to deliver groundbreaking technologies to address 3D IC package design challenges as well as advancements in 5G and autonomous simulation. To learn more, view our on-demand webinar: Ansys 2021 R2: Ansys HFSS Update.
Phi Plus meshing technology brings unrivaled speed and robustness to solving 3D IC package challenges, especially geometries like wire bond type packages, and is HPC enabled. Additionally, Phi Plus utilizes the Mesh Fusion algorithm at the component level, with parallel processing for faster solutions.
HFSS SBR+, as an asymptotic electromagnetic solver, enables efficient simulation of non-uniform, thick 3D dielectric structures such as antenna radomes, electromagnetic lenses, and plastic automotive bumper fascia. This new feature expands the range of designs that can be modeled with the shooting and bouncing ray technique of HFSS SBR+.
This feature provides increased speed for far field antenna post processing. It is seful for multi-port antenna simulations such as radar and 5G mmWave array antenna design. In a 5G application, this allows you to quickly extract the simulation’s far field data from a large array antenna analysis and perform massive MIMO calculations.
The Ansys HFSS simulation suite consists of a comprehensive set of solvers to address diverse electromagnetic problems ranging in detail and scale from passive IC components to extremely large-scale EM analyses such as automotive radar scenes for ADAS systems. Its reliable automatic adaptive mesh refinement lets you focus on the design instead of spending time determining and creating the best mesh.
This automation and guaranteed accuracy differentiates HFSS from all other EM simulators, which require manual user control and multiple solutions to ensure that the generated mesh is suitable and accurate.
HFSS is the premier EM tool for R&D and virtual design prototyping. It reduces design cycle time and boosts your product’s reliability and performance.
Users can take advantage of the seamless workflow in Electronics Desktop, which includes advanced electromagnetic field solvers, and dynamically link them to power circuit simulators to predict EMI/EMC performance of electrical devices. These integrated workflows avoid repetitive design iterations and costly recurrent EMC certification tests. Multiple EM solvers intended to address diverse electromagnetic problems, as well as the circuit simulators in Electronics Desktop, help engineers assess the overall performance of their electrical devices and create interference-free designs. These diverse problems range from radiated and conducted emissions, susceptibility, crosstalk, RF desense, RF coexistence, cosite, electrostatic discharge, electric fast transients (EFT), burst, lightning strike effects, high intensity fields (HIRF), radiation hazards (RADHAZ), electromagnetic environmental effects (EEE), electromagnetic pulse (EMP) to shielding effectiveness and other EMC applications.
EMIT’s powerful analysis engine computes all important RF interactions including non-linear system component effects. Diagnosing RFI in complex environments is notoriously difficult and expensive to perform in a testing environment, but with EMIT’s dynamic linked results views, the identification of the root-cause of any interference is rapidly accomplished via graphical signal trace-back and diagnostic summaries that show the exact origin and path that interfering signals take to each receiver. Once the cause of interference is uncovered, EMIT enables rapid evaluation of various RFI mitigation measures in order to arrive at the optimum solution. The new HFSS/EMIT Datalink allows the model for RFI analysis to be created in EMIT directly from the physical 3-D model of the installed antennas in HFSS. This provides a seamless end-to- end workflow for a complete RFI solution for RF environments ranging from large platform cosite interference to receiver desense in electronic devices.
A candidate array design can examine input impedances of all elements under any beam scan condition. Phased array antennas can be optimized for performance at the element, subarray or complete array level based on element match (passive or driven) far-field and near-field pattern behavior over any scan condition of interest. Infinite array modeling involves one or more antenna elements placed within a unit cell. The cell contains periodic boundary conditions on the surrounding walls to mirror fields, creating an infinite number of elements. Element scan impedance and embedded element radiation patterns can be computed, including all mutual coupling effects. The method is especially useful for predicting array-blind scan angles that can occur under certain array beam steering conditions. Finite array simulation technology leverages domain decomposition with the unit cell to obtain a fast solution for large finite-sized arrays. This technology makes it possible to perform complete array analysis to predict all mutual coupling, scan impedance, element patterns, array patterns and array edge effects.
It includes EMIT, a unique multi-fidelity approach for predicting RF system performance in complex RF environments with multiple sources of interference. EMIT also provides the diagnostic tools needed to quickly identify root-cause RFI issues and mitigate problems early in the design cycle.
HFSS with SI Circuits can handle the complexity of modern interconnect design from die-to-die across ICs, packages, connectors and PCBs. By leveraging the HFSS advanced electromagnetic field simulation capability dynamically linked to powerful circuit and system simulation, engineers can understand the performance of high-speed electronic products long before building a prototype in hardware.
HFSS RESOURCES & EVENTS
This webinar spotlights Ansys HFSS groundbreaking technologies, which address PCB and 3D-IC package design challenges as well as advancements in antenna design.
This webinar series shows you how the HFSS adaptive meshing technology handles massive PCB layout geometries and gives you the most accurate results using real customer examples.
This webinar will chart the progress of HFSS with respect to antenna design and how it has evolved into the established leader in the field.