Ansys Electronics

Electromagnetic, Signal Integrity, Thermal and Electro-Mechanical Simulation Solutions

Electronics Business Value

The use of Ansys Electronics solution suite minimizes the testing costs, ensures regulatory compliance, improves reliability and drastically reduces your product development time. All this while helping you build the best-in-class and cutting-edge products. Leverage the simulation capability from Ansys to solve the most critical aspects of your designs

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Ansys Electronics Electronics Design Simulation

With our solutions, we help you solve the most critical aspects of your product designs through simulation. If you work with antenna, RF, microwave, PCB, package, IC design or even an electromechanical device, we provide you with the industry gold standard simulators. These solutions help you solve any electromagnetic, temperature, SI, PI, parasitic, cabling and vibration challenges in your designs. We build on this with complete product simulation, allowing you to achieve first pass success designing an airplane, car, cellphone, laptop, wireless charger, or any other system.

JANUARY 2021

What's New

Ansys 2021 R1 delivers groundbreaking enhancements in the electronics suite:

  • Ansys HFSS Mesh Fusion enables simulation of large, never before possible electromagnetic systems with efficiency and scalability.
  • Encrypted 3D components supported in HFSS 3D Layout for PCBs, IC packages and IC designs enable suppliers to share detailed 3D component designs for creating highly accurate simulations.
  • Ansys Maxwell leverages cyclic repeatability by slice-only solving within cyclically repeated non-planar radial boundary conditions, including auto-extraction of full-model outputs.
  • Ability to output transient electromagnetic forces from Maxwell into Ansys Motion. This extends EM interaction to rigid body dynamics and enhances the overall noise-vibration solution.
  • Ansys EMA3D Cable generates S-parameter models of cables with all electromagnetic effects. Bringing in cable harness definition enables mesh and real-world simulations within a full vehicle structure. 
  • Ansys Mechanical Thermal solver is now available inside AEDT for a streamlined workflow, linking EM designs from HFSS, Maxwell and Ansys Q3D for quick thermal insight.
  • Ansys SIwave’s new wizard provides an automated workflow to improve setup time required for PCB designs with DDR. 

Webinars

Electronic Products

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Capabilities

Reduce your design-cycle and time-to-market by ensuring your electronics design is validated, cost-effective, operable and certification-ready.

  • Power integrity and signal integrity analysis
  • Electromagnetic interference and compatibility
  • Wireless and RF
  • Thermal management
  • Electric machine analysis
  • Electronics reliability simulation

These integrated electromagnetics (EM) and circuit simulation tools essential for designing high-speed serial channels, parallel buses and complete power delivery systems found in modern high-speed electronic devices.

Multiple EM solvers intended to address diverse electromagnetic problems ranging from radiated and conducted emissions, susceptibility, crosstalk, RF desense, RF coexistence, cosite, electrostatic discharge, electric fast transients (EFT), burst, lightning strike effects, high intensity fields (HIRF), radiation hazards (RADHAZ), electromagnetic environmental effects (EEE), electromagnetic pulse (EMP) to shielding effectiveness and other EMC applications. Diagnose, isolate and eliminate EMI and radio-frequency issues (RFI) early in the design cycle. 

By leveraging advanced electromagnetic-field simulators dynamically linked to powerful harmonic-balance and transient circuit simulation,  engineering teams consistently achieve best-in-class design in a broad range of applications including antennas, phased arrays, passive RF/mW components, integrated multi-chip modules, advanced packaging, and RF PCBs.

Ansys software simulates the interactions between these components, and the design flow incorporates thermal and mechanical analysis for evaluating cooling strategies and analyzing critical mechanical effects like noise-vibration-harshness (NVH).

 

Applications

View All Ansys Applications

electronics hfss

PCBs, ICs and IC Packages

Ansys’ complete PCB design solution enables you to simulates PCBs, ICs, and packages and accurately evaluate an entire system.

Electric car lithium battery pack and power connections

Antenna Design and Placement

Electromagnetic simulation of antenna design and its interaction with the entire system enables you to evaluate antenna placement, EMI/co-site interference and more.

electronics-hfss-airplane-antenna
电磁干扰/兼容性 (EMI/EMC)

电磁干扰/兼容性 (EMI/EMC)

借助仿真最大程度减少电磁干扰,从而实现高性能、兼容性强且安全的电子系统(可达微芯片级)。

电动机

电动机

Ansys 电动机设计软件涵盖从概念设计到电动机的详细电磁、热力和机械分析。

Electric car lithium battery pack and power connections

电力电子技术

为电子系统供能十分复杂。您可利用仿真工具,高效解决高难度设计挑战,提升性能并推动创新。

自动驾驶传感器设计

自动驾驶传感器开发

Ansys 可提供全面的自动驾驶车辆传感器仿真能力,包括激光雷达、雷达和摄像头的设计与开发。

Resources & Events

Case Studies

Ansys case study

On the Radar

Autoliv engineers have used Ansys HFSS to integrate many radar systems into new vehicles without a single issue that required an additional design iteration.

ansys case study

Making Waves

At Chemring Technology Solutions, ANSYS HFSS plays a key role in most projects involving wireless communications, radar and high-frequency networking in which electromagnetic fields are critical.

ansys case study

Cutting the Cords

Peraso engineers used ANSYS simulation software to solve thermal problems associated with packing high-power transmitters into a tiny enclosure.

ansys case study

Ansys + Andar Technologies

Virtual prototypes from ANSYS HFSS allow Andar to create innovative designs and reduce the amount of physical prototyping to a minimum. 

Ansys antenna simulation solutions
White Paper

Antenna Simulation for Commercial Unmanned Aerial Vehicles and Wireless Networks in a Warehouse Environment

This white paper explores diverse communications and engineering problems involving commercial UAVs for delivering consumer merchandise, and describes solutions from Ansys to these manifold problems.


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