The use of Ansys Electronics solution suite minimizes the testing costs, ensures regulatory compliance, improves reliability and drastically reduces your product development time. All this while helping you build the best-in-class and cutting-edge products. Leverage the simulation capability from Ansys to solve the most critical aspects of your designs
Electronics Design Simulation
With our solutions, we help you solve the most critical aspects of your product designs through simulation. If you work with antenna, RF, microwave, PCB, package, IC design or even an electromechanical device, we provide you with the industry gold standard simulators. These solutions help you solve any electromagnetic, temperature, SI, PI, parasitic, cabling and vibration challenges in your designs. We build on this with complete product simulation, allowing you to achieve first pass success designing an airplane, car, cellphone, laptop, wireless charger, or any other system.
The Ansys Electronics Desktop (AEDT) is a platform that enables true electronics system design. AEDT provides access to the Ansys gold-standard electromagnetics simulation solutions such as Ansys HFSS, Ansys Maxwell, Ansys Q3D Extractor, Ansys SIwave, and Ansys Icepak using electrical CAD (ECAD) and mechanical CAD (MCAD) workflows. In addition, it also includes direct links to the complete Ansys portfolio of thermal, fluid, and mechanical solvers for comprehensive Multiphysics analysis. Tight integration among these solutions provides the user with unprecedented ease of use for setup and faster resolution of complex simulations for design and optimization. For more information on the AEDT platform, contact us here.
January 2023
In the 2023 R1 release, Ansys Electronics demonstrates technology leadership in computational electromagnetics. Improvements in simulation performance, meshing, integrations with other Ansys tools, automated workflows, and modeling capabilities extend our leadership in electromagnetic simulation and computational multiphysics for designing high-speed PCBs, electric machines, antennae, radar, and other electronic systems.
Un solveur de champ électromagnétique 3D pour concevoir des composants électroniques haute fréquence et haute vitesse. Ses solveurs FEM, IE, asymptotiques et hybrides traitent les problèmes de RF, micro-ondes, IC, PCB et EMI.
A computational fluid dynamics (CFD) solver for electronics thermal management. It predicts airflow, temperature and heat transfer in IC packages, PCBs, electronic assemblies, enclosures and power electronics.
Ansys EMA3D Cable is a cable EMC modelling tool that specializes in analyzing lightning-induced electromagnetic (EM) effects on large platforms.
Un solveur de simulation de champ électromagnétique pour les machines électriques et les dispositifs électromécaniques. Résolvez des champs électriques statiques, dans le domaine des fréquences et variant dans le temps.
Un outil de conception basé sur des modèles pour les analyses multiphysiques des moteurs électriques sur toute la plage de fonctionnement couple-vitesse afin d'optimiser les performances, l'efficacité et la taille des véhicules électriques.
Automated RF, microwave and digital filter design, synthesis and optimization in an efficient, straightforward process.
Ansys Q3D Extractor calcule le paramètre parasite de la résistance, de l'inductance, de la capacité et de la conductance (RLCG) dépendant de la fréquence pour les produits électroniques.
3D modeling solution of charging, discharging and charge carrier transport across a wide range of applications, in one streamlined workflow.
Reduce your design-cycle and time-to-market by ensuring your electronics design is validated, cost-effective, operable and certification-ready.
These integrated electromagnetics (EM) and circuit simulation tools essential for designing high-speed serial channels, parallel buses and complete power delivery systems found in modern high-speed electronic devices.
Multiple EM solvers intended to address diverse electromagnetic problems ranging from radiated and conducted emissions, susceptibility, crosstalk, RF desense, RF coexistence, cosite, electrostatic discharge, electric fast transients (EFT), burst, lightning strike effects, high intensity fields (HIRF), radiation hazards (RADHAZ), electromagnetic environmental effects (EEE), electromagnetic pulse (EMP) to shielding effectiveness and other EMC applications. Diagnose, isolate and eliminate EMI and radio-frequency issues (RFI) early in the design cycle.
By leveraging advanced electromagnetic-field simulators dynamically linked to powerful harmonic-balance and transient circuit simulation, engineering teams consistently achieve best-in-class design in a broad range of applications including antennas, phased arrays, passive RF/mW components, integrated multi-chip modules, advanced packaging, and RF PCBs.
Perform electronics cooling simulation and thermal analysis for chip-package, PCB and systems, as well as conduct thermomechanical stress analysis and airflow analysis to select the ideal heat sink or fan solution
Ansys software simulates the interactions between these components, and the design flow incorporates thermal and mechanical analysis for evaluating cooling strategies and analyzing critical mechanical effects like noise-vibration-harshness (NVH).
Manage material information, optimize CAD geometries, perform complex multiphysics analysis, predict time-to-failure, and implement automation across the lifetime of your design.
"After a 2 year extensive evaluation and measurement correlation of the ANSYS products against multiple industry products, the measurement comparisons from DC to 50 GHz of multiple package and PCB custom test structures have shown that the ANSYS solutions are robust and accurate across the widest range of applications and structures."
Learn about two new RF/microwave filter design and analysis solutions that will help engineers increase the efficiency of filter design.
2021 R2 introduces significant improvements to electronics thermal management analyses. From native Joule heating to significant improvements in MCAD geometry handling, mesh and solution processing lead to productivity gains for Icepak.
