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Ansys Electronics
Electromagnetic, Signal Integrity, Thermal and Electro-Mechanical Simulation Solutions

Electronics Business Value

The use of Ansys Electronics solution suite minimizes the testing costs, ensures regulatory compliance, improves reliability and drastically reduces your product development time. All this while helping you build the best-in-class and cutting-edge products. Leverage the simulation capability from Ansys to solve the most critical aspects of your designs

Ansys Electronics

Electronics Design Simulation

With our solutions, we help you solve the most critical aspects of your product designs through simulation. If you work with antenna, RF, microwave, PCB, package, IC design or even an electromechanical device, we provide you with the industry gold standard simulators. These solutions help you solve any electromagnetic, temperature, SI, PI, parasitic, cabling and vibration challenges in your designs. We build on this with complete product simulation, allowing you to achieve first pass success designing an airplane, car, cellphone, laptop, wireless charger, or any other system.

Ansys Electronics Desktop (AEDT) 

The Ansys Electronics Desktop (AEDT) is a platform that enables true electronics system design. AEDT provides access to the Ansys gold-standard electromagnetics simulation solutions such as Ansys HFSS, Ansys Maxwell, Ansys Q3D Extractor, Ansys SIwave, and Ansys Icepak using electrical CAD (ECAD) and mechanical CAD (MCAD) workflows. In addition, it also includes direct links to the complete Ansys portfolio of thermal, fluid, and mechanical solvers for comprehensive Multiphysics analysis. Tight integration among these solutions provides the user with unprecedented ease of use for setup and faster resolution of complex simulations for design and optimization. For more information on the AEDT platform, contact us here.

Ansys Electronics Technology Collage

Electronics Products

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July 2023

What's New

In 2023 R2, Ansys Electronics continues demonstrating computational electromagnetics leadership. Maxwell's new capabilities include ECAD integration and time domain simulation improvements using HPC, which opens new magnetics and power electronics applications for consumer devices. HFSS enhancements introduce 3D Layout tool integrations, HPC adaptive mesh refinement, and further refinements in other Electronics tools.

SiWave Thermal Simulation

Webinars

HFSS 3D

R2 2023 : Nouveautés Ansys HFSS, SIwave et Q3D

Les intégrations de Q3D et Raptor-X à HFSS 3D Layout et les nouveaux flux électrothermiques de Q3D et Siwave figurent parmi les nombreuses améliorations apportées par cette mise à jour.

Ansys Thermal Integrity

R2 2023 : Nouveautés Ansys Thermal Integrity

Les améliorations apportées au solveur Icepak et au maillage, ainsi que la nouvelle modélisation ECAD et le solveur thermique transitoire de Mechanical Thermal font partie des nombreuses nouvelles fonctionnalités intégrées à ces simulateurs grâce à cette version.

Ansys EMC Plus

R2 2023 : Nouveautés Ansys EMC Plus

L'importation PCB automatisée, les options de maillage à grille variable et la modélisation des diagrammes de radiation d'antenne sur des plateformes plus grandes font partie des améliorations notables apportées à EMC Plus.

Ansys Charge Plus

R2 2023 : Nouveautés Ansys Charge Plus

La dernière version introduit des mises à jour du moteur de maillage, la modélisation des flux de plasma et de gaz, et l'intégration de Chemkin-Pro.

Capabilities

Reduce your design-cycle and time-to-market by ensuring your electronics design is validated, cost-effective, operable and certification-ready.

  • Power integrity and signal integrity analysis
  • Electromagnetic interference and compatibility
  • Wireless and RF
  • Thermal management
  • Electric machine analysis
  • Electronics reliability simulation

View Product Packages Brochure

These integrated electromagnetics (EM) and circuit simulation tools essential for designing high-speed serial channels, parallel buses and complete power delivery systems found in modern high-speed electronic devices.

Multiple EM solvers intended to address diverse electromagnetic problems ranging from radiated and conducted emissions, susceptibility, crosstalk, RF desense, RF coexistence, cosite, electrostatic discharge, electric fast transients (EFT), burst, lightning strike effects, high intensity fields (HIRF), radiation hazards (RADHAZ), electromagnetic environmental effects (EEE), electromagnetic pulse (EMP) to shielding effectiveness and other EMC applications. Diagnose, isolate and eliminate EMI and radio-frequency issues (RFI) early in the design cycle. 

By leveraging advanced electromagnetic-field simulators dynamically linked to powerful harmonic-balance and transient circuit simulation,  engineering teams consistently achieve best-in-class design in a broad range of applications including antennas, phased arrays, passive RF/mW components, integrated multi-chip modules, advanced packaging, and RF PCBs.

Perform electronics cooling simulation and thermal analysis for chip-package, PCB and systems, as well as conduct thermomechanical stress analysis and airflow analysis to select the ideal heat sink or fan solution

Ansys software simulates the interactions between these components, and the design flow incorporates thermal and mechanical analysis for evaluating cooling strategies and analyzing critical mechanical effects like noise-vibration-harshness (NVH).

Manage material information, optimize CAD geometries, perform complex multiphysics analysis, predict time-to-failure, and implement automation across the lifetime of your design.

electronics hfss

PCBs, ICs and IC Packages

Ansys’ complete PCB design solution enables you to simulates PCBs, ICs, and packages and accurately evaluate an entire system.

Electric car lithium battery pack and power connections

Antenna Design and Placement

Electromagnetic simulation of antenna design and its interaction with the entire system enables you to evaluate antenna placement, EMI/co-site interference and more.

electronics-hfss-airplane-antenna

Featured Webinars

On Demand Webinar
Ansys Webinar
Base-Station Antenna Placement and Operations for 5G/6G Communications

Learn more about how Ansys tools can aid engineers in assessing base-station antenna placement and operations.

On Demand Webinar
Ansys webinar
An Overview of the Foundations of Ansys HFSS and Ansys Maxwell Solver Technologies

In this webinar, you'll gain a deeper understanding of the mathematical underpinnings of both HFSS and Maxwell.


CASE STUDIES

ansys case study

Making Waves

At Chemring Technology Solutions, ANSYS HFSS plays a key role in most projects involving wireless communications, radar and high-frequency networking in which electromagnetic fields are critical.

ansys case study

Ansys + Andar Technologies

Virtual prototypes from ANSYS HFSS allow Andar to create innovative designs and reduce the amount of physical prototyping to a minimum. 


WHITE PAPERS & ARTICLES

physics based sensor validation

Improving Autonomous Vehicle Radar Performance with Simulation

As the world draws near to the reality of fully autonomous automobiles and transport vehicles, there is a great deal of focus on the development of artificial intelligence (AI), machine learning and rapid automated decision-making.



VIDEOS

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