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Ansys Electronics
Electromagnetic, Signal Integrity, Thermal and Electro-Mechanical Simulation Solutions

Electronics Business Value

The use of Ansys Electronics solution suite minimizes the testing costs, ensures regulatory compliance, improves reliability and drastically reduces your product development time. All this while helping you build the best-in-class and cutting-edge products. Leverage the simulation capability from Ansys to solve the most critical aspects of your designs

Ansys Electronics

Electronics Design Simulation

With our solutions, we help you solve the most critical aspects of your product designs through simulation. If you work with antenna, RF, microwave, PCB, package, IC design or even an electromechanical device, we provide you with the industry gold standard simulators. These solutions help you solve any electromagnetic, temperature, SI, PI, parasitic, cabling and vibration challenges in your designs. We build on this with complete product simulation, allowing you to achieve first pass success designing an airplane, car, cellphone, laptop, wireless charger, or any other system.

JULY 2021

What's New

Ansys 2021 R2 delivers groundbreaking technologies to address challenges in 3D IC, autonomy, 5G and electrification.

  • Ansys introduces the Electronics Desktop Student version.
  • Ansys HFSS Phi Plus meshing dramatically increases speed and capacity for 3D IC packaging simulation, including wire bonds.
  • Ansys HFSS SBR+ enables efficient simulation of 3D dielectrics such as automotive bumper fascia and antenna radomes.
  • Ansys SI Xplorer helps PCB designers to define stack-up and optimize via transitions.
  • With EMA3D Cable’s mesh subgrid, engineers can define regions in the model where the mesh cell size can be different from the rest of the model.
  • Ansys Icepak’s Joule heating analysis solves coupled electrothermal problems with static or transient excitations, while thermal ROM simplifies setup for variable flow rate problems. Icepak solver improvements enable 10 to 100X faster times for MCAD geometry processing and solving.
  • Ansys Maxwell A-Φ solver enhances conductive EMC analysis for busbars, power electronics and PCBs.
  • Ansys Maxwell 2D skew model enables 3D simulation accuracy of electrical machines at the speed of 2D.
  • Multiphysics enhancements broaden applications of NVH in electromechanical devices and improve the thermal dependency response of permanent magnets.
  • Introducing Ansys Nuhertz FilterSolutions — an RF and digital filter design, synthesis and optimization solution with Ansys HFSS integration.

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Webinars

Electronic Products

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Capabilities

Reduce your design-cycle and time-to-market by ensuring your electronics design is validated, cost-effective, operable and certification-ready.

  • Power integrity and signal integrity analysis
  • Electromagnetic interference and compatibility
  • Wireless and RF
  • Thermal management
  • Electric machine analysis
  • Electronics reliability simulation

These integrated electromagnetics (EM) and circuit simulation tools essential for designing high-speed serial channels, parallel buses and complete power delivery systems found in modern high-speed electronic devices.

Multiple EM solvers intended to address diverse electromagnetic problems ranging from radiated and conducted emissions, susceptibility, crosstalk, RF desense, RF coexistence, cosite, electrostatic discharge, electric fast transients (EFT), burst, lightning strike effects, high intensity fields (HIRF), radiation hazards (RADHAZ), electromagnetic environmental effects (EEE), electromagnetic pulse (EMP) to shielding effectiveness and other EMC applications. Diagnose, isolate and eliminate EMI and radio-frequency issues (RFI) early in the design cycle. 

By leveraging advanced electromagnetic-field simulators dynamically linked to powerful harmonic-balance and transient circuit simulation,  engineering teams consistently achieve best-in-class design in a broad range of applications including antennas, phased arrays, passive RF/mW components, integrated multi-chip modules, advanced packaging, and RF PCBs.

Perform electronics cooling simulation and thermal analysis for chip-package, PCB and systems, as well as conduct thermomechanical stress analysis and airflow analysis to select the ideal heat sink or fan solution

Ansys software simulates the interactions between these components, and the design flow incorporates thermal and mechanical analysis for evaluating cooling strategies and analyzing critical mechanical effects like noise-vibration-harshness (NVH).

Manage material information, optimize CAD geometries, perform complex multiphysics analysis, predict time-to-failure, and implement automation across the lifetime of your design.

 

Applications

View All Ansys Applications

electronics hfss

PCBs, ICs and IC Packages

Ansys’ complete PCB design solution enables you to simulates PCBs, ICs, and packages and accurately evaluate an entire system.

Electric car lithium battery pack and power connections

Antenna Design and Placement

Electromagnetic simulation of antenna design and its interaction with the entire system enables you to evaluate antenna placement, EMI/co-site interference and more.

electronics-hfss-airplane-antenna
전자기 간섭/적합성(EMI/EMC)

전자기 간섭/적합성(EMI/EMC)

시뮬레이션을 통해 전자기 간섭을 최소화하면 마이크로 칩 수준까지 고성능, 규정 준수 및 안전한 전자 시스템을 제공합니다.

전기모터

전기모터

Ansys 전기모터 설계 소프트웨어는 전기모터에 대한 개념 설계에서 상세한 전자기, 열 및 기계적 분석까지 진행합니다.

Electric car lithium battery pack and power connections

전력 전자

전력 전자 시스템은 복잡합니다. 시뮬레이션은 고급 시스템 설계 과제를 효율적으로 설계하고, 성능을 최적화하며 혁신을 추구하기 위한 툴을 제공합니다.

자율주행 센서 설계

자율주행 센서 개발

Ansys는 라이더, 레이더 및 카메라 설계와 개발을 포함하는 포괄적인 자율주행 차량 센서 시뮬레이션 기능을 제공합니다.

Featured Webinars

Upcoming Webinar
April 15,2021 11 AM EDT / 4 PM BST / 8:30 PM IST
Ansys cloud webinar

Webinar Boosting AEDT simulation with Ansys Cloud

This webinar showcases how you can switch to the new price/performance optimized submission workflow within Ansys Cloud. 

Upcoming Webinar
May 06,2021 11 AM EDT / 4 PM BST / 8:30 PM IST
Ansys On Demand Webinar

Thermal Performance of Inverter Bus Bars with Complex Harmonic Content

This webinar spotlights Ansys 2021 R1’s new capabilities for coupling accurate loss density calculations to thermal solvers for predicting temperature in bus bars.

Upcoming Webinar
May 13,2021 11 AM EDT / 4 PM BST / 8:30 PM IST
HFSS resource webinar

Practical Ports for Perfect Performance

This webinar spotlights the theoretical basis of various port types and how to use them in real designs to deliver maximum accuracy.


CASE STUDIES

Ansys case study

On the Radar

Autoliv engineers have used Ansys HFSS to integrate many radar systems into new vehicles without a single issue that required an additional design iteration.

ansys case study

Making Waves

At Chemring Technology Solutions, ANSYS HFSS plays a key role in most projects involving wireless communications, radar and high-frequency networking in which electromagnetic fields are critical.

ansys case study

Cutting the Cords

Peraso engineers used ANSYS simulation software to solve thermal problems associated with packing high-power transmitters into a tiny enclosure.

ansys case study

Ansys + Andar Technologies

Virtual prototypes from ANSYS HFSS allow Andar to create innovative designs and reduce the amount of physical prototyping to a minimum. 


WHITE PAPERS & ARTICLES

Ansys antenna simulation solutions

Antenna Simulation for Commercial Unmanned Aerial Vehicles and Wireless Networks in a Warehouse Environment

This white paper explores diverse communications and engineering problems involving commercial UAVs for delivering consumer merchandise, and describes solutions from Ansys to these manifold problems.


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