The use of Ansys Electronics solution suite minimizes the testing costs, ensures regulatory compliance, improves reliability and drastically reduces your product development time. All this while helping you build the best-in-class and cutting-edge products. Leverage the simulation capability from Ansys to solve the most critical aspects of your designs
Electronics Design Simulation
With our solutions, we help you solve the most critical aspects of your product designs through simulation. If you work with antenna, RF, microwave, PCB, package, IC design or even an electromechanical device, we provide you with the industry gold standard simulators. These solutions help you solve any electromagnetic, temperature, SI, PI, parasitic, cabling and vibration challenges in your designs. We build on this with complete product simulation, allowing you to achieve first pass success designing an airplane, car, cellphone, laptop, wireless charger, or any other system.
JULY 2021
Ansys 2021 R2 delivers groundbreaking technologies to address challenges in 3D IC, autonomy, 5G and electrification.
A 3D electromagnetic field solver to design high-frequency and high-speed electronic components. Its FEM, IE, asymptotic and hybrid solvers address RF, microwave, IC, PCB and EMI problems.
A computational fluid dynamics (CFD) solver for electronics thermal management. It predicts airflow, temperature and heat transfer in IC packages, PCBs, electronic assemblies, enclosures and power electronics.
An electromagnetic field simulation solver for electric machines and electromechanical devices. Solve static, frequency-domain and time-varying electric fields.
A template-based design tool for multiphysics analyses of electric motors across the full torque-speed operating range to optimize EV performance, efficiency and size.
Ansys Q3D Extractor calculates the parasitic parameter of frequency-dependent resistance, inductance, capacitance and conductance (RLCG) for electronic products.
Reduce your design-cycle and time-to-market by ensuring your electronics design is validated, cost-effective, operable and certification-ready.
These integrated electromagnetics (EM) and circuit simulation tools essential for designing high-speed serial channels, parallel buses and complete power delivery systems found in modern high-speed electronic devices.
Multiple EM solvers intended to address diverse electromagnetic problems ranging from radiated and conducted emissions, susceptibility, crosstalk, RF desense, RF coexistence, cosite, electrostatic discharge, electric fast transients (EFT), burst, lightning strike effects, high intensity fields (HIRF), radiation hazards (RADHAZ), electromagnetic environmental effects (EEE), electromagnetic pulse (EMP) to shielding effectiveness and other EMC applications. Diagnose, isolate and eliminate EMI and radio-frequency issues (RFI) early in the design cycle.
By leveraging advanced electromagnetic-field simulators dynamically linked to powerful harmonic-balance and transient circuit simulation, engineering teams consistently achieve best-in-class design in a broad range of applications including antennas, phased arrays, passive RF/mW components, integrated multi-chip modules, advanced packaging, and RF PCBs.
Perform electronics cooling simulation and thermal analysis for chip-package, PCB and systems, as well as conduct thermomechanical stress analysis and airflow analysis to select the ideal heat sink or fan solution
Ansys software simulates the interactions between these components, and the design flow incorporates thermal and mechanical analysis for evaluating cooling strategies and analyzing critical mechanical effects like noise-vibration-harshness (NVH).
Manage material information, optimize CAD geometries, perform complex multiphysics analysis, predict time-to-failure, and implement automation across the lifetime of your design.
"After a 2 year extensive evaluation and measurement correlation of the ANSYS products against multiple industry products, the measurement comparisons from DC to 50 GHz of multiple package and PCB custom test structures have shown that the ANSYS solutions are robust and accurate across the widest range of applications and structures."
This webinar showcases how you can switch to the new price/performance optimized submission workflow within Ansys Cloud.
This webinar spotlights Ansys 2021 R1’s new capabilities for coupling accurate loss density calculations to thermal solvers for predicting temperature in bus bars.
This webinar spotlights the theoretical basis of various port types and how to use them in real designs to deliver maximum accuracy.
