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Ansys Electronics
Electromagnetic, Signal Integrity, Thermal and Electro-Mechanical Simulation Solutions

Electronics Business Value

The use of Ansys Electronics solution suite minimizes the testing costs, ensures regulatory compliance, improves reliability and drastically reduces your product development time. All this while helping you build the best-in-class and cutting-edge products. Leverage the simulation capability from Ansys to solve the most critical aspects of your designs

Ansys Electronics

Electronics Design Simulation

With our solutions, we help you solve the most critical aspects of your product designs through simulation. If you work with antenna, RF, microwave, PCB, package, IC design or even an electromechanical device, we provide you with the industry gold standard simulators. These solutions help you solve any electromagnetic, temperature, SI, PI, parasitic, cabling and vibration challenges in your designs. We build on this with complete product simulation, allowing you to achieve first pass success designing an airplane, car, cellphone, laptop, wireless charger, or any other system.

Ansys Electronics Desktop (AEDT) 

The Ansys Electronics Desktop (AEDT) is a platform that enables true electronics system design. AEDT provides access to the Ansys gold-standard electromagnetics simulation solutions such as Ansys HFSS, Ansys Maxwell, Ansys Q3D Extractor, Ansys SIwave, and Ansys Icepak using electrical CAD (ECAD) and mechanical CAD (MCAD) workflows. In addition, it also includes direct links to the complete Ansys portfolio of thermal, fluid, and mechanical solvers for comprehensive Multiphysics analysis. Tight integration among these solutions provides the user with unprecedented ease of use for setup and faster resolution of complex simulations for design and optimization. For more information on the AEDT platform, contact us here.

Ansys Electronics Technology Collage

February 2022

What's New

The Ansys 2022 R1 update grows the capabilities and functionality of its electronics solver products in both breadth and depth.

  • EMA3D Cable – much faster simulation times at deeper granularity, improved model libraries, and cable harness connectivity enhancements
  • EMA3D Charge – dielectric breakdown simulation, refined meshing, and simulation of radiation-induced ionization for space applications
  • HFSS – Phi Plus Meshing for 3DIC packaging simulation, modeling of rough surfaces for ADAS, and fast broadband frequency sweeps
  • Icepak – Links to Ansys Redhawk and Ansys Fluent, along with improved multiphysics flows within Ansys Electronics Desktop
  • Maxwell – poly-phase electric machine ROM, Litz wire, and a faster simulation option for systems requiring FEA
  • Motor-CADoptiSLang interface and NVH assessment
  • SIwave – temperature gradient input from Ansys Icepak and automated functionality when used in HFSS 3D Layout


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Ansys 2022 R1: Was ist neu in Ansys HFSS

Nehmen Sie an diesem Webinar teil, in dem wir alle neuen Innovationen in Ansys HFSS 2022 R1 vorstellen.

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Ansys 2022 R1: Updates für Ansys Maxwell

Die Aktualisierungen von Ansys Maxwell in Ansys 2022 R1 bieten eines der umfangreichsten Sets an neuen und erweiterten Funktionen in der Unternehmensgeschichte von Ansys.

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Ansys 2022 R1: Update für Ansys Icepak

Begleiten Sie uns, wenn wir die neuen Produkt-Updates für Ansys Icepak und Ansys Mechanical in Ansys Electronics Desktop vorstellen.

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Ansys 2022 R1: Was ist neu in Ansys Signal & Power Integrity

Die Erweiterungen von Ansys 2022 R1 für Signal- und Stromversorgungsintegrität verbessern die Automatisierung, die Kapazität, den Workflow und die Multiphysik-Funktionen für alle Anwender*innen. Verpassen Sie nicht dieses Webinar, um mehr über die spannenden neuen Updates zu erfahren.

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Ansys 2022 R1: Was ist neu in Ansys Motor-CAD

Wir stellen die neueste Version von Ansys Motor-CAD für Ansys 2022 R1 vor und geben einen detaillierten Einblick in die neuen Funktionen für die multiphysikalische Auslegung von Elektromotoren.

Electronics Products

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Reduce your design-cycle and time-to-market by ensuring your electronics design is validated, cost-effective, operable and certification-ready.

  • Power integrity and signal integrity analysis
  • Electromagnetic interference and compatibility
  • Wireless and RF
  • Thermal management
  • Electric machine analysis
  • Electronics reliability simulation

These integrated electromagnetics (EM) and circuit simulation tools essential for designing high-speed serial channels, parallel buses and complete power delivery systems found in modern high-speed electronic devices.

Multiple EM solvers intended to address diverse electromagnetic problems ranging from radiated and conducted emissions, susceptibility, crosstalk, RF desense, RF coexistence, cosite, electrostatic discharge, electric fast transients (EFT), burst, lightning strike effects, high intensity fields (HIRF), radiation hazards (RADHAZ), electromagnetic environmental effects (EEE), electromagnetic pulse (EMP) to shielding effectiveness and other EMC applications. Diagnose, isolate and eliminate EMI and radio-frequency issues (RFI) early in the design cycle. 

By leveraging advanced electromagnetic-field simulators dynamically linked to powerful harmonic-balance and transient circuit simulation,  engineering teams consistently achieve best-in-class design in a broad range of applications including antennas, phased arrays, passive RF/mW components, integrated multi-chip modules, advanced packaging, and RF PCBs.

Perform electronics cooling simulation and thermal analysis for chip-package, PCB and systems, as well as conduct thermomechanical stress analysis and airflow analysis to select the ideal heat sink or fan solution

Ansys software simulates the interactions between these components, and the design flow incorporates thermal and mechanical analysis for evaluating cooling strategies and analyzing critical mechanical effects like noise-vibration-harshness (NVH).

Manage material information, optimize CAD geometries, perform complex multiphysics analysis, predict time-to-failure, and implement automation across the lifetime of your design.



View All Ansys Applications

electronics hfss

PCBs, ICs and IC Packages

Ansys’ complete PCB design solution enables you to simulates PCBs, ICs, and packages and accurately evaluate an entire system.

Electric car lithium battery pack and power connections

Antenna Design and Placement

Electromagnetic simulation of antenna design and its interaction with the entire system enables you to evaluate antenna placement, EMI/co-site interference and more.

Elektromagnetische Störung/Kompatibilität (EMI/EMC)

Elektromagnetische Störung/Kompatibilität (EMI/EMC)

Die Minimierung elektromagnetischer Störungen durch Simulation liefert leistungsfähige, konforme und sichere Elektronik-Systeme bis auf Mikrochip-Ebene.

Elektrische Motoren

Elektrische Motoren

Die Ansys-Designsoftware für elektrische Motoren reicht vom Konzeptdesign bis zur detaillierten Elektromagnetik, thermischen und mechanischen Analyse von elektrischen Motoren.

Electric car lithium battery pack and power connections


Leistungselektronik-Systeme sind komplex. Die Simulation bietet die erforderlichen Tools, um hochgradige Designherausforderungen zu meistern, die Leistung zu verbessern und die Innovation voranzutreiben.

Sensor-Design für autonome Fahrzeuge

Sensorentwicklung für autonome Fahrzeuge

Ansys bietet eine umfassende Lösung zur Simulation von Sensoren für autonome Fahrzeuge, die Lidar-, Radar- und Kameradesign und -entwicklung einschließt.

Featured Webinars

On Demand Webinar
Ansys Webinar

Ansys 2021 R2: Introducing New Ansys Solutions for RF/Microwave Filter Design

Learn about two new RF/microwave filter design and analysis solutions that will help engineers increase the efficiency of filter design.

On Demand Webinar
Ansys webinar

Ansys 2021 R2: What’s New in Ansys Icepak

2021 R2 introduces significant improvements to electronics thermal management analyses. From native Joule heating to significant improvements in MCAD geometry handling, mesh and solution processing lead to productivity gains for Icepak.

Webinar on Demand
Ansys Webinar

Ansys 2021 R2: EMA3D Cable Update: Faster EMC Solving for Electronic Devices

Learn how the new features in Ansys EMA3D Cable can help you tackle electromagnetic interference (EMI) challenges including radiated emissions, radiated immunity, electrostatic discharge (ESD) and interference between systems integrated on a platform.


Ansys case study

On the Radar

Autoliv engineers have used Ansys HFSS to integrate many radar systems into new vehicles without a single issue that required an additional design iteration.

ansys case study

Making Waves

At Chemring Technology Solutions, ANSYS HFSS plays a key role in most projects involving wireless communications, radar and high-frequency networking in which electromagnetic fields are critical.

ansys case study

Cutting the Cords

Peraso engineers used ANSYS simulation software to solve thermal problems associated with packing high-power transmitters into a tiny enclosure.

ansys case study

Ansys + Andar Technologies

Virtual prototypes from ANSYS HFSS allow Andar to create innovative designs and reduce the amount of physical prototyping to a minimum. 


Erfahren Sie, wie Ansys Ihnen helfen kann

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