Product Specs
HFSS’s unmatched capacity, coupled with indisputable accuracy, enables engineers to address RF, microwave, IC, PCB and EMI problems for most complex systems.
*only available with Electronics Enterprise
Ansys HFSS
Best-In-Class 3D High Frequency Structure Simulation Software
多用途全波3D电磁（EM）仿真软件，用于设计和仿真高频电子产品，例如天线、组件、互连、连接器、IC和PCB。
3D EM SIMULATION SOFTWARE
3D Electromagnetic Field Simulator for RF and Wireless Design
Ansys HFSS is a 3D electromagnetic (EM) simulation software for designing and simulating high-frequency electronic products such as antennas, antenna arrays, RF or microwave components, high-speed interconnects, filters, connectors, IC packages and printed circuit boards. Engineers worldwide use Ansys HFSS software to design high-frequency, high-speed electronics found in communications systems, advanced driver assistance systems (ADAS), satellites, and internet-of-things (IoT) products.
-
Component-to-System EM Workflow
-
Coupled EM System Solver
-
Encrypted 3D Design Share
-
Automatic Adaptive Meshing
-
Antenna Design Toolkit -
Radar Pre/Post Processing -
Frequency and Time Domain FEM -
Hybrid FEM/IE/SBR+ Solver
-
3D Layout ECAD Flow -
*SBR+ Accelerated Doppler Processing -
Integral Equation (MoM) -
Memory Matrix Solvers
-
5G Post-Processing -
Concurrent Initial 3D Meshing -
SBR+ for Large Scale EMs -
Multipaction Solver
From Chips to Ships, Solve Them All with HFSS
How Ansys HFSS Mesh Fusion solves much larger designs than ever thought possible
HFSS Mesh Fusion’s patented technology enables much more complex designs to be simulated with the same rigor, accuracy and reliability of Ansys HFSS. It accomplishes this by applying targeted meshing technologies within the same design, appropriate to the local geometry.
HFSS Mesh Fusion continues to use the same “electromagnetically aware” adaptive meshing technology as before without compromising accuracy because a fully coupled electromagnetic matrix is solved with each adaptive mesh step and for each point in a frequency sweep.
July 2023
What's New
Improvements to meshing and solvers and new integrations reinforce and extend HFSS scalability from micro to macro, further solidifying its EM simulation performance and gold-standard accuracy.
Layout Component Placement Enhancement
Permits HFSS 3D Layout to combine the electromagnetic capture of a complete chip design with Q3D RLCG parasitics at package and board for a full chip-to-system EM simulation.
3D Component Array with Platform Geometries
Improved antenna simulation in larger structures, further reinforcing the HFSS ability to execute EM simulations over scale with gold-standard accuracy.
HPC Scalable Distributed Adaptive Refinement (beta)
A ‘divide and conquer’ technique that permits objects with variable geometries to be deliberately partitioned, meshed, and re-integrated through Mesh Fusion, resulting in faster simulations.
HFSS Case Studies
HFSS Application Briefs
FAQs
Ansys HFSS is a 3D electromagnetic simulation software solution for designing and simulating high-frequency electronic products such as antennas, RF and microwave components, high-speed interconnects, filters, connectors, IC components and packages and printed circuit boards.
To install Ansys HFSS, you must be an Ansys customer and have access to the Customer Portal. Ansys HFSS is included in the Electronics software bundle and is also included in the free Ansys Student bundle.
Yes, STL is an import option in HFSS. For finite element model (FEM) analysis, STL files are converted to the HFSS modeler format. For IE and SBR+ analysis, there is an option to import and directly solve to the STL facets.
To download Ansys HFSS, you must be an Ansys customer and have access to the Customer Portal. Ansys HFSS is included in the Electronics software bundle and is also included in the free Ansys Student bundle.
You can learn about Ansys HFSS in several different ways depending on whether you are an existing customer or a student or non-customer.
Intro to Ansys HFSS is a free course available on our Ansys Innovation Courses site where you will learn the basics of Ansys HFSS geometry design and the EM simulation workflow.
These HFSS courses are available to Ansys Customers.
Get step-by-step instructions on designing antennas in Ansys HFSS in this video, which demonstrates how to create the geometry of the dipole antenna and discusses features in HFSS for antenna analysis. "How to Design Antennas in Ansys HFSS."
物理场定义网格；网格并不能定义物理场
Ansys HFSS仿真套件包含一系列综合全面的求解器，可解决从无源IC组件到超大规模电磁分析（如ADAS系统的汽车雷达场景）的各种详细的电磁问题。其可靠的自动自适应网格细化让您可以专注于设计，而不是花时间确定和创建最佳网格。
这种自动化和保证的准确性使HFSS与所有其它电磁仿真器不同，后者需要手动用户控制和多种解决方案才能确保生成合适、准确的网格。
主要特征
HFSS是用于研发和虚拟设计原型构建的高级电磁工具。它可以缩短设计周期并提高产品的可靠性和性能。
- EMI/EMC分析
- 复杂环境中的射频干扰（RFI）
- 已安装天线和射频共址分析
- 射频系统和电路分析
- 信号和电源完整性分析
用户可以利用Electronics Desktop中的无缝工作流程（其中包括高级电磁场求解器），并将它们动态链接到电源电路仿真器，以预测电气设备的EMI/EMC性能。这些集成式工作流程可避免重复的设计迭代和昂贵的周期性EMC认证测试。旨在解决各种电磁问题的多个EM求解器以及Electronics Desktop中的电路仿真器，可帮助工程师评估其电气设备的整体性能并创建无干扰设计。这些不同的问题包括辐射和传导、敏感度、串扰、RF灵敏度劣化、RF共存、共址、静电放电、电快速瞬变（EFT）、突发、雷击效应、高强度场（HIRF）、辐射危害（RADHAZ）、电磁环境效应（EEE）、电磁脉冲（EMP）到屏蔽效能和其它EMC应用。
EMIT强大的分析引擎可以计算所有重要的RF相互作用，包括非线性系统组件影响。众所周知，在测试环境中诊断复杂环境内的RFI非常困难而且成本高昂，但是，利用EMIT的动态链接结果视图，就可以通过图形化信号跟踪和诊断总结功能显示干扰信号的源头以及其到达接收器的路径，从而快速确定任何干扰的根源。一旦找到干扰原因，EMIT就能快速评估各种RFI缓解措施，从而实现最优解决方案。新的HFSS/EMIT数据链路允许在EMIT中直接通过HFSS已安装天线的物理3D模型创建RFI分析模型，从而为完整RFI解决方案实现无缝的端对端工作流程，以满足大平台共址干扰、电子设备接收器灵敏度劣化等射频环境的要求。
备选阵列设计可以在任何光束扫描条件下检查所有元件的输入阻抗。相控阵天线可以根据任何目标扫描条件下的元件匹配（无源或驱动）远场和近场模式行为，针对元件、子阵列或完整阵列级别的性能进行优化。无限阵列建模涉及放置在单元内的一个或多个天线元件。该单元包含周围壁面上的周期性边界条件以产生镜像场，从而创建无限数量的单元。它可以计算元件扫描阻抗和嵌入式元件辐射方向图，包括所有互耦效应。该方法对于预测在某些阵列波束控制条件下可能出现的阵列盲扫描角度特别有用。有限阵列仿真技术利用单元的域分解来获得有限大阵列的快速解决方案。该技术可以执行完整的阵列分析，以预测所有互耦、扫描阻抗、单元方向图、阵列方向图和阵列边缘效应。
它包括EMIT，这是一种独特的多保真度方法，可用于预测具有多个干扰源的复杂射频环境中的射频系统性能。此外，EMIT还可提供所需的诊断工具，用于快速识别根源RFI问题，并在设计周期中尽早解决问题。
带有SI电路的HFSS可以处理现代互连设计的复杂性，包括 IC、封装、连接器和PCB的裸片到裸片设计。通过利用与强大的电路和系统仿真动态链接的HFSS高级电磁场仿真功能，工程师可以早在构建硬件原型之前就了解高速电子产品的性能。
能够仿真加密的HFSS 3D组件，意味着无需在精度上妥协。设计师再也不用在设计中被迫使用电路级组件（例如S参数模型）替代真实的3D模型，让总体仿真精度受影响。
这可以让厂商的潜在客户在完整系统设计中使用加密的3D组件，既让终端客户能够充分考虑集成后的耦合效应，提高了结果有效性置信度，又能保护厂商的设计IP。此外，HFSS和自适应网格划分实现了黄金标准精度，为加密的3D组件提供完整、未受损的高仿真精度。
HFSS Multipaction求解器基于有限元单元内粒子（PIC）方法。HFSS提供的Multipaction分析可作为频域场解的后处理。只需几个步骤即可设置带电粒子仿真的激励和边界条件，您可以检查您的设计是否符合防止multipaction击穿的标准。
HFSS资源和活动
特色网络研讨会
Webinar on Demand
Webinar Series
On Demand Webinar
点播网络研讨会
博客
-
New HFSS SBR+ Technology in Ansys 2021 R2 a Big Step Forward for Automotive Radar Integration -
How to Design 5G and mm-Wave Filters Using AI-Optimized Tuning -
Design, Test, and Deployment of 5G Networks With Cost and Performance Targets -
Simulating Just the Antenna is Not Enough: Analyze the Complete Antenna System with the Environment -
Solving Chip Designs at the System Level via HFSS 3D Layout -
Wired for Success: Ansys HFSS Leads in Wirebond Simulation
可便捷访问的Ansys软件
所有用户（包括残障人士）都可以访问我们的产品，这对Ansys至关重要。因此，我们努力遵循基于美国访问委员会（Section 508）、网页内容无障碍指南（WCAG）和自愿产品可访问性模板（VPAT）的当前格式的可访问性要求。
了解Ansys提供的产品与服务
了解Ansys提供的产品与服务
Contact Us
立即联系我们
