Designing for good signal integrity is a multi-step process that often requires importing and exporting data from one tool to another. HFSS-IC offers access to multiple industry-leading EM extraction tools in one design interface and a circuit solver to complete the simulation-based workflow.  

Next‑generation chip‑package systems face increasingly complex power‑delivery demands — tighter integration, higher current density, advanced 3D packaging (InFO, CoWoS, WoW), and ultra‑dense PDNs that strain the limits of traditional 2.5D and reduced‑order tools. These architectures require accurate broadband modelling across dies, packages, RDLs, and boards to reliably predict IR drop, impedance, resonances, and coupling paths.

HFSS‑PI delivers the industry’s first high‑capacity, broadband 3D Power Integrity solver purpose‑built for these challenges. Powered by the NexGen HFSS Prism mesh‑and‑solve technology, it enables end‑to‑end PDN modelling with true 3D EM accuracy — from DC through high frequencies — while scaling to massive multilayer designs. This allows engineers to confidently analyze coupling mechanisms, return‑path behaviour, and power‑delivery bottlenecks earlier and with far greater fidelity than legacy tools.

The Ansys Electronics Desktop Platform now has a design mode tailored for IC design work. In this mode, designers can access all the HFSS-IC solver technologies (HFSS, RaptorX, and Q3D) to perform fast and accurate electromagnetic extraction of die and interposer designs from DC to high frequency for signal and power integrity analysis.

Leverage IC mode in Electronics Desktop for automated translation and simplification of the design, fast and accurate extraction, and advanced post-processing capabilities that help you design first-time-right interposers for 2.5 and 3D IC design. 

3DIC design brings a new simulation challenge: how can the entire chip be modeled to the package system and ensure no undesirable electromagnetic coupling occurs between various components in the assembly? HFSS has advanced usability and automation features that streamline the assembly of multiscale, heterogeneous designs. Once assembled, engineers will use HFSS Mesh Fusion and HPC to obtain timely gold standard accurate model extractions for signal and power integrity analysis. Create a dynamic link between HFSS and the circuit to push transient excitations and visualize 3D fields in the full system to obtain next-level design insights and confidently innovate.