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Electronics Reliability

Solve your biggest thermal, electrical and mechanical reliability challenges.


Optimize and Predict Electronics Reliability

Best practices for ensuring and predicting electronics reliability require comprehensive multi-physics simulations. Ansys ensures reliability success by developing solutions and workflows that overcome today’s biggest simulation and design challenges.

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    Extract Detailed Geometries from any ECAD file
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    Perform Complex Multiphysics Analyses
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    Predict Time to Failure Before Prototyping
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    Implement Automation and Optimization

Electronics Reliability Just Got Easier

Design Democratization

Ansys Electronics Reliability solutions allow organizations to capture a wide-range of parts, materials, simulation and other data, as well as access to critical, simulation-ready material and component data.

Robust Reliability Predictions

Reliability predictions based on physics of failure (PoF) principles resides at the core of the Ansys Electronics Reliability portfolio. Using Ansys simulation tools, electronics manufacturers can determine how long it takes for a product to fail and why the failure occurred.

Workflow Automation

Ansys Electronics Reliability tools allow engineers to create comprehensive simulation workflows that include high-levels of automation.

Electrical, Thermal and Mechanical Analysis

Integrated workflows between Ansys Sherlock, Icepak, Mechanical, LS-DYNA, and more provide the simulation results necessary to optimize product designs and ensure reliability in the field.

Featured Products

Determine the electronics reliability workflow that works for you and your team

Simulation isn’t a one size fits all. That’s why Ansys provides multiple electronics reliability workflows to fit your product and your reliability needs.


Solve Thermal, Mechanical and Electrical PCB Challenges

Analyze the electrical, thermal and mechanical characteristics of a PCB— all using Ansys tools.


Determine the Components Most at Risk During Temperature Cycling

Identify the most temperature-sensitive components in power supply design and learn how to make physics-based decisions on how hot is too hot.


Improve Automotive Electronics Reliability

The best way to ensure automotive electronics reliability is by taking the physics of failure (PoF) approach, which uses science (physics, chemistry, etc.) to capture an understanding of failure mechanisms and evaluate useful life under actual operating conditions.

Printed Circuit Board (PCB) Solutions

Ansys solutions for PCB reliability include a multi-physics workflow that uses a suite of leading simulation tools.  Using our workflow solutions, you can simulate electrical, thermal, and mechanical effects to determine product reliability.

  • Ansys HFSS and SIwave to determine Power and Signal Integrity
  • Ansys Icepak to assess Thermal Integrity
  • Ansys Mechanical for Structural Analysis
  • Ansys LS-DYNA for Drop-Test and Impact Studies
  • Ansys Sherlock for Reliability (Life) Predictions of Electronics Systems

Featured Events


Featured Resources




Continental Automotive Tests its Product Reliability in a Fraction of Time Before Building Prototype

Continental Automotive chose Ansys Sherlock for its ability to quantify the changes in reliability of a component due to various system-level effects, including the thermomechanical influence of these adhesives


White Paper

Reliability Physics Analysis for Implementing SAE J3168 Standard

This white paper describes the approach and content of SAE J3168 and the challenges in implementing it in AADHP applications. It further describes the use of Ansys Sherlock software to implement SAE J3168.

See What Ansys Can Do For You

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