Industry-proven and foundry-certified analog and mixed-signal EM/IR solution

ANSYS Totem is a transistor-level power noise and reliability analysis platform that enables you to perform comprehensive power integrity analysis on analog mixed-signal IP and full custom designs.

Totem enables creation of IP models for SOC-level power integrity signoff using RedHawk and generates compact chip models of power delivery networks for a variety of analyses including power integrity and ESD/EMC at chip and system-level.

Redefining Analog/Mixed Signal Signoff

  Traditional Power-Noise-Reliability
Analysis Flows
ANSYS Totem Based
Re-defined Full-Chip Signoff Flows
  • No Analysis Available at early stages
  • Need a clean GDS/Netlist
  • Grid Prototyping Analysis
  • GDS Only flows for early stage weakness checks
  • Need detailed PG extracted net-list
  • Fast spice simulators chokes for even medium sized designs
  • Totem extracts PG grid itself, capacity to handle ultra large designs
  • Several Million Xtor FLAT Analysis capacity
  • Complete re-run of the flow from LVS to simulation needs to be performed which may take several days
  • Multiple iterations are very hard to accomplish before Tape-in
  • No What-if capabilities
  • Incremental analysis with new GDS can be run, which is few minutes to hours
  • Abundant what-if scenarios and study possible to make intelligent fixes
  • Combining Digital + Analog not possible
  • Totem can simultaneously handle Digital (P&R) blocks + Analog (Full Custom) blocks in one single simulation

Totem delivers:

Best-in-Class Signoff Analysis

Totem’s core engines for extraction, simulation, electromigration and self-heat analysis are certified for all major technology nodes and correlated several times against spice and silicon measurements. Totem is certified across several major foundries and is the preferred signoff tool for several major semiconductor companies.

The Only Complete Solution

Totem supports all major data formats (GDS, OASIS, LVS database, etc.) for analog, LEF/DEF (for digital) and is compatible with all major spice simulation environments. It has capacity to handle very large designs and possesses superior macro-modeling capabilities for generating an accurate and compact IP model for SOC signoff.

Broad Design Coverage

Totem provides a comprehensive suite of analyses spanning early stage to signoff. It can effectively handle a variety of design styles such as SerDes, data converters, power management IC, embedded memories, DRAM, Flash, FPGA and chip image sensors. Additionally, it delivers numerous analysis capabilities including substrate noise analysis, RDSON analysis, thermal and ESD analysis to address challenges in different designs. It also provides a configurable cockpit for customers to customize their analysis based on their workflows.



  • Early and In-design Analysis

    Supports capabilities like power grid weakness analysis, missing vias, P2P checks and a variety of other analyses that can highlight design weaknesses which are costly to address closer to tape-in.

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  • Signoff Analysis

    Totem is a silicon-proven, layout-based, analog, mixed-signal and custom circuit simulation platform for power integrity and reliability signoff.

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  • Advanced Reliability Analysis

    Totem provides comprehensive reliability signoff solutions for power EM, signal EM , ESD, thermal reliability including self-heating, joule -heating, thermal-aware EM and statistical EM budgeting analysis.

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  • IP Signoff and SoC Integration

    Totem enables EMIR signoff for IPs and macro-modeling capabilities for easy integration and accurate analysis of the IPs at the SoC level.

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  • Advanced Debug

    Totem’s versatile, multifunctional GUI enables customizable maps and debug views that can help designers easily find and fix the real design weaknesses.

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  • Advanced Analysis and Modeling

    Totem offers advanced analysis and modeling capabilities for a variety of designs including high-speed AMS, RF, PMIC and multi-die configurations.

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See how our customers are using our software:

More music, less noise

Noise-Free Infotainment Chip Design

As automotive infotainment units become more complex, designers turn to simulation at the chip level to ensure reliable, noise-free performance. NXP engineers designed a new IC chip for a digital automobile radio with a 75 percent footprint reduction, lower costs and superior sound quality.

View Case Study