For many years, Icepak has played a vital role in ensuring the thermal integrity and reliability of the electronics systems, ranging from the package to the system level. The new AEDT Icepak 2022 R2 brings many new features to improve the Icepak workflows and effectiveness.
AEDT Icepak features enhanced meshing workflows for slider bar meshing to accommodate more complex geometries. Virtual mesh regions simplify the assembly creation process and coordinate aligned meshes to prevent bleeding on edges. Improved Multiphysics workflows from EM tools help in early design insights for electrical engineers. It features new CTM v2 and Delphi ROMs for enhanced package modeling and new post-processing options.
AEDT Icepak 2022 R2 includes multiple features, and, in this webinar, we present the tool's new features for enhanced productivity and advanced modeling.
- Enhanced meshing workflows for slider bar meshing, virtual mesh regions, and coordinate system aligned mesh
- Enhanced chip modeling capabilities - CTM v2 and Delphi Network
- Streamline animations and blower modeling
Tejas Jeurkar - Application Engineer, Ansys