ANSYS Electronics Desktop Features

The ANSYS Electronics Desktop environment houses the ANSYS gold-standard electromagnetics simulation applications. Tight integration among the simulators yields unprecedented ease of use for setup and solution of complex simulations for design and optimization. It is the native desktop for HFSS, Maxwell, Q3D Extractor, Twin Builder and other simulators.

Powerful Multi-Product Workflows

Electronics Desktop features an intuitive ribbon interface with a consistent look and feel, enabling engineers to work seamlessly across multiple products. For example, consider the simulation of a complete radar system. An antenna array can be created in HFSS and linked to the design of an aircraft such as an F-16. The low noise amplifier and circulator, two important components in the radar module circuit design, can be modeled in HFSS 3D Layout and HFSS respectively. The amplifier and a bandpass filter (modeled in HFSS) can be linked together in a circuit simulation with other components of the radar module connected to the antenna array. The outputs of the circuit simulation can be used to drive the post-processing of the antennas using a feature called push excitations. This feature enables engineers to view the electromagnetic fields generated when the array is driven by the radar module circuit.

Radar System Analysis

Radar System Analysis

Design and Simulation Management

ANSYS Electronics Desktop provides an intuitive and consistent ribbon interface for model entry, model setup, simulation control and post-processing in a single framework. ANSYS gold standard electromagnetic field simulators — ANSYS HFSS, ANSYS Maxwell, ANSYS Icepak and ANSYS Q3D Extractor — share this desktop environment. The solver-on-demand methodology enables you to combine field simulators with circuit- and system-level simulations to explore complete system performance. You can insert high-frequency and signal integrity components into projects, with drag-and-drop dynamic links for simple problem setup and reliable performance. Working within a single interface, rather than moving back and forth between several different applications, eliminates the need to export data from one program to another. For example, you can easily insert VRMs, S-parameter elements or IBIS-AMI models into a circuit simulation. Multiple and connected simulations can be easily executed in Electronics Desktop. Engineers can link HFSS, Maxwell, Q3D Extractor and Icepak to obtain electro-thermal solutions. Just a simple mouse-click operation can link power losses from EM tools to Icepak for electro-thermal simulations.

Electrothermal Simulation of a Ring Hybrid Coupler

Electrothermal Simulation of a Hybrid Ring Coupler

The ANSYS Electronics Desktop has a high-performance 3D layout ECAD interface to complement the traditional 3D MCAD-based modeling interface. The HFSS 3D Layout interface is a significant productivity enhancement for IC Package and PCB designers, as it allows them to easily create fully parametric layout-based models to be solved by ANSYS HFSS. Electromagnetic field solutions are fully 3D; only the geometry is layer-based. Models of printed circuit boards (PCBs), electronic packages and custom integrated circuits can be brought into the desktop from popular electronic design automation (EDA) tools. What’s more, HFSS 3D Layout uses specialized HFSS meshing methods to speed solutions.

eDesktop HFSS Layout

Printed Circuit Board Design in ANSYS HFSS 3D Layout

Design Automation and Scripting

The products within ANSYS Electronics Desktop support both Python and Visual Basic scripting. You can record the execution of commands while creating models, assigning boundary conditions, specifying simulation parameters and post-processing. These recorded scripts can be played back or edited to modify the command sequence. In other words, powerful built-in scripting capabilities can automate lengthy processes.

Automate Design Import and Setup for Simulation

Automate Design Import and Setup for Simulation

Component Libraries and Model Support

As electronics systems push the limits of component size, weight and performance, engineers must adopt new technologies and smarter workflows. The ability to share accurate 3D design data among engineering groups while protecting intellectual property is critical to developing next-generation complexity in a secure and scalable manner. The patented 3D Component technology is a breakthrough in model sharing, allowing engineers to create encrypted models that provide all the information to successfully simulate complete assemblies with the highest fidelity. For example, vendor components of a chip antenna and connector can be inserted onto a printed circuit board for a complete assembly simulation.

Vendor Component of a Connector on Board

Vendor Component of a Connector on Board

ANSYS Electronics Desktop Design Types

This table describes the different design types present in ANSYS Electronics Desktop.

Design Types Description
HFSS a 3D MCAD interface to design and simulate electromagnetic components and their installed performance. HFSS includes FEM, IE, PO, and SBR+ solvers.
HFSS 3D Layout a 3D ECAD interface to design and simulate electromagnetic components.
HFSS-IE a 3D MCAD full-wave integral equation solver for large open problems.
Q3D Extractor a quasi-static 3D solver to extract lumped RLGC parameters and SPICE models.
2D Extractor a 2D solver used to extract per-unit-length RLGC parameters of transmission lines and coaxial cables.
Circuit a schematic-based interface to the circuit simulator for RF and SI applications.
Circuit Netlist a netlist (text-based) interface to the circuit simulator for RF and SI applications.
Maxwell 3D a finite element analysis (FEA) tool to solve 3D MCAD electrostatic, magnetostatic, eddy current and transient problems.
Maxwell 2D a finite element analysis (FEA) tool to solve 2D electrostatic, magnetostatic, eddy current and transient problems.
RMxprt a template-based machine design tool to generate 2D and 3D geometries enabling fast, along with analytical calculations of machine performance and detailed finite element calculations in ANSYS Maxwell.
Icepak a 3D interface to design and simulate thermal behavior of electronic components.
EMIT a tool to predict radio frequency RFI in complex environments.
Twin Builder an integrated, multi-domain, mixed-signal simulator for complex technical systems.