Industry-proven and foundry-certified analog and mixed-signal EM/IR solution
ANSYS Totem is a transistor-level power noise and reliability analysis platform that enables you to perform comprehensive power integrity analysis on analog mixed-signal IP and full custom designs.
Totem enables creation of IP models for SOC-level power integrity signoff using RedHawk and generates compact chip models of power delivery networks for a variety of analyses including power integrity and ESD/EMC at chip and system-level.
Redefining Analog/Mixed Signal Signoff
|ANSYS Totem Based
Re-defined Full-Chip Signoff Flows
|MIXED SIGNAL DESIGN PROTOTYPING||
|METAL FIXES & ECO||
|FULL CHIP INTEGRATION||
Best-in-Class Signoff Analysis
Totem’s core engines for extraction, simulation, electromigration and self-heat analysis are certified for all major technology nodes and correlated several times against spice and silicon measurements. Totem is certified across several major foundries and is the preferred signoff tool for several major semiconductor companies.
The Only Complete Solution
Totem supports all major data formats (GDS, OASIS, LVS database, etc.) for analog, LEF/DEF (for digital) and is compatible with all major spice simulation environments. It has capacity to handle very large designs and possesses superior macro-modeling capabilities for generating an accurate and compact IP model for SOC signoff.
Broad Design Coverage
Totem provides a comprehensive suite of analyses spanning early stage to signoff. It can effectively handle a variety of design styles such as SerDes, data converters, power management IC, embedded memories, DRAM, Flash, FPGA and chip image sensors. Additionally, it delivers numerous analysis capabilities including substrate noise analysis, RDSON analysis, thermal and ESD analysis to address challenges in different designs. It also provides a configurable cockpit for customers to customize their analysis based on their workflows.
- Thermal, EM and ESD Reliability Signoff for Next Generation FinFET Designs - Webinar
- Multiphysics Reliability Signoff for Next-Generation Automotive Electronics Systems - Webinar
- Enabling Power and Reliability Signoff for AMS Designs - Webinar
- ANSYS in ACTION: Enabling FinFET Thermal Reliability Signoff for IPs - Webinar
- ANSYS in ACTION: Analog and Mixed Signal Workflows for Power and Reliability Signoff for SerDes IP and PMIC - Webinar
See how our customers are using our software:
Noise-Free Infotainment Chip Design
As automotive infotainment units become more complex, designers turn to simulation at the chip level to ensure reliable, noise-free performance. NXP engineers designed a new IC chip for a digital automobile radio with a 75 percent footprint reduction, lower costs and superior sound quality.View Case Study