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Ansys Innovation Conference

Santa Clara Marriott
November 2nd, 2023

Presentations On-Demand

AI ML Ansys Innovation Conference
Leveraging AI/ML for Engineering Simulation Presented by Prith Banerjee

Artificial Intelligence (AI) is being used in engineering simulation to improve the design and optimization of complex systems, particularly in scenarios where creating and analyzing a vast design space is challenging.

Ansys Maxwell
High-fidelity electric motor simulation with Ansys Maxwell
Increase Electromagnetic Design Innovation with Ansys Maxwell Presented by Jingchen Liang

In this presentation, we will learn about the latest capabilities of the Ansys low frequency electromechanical simulation tools such as Motor-CAD, Maxwell, and Simplorer.  Common applications in electric machine and consumer electronics and how machine learning can enhance digital twin deployment of electric machine models will be discussed.

Ansys Mechanical
How AI and ML are Changing Simulation
Process Integration and Design optimization with AI/ML Presented by Ralf Lampert

Simulation has become an integral part of the product development cycle. One key aspect is the digitalization and optimization of the overall simulation workflow by integrating multidisciplinary computer-aided engineering (CAE) tools. In this webinar, we will show you how to get the best out of your existing CAE tools — such as Ansys Workbench, Ansys Mechanical, and more — by orchestrating and optimizing the simulation workflows with Ansys optiSLang, the state-of-the-art process integration and design optimization solution powered with AI/ML.

ML Service
Distributed Backends for Machine Learning-based Simulation Solvers Presented by Allen Mao & Kliment Minchev

ML Service offers a machine learning-based simulation backend where users can train models from scratch, tune pre-trained models, and execute them on Ansys-relevant data formats. This backend enables a No-Code mode for users to interact through configurable workflows. Training and Inference modes are both executed as distributed, cloud-ready pipelines. ML Service can seamlessly integrate with products such as the Ansys Insight (formerly OnScale Solve) ecosystem. Some of the infrastructure technologies powering ML Service include Nvidia Triton Inference Server, AWS SageMaker, and a planned Kubernetes migration, among others. As the capabilities of ML Service grow, this presentation will provide an update into how using this ML backend can boost the integration of ML techniques into simulation-based workflows as well as a demo of the service. 

Ansys Granta
Ansys Granta Webinar Additive Manufacturing
Materials as a tool for Digital transformation Presented by Benjamin Conlon

As we look to incorporate sustainability and circular economy ideas into the product development process, we can view materials as an avenue to establish the concepts. Tools like those which are present in the Ansys Granta product suite enable direct integration into systems like CAE,CAD and PLM which can be used to centralize and enable a digital concept of materials. In this session we will explore the core ideas around materials data management and how it can relate to improving the product development process while planning for the needs of organizations for the future.

Ansys Sherlock
Design for Reliability Using Ansys Sherlock
Electronics Reliability Just Got Easier Presented by Kelly Morgan

With increasing demands being placed on modern electronics systems, it is imperative that engineers consider the common failure modes and scenarios when developing their products. Ansys solutions revolutionize electronics designs by empowering designers and analysts to simulate real-world conditions and accurately model PCBs and assemblies to predict solder fatigue due to thermo-mechanical, shock, and vibration conditions. With cutting edge modeling features such as trace modeling and industry-leading physics solvers, Ansys can play a major role in your product development process.

Ansys Gateway
Twin Builder AWS IoT Twin Maker
Boost your Electronics simulation with HPC on Ansys Gateway powered by AWS Presented by Dr. Laila Salman

Ansys HFSS is a 3D electromagnetic (EM) simulation software for designing and simulating high-frequency electronic products such as antennas, antenna arrays, RF or microwave components, high-speed interconnects, filters, connectors, IC packages, and printed circuit boards. These different use cases often require large complex models to solve on a traditional workstation, and leveraging an HPC cluster is often tedious, time-consuming, and expensive. Ansys recently partnered with AWS (Amazon Web Services) to develop a new product that optimizes the use of Ansys applications on the cloud




8:30 AM – 9:30 AM

Registration Check-in and Breakfast 

9:35 AM – 9:45 AM

Welcome and Opening Remarks 

9:50 AM– 10:20 AM

Ansys Keynote Address: Leveraging AI/ML for Engineering Simulation - Prith Banerjee, CTO, Ansys 

10:25 AM – 10:55 AM

Customer Keynote Address: Deep Learning for Science and Engineering – Bill Dally, Chief Scientist and Senior Vice President of Nvidia Research 

11:00 AM – 11:15 AM

Coffee Break

11:20 AM – 11:50 AM

Behind the scenes of the Ansys Docuseries: “Driven by Simulation”

11:55 AM – 1:00 PM

Lunch and Demo Pavilion

1:05 PM – 1:35 PM

Increase Electromagnetic Design Innovation with Ansys Maxwell

1:40 PM – 2:10 PM

Process Integration and Design Optimization with AI/ML

2:15 PM – 2:45 PM

Distributed Backends for Machine Learning-Based Simulation Solvers

2:50 PM – 3:05 PM 

Coffee Break

3:10 PM – 3:40 PM

Materials as a Tool for Digital Transformation

3:45 PM – 4:15 PM

Electronics Reliability Just Got Easier

4:20 PM – 4:50 PM

AEDT Simulation Boost using Ansys Gateway HPC Cloud Computing with AWS

4:55 PM – 5:05 PM

Closing Remarks

 5:10 PM – 6:00 PM

Networking Happy Hour