Determine the electronics reliability workflow that works for you and your team
Simulation isn’t a one size fits all. That’s why Ansys provides multiple electronics reliability workflows to fit your product and your reliability needs.
Solve your biggest thermal, electrical and mechanical reliability challenges.
Best practices for ensuring and predicting electronics reliability require comprehensive multi-physics simulations. Ansys ensures reliability success by developing solutions and workflows that overcome today’s biggest simulation and design challenges.
Ansys Electronics Reliability solutions allow organizations to capture a wide-range of parts, materials, simulation and other data, as well as access to critical, simulation-ready material and component data.
Reliability predictions based on physics of failure (PoF) principles resides at the core of the Ansys Electronics Reliability portfolio. Using Ansys simulation tools, electronics manufacturers can determine how long it takes for a product to fail and why the failure occurred.
Ansys Electronics Reliability tools allow engineers to create comprehensive simulation workflows that include high-levels of automation.
Integrated workflows between Ansys Sherlock, Icepak, Mechanical, LS-DYNA, and more provide the simulation results necessary to optimize product designs and ensure reliability in the field.
A computational fluid dynamics (CFD) solver for electronics thermal management. It predicts airflow, temperature and heat transfer in IC packages, PCBs, electronic assemblies, enclosures and power electronics.
구조 및 연성 거동에 대한 심층 해석을 제공하는 유한 요소 해석 (FEA) 솔루션 제품군을 사용하여 광범위한 구조 해석요구를 해결합니다.
Ansys Mechanical에 통합된 강력한 Explicit 시뮬레이션 도구를 사용해 보십시오. 다양한 기능과 재료 모델을 통해 확장성이 뛰어난 복잡한 모델을 구현할 수 있습니다.
고주파, 고속의 전자부품을 설계하는 3D 전자기장 솔버. FEM, IE, 점근 및 하이브리드 솔버는 RF, 마이크로파, IC, PCB및 EMI 문제를 해결합니다.
Ansys는 하나의 통합 툴로 주요 안전 분석 방법을 구현합니다. 안전 표준에 따라 요구되는 분석 작업을 효율적이고 일관된 방식으로 실행할 수 있도록 지원합니다.
Simulation isn’t a one size fits all. That’s why Ansys provides multiple electronics reliability workflows to fit your product and your reliability needs.
Ansys solutions for PCB reliability include a multi-physics workflow that uses a suite of leading simulation tools. Using our workflow solutions, you can simulate electrical, thermal, and mechanical effects to determine product reliability.
In this webinar, learn how Ansys SIwave, Ansys Icepak, Ansys Mechanical and Ansys Sherlock can be used as a comprehensive multi-physics solution to optimize PCB reliability.
This webinar will demonstrate an automated process of thermal modeling of printed circuit boards. It will present a workflow to translate ECAD data to a thermal and mechanical model in Ansys Icepak, followed by the transfer of results into Ansys Sherlock for solder fatigue analysis.
This webinar covers product integrations, relevant updates for each tool that will enable faster and more efficient simulations and updates to key workflows that help users address important electronics reliability challenges.