Determine the electronics reliability workflow that works for you and your team
Simulation isn’t a one size fits all. That’s why Ansys provides multiple electronics reliability workflows to fit your product and your reliability needs.
Electronics Reliability
Solve your biggest thermal, electrical and mechanical reliability challenges.
ANSYS APPLICATIONS
Optimize and Predict Electronics Reliability
Best practices for ensuring and predicting electronics reliability require comprehensive multi-physics simulations. Ansys ensures reliability success by developing solutions and workflows that overcome today’s biggest simulation and design challenges.
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Extract Detailed Geometries from any ECAD file
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Perform Complex Multiphysics Analyses
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Predict Time to Failure Before Prototyping
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Implement Automation and Optimization
Electronics Reliability Just Got Easier
Design Democratization
Ansys Electronics Reliability solutions allow organizations to capture a wide-range of parts, materials, simulation and other data, as well as access to critical, simulation-ready material and component data.
Robust Reliability Predictions
Reliability predictions based on physics of failure (PoF) principles resides at the core of the Ansys Electronics Reliability portfolio. Using Ansys simulation tools, electronics manufacturers can determine how long it takes for a product to fail and why the failure occurred.
Workflow Automation
Ansys Electronics Reliability tools allow engineers to create comprehensive simulation workflows that include high-levels of automation.
Electrical, Thermal and Mechanical Analysis
Integrated workflows between Ansys Sherlock, Icepak, Mechanical, LS-DYNA, and more provide the simulation results necessary to optimize product designs and ensure reliability in the field.
Featured Products
초기 설계 단계에서 구성 요소, 보드 및 시스템 레베의 전자 하드웨어에 대한 신속하고 정확한 수명 예측으로 향후 설계를 대비할 수 있습니다.
- 솔더 피로 해석
- ECAD를 FEA/CFD로 빠르게 변환
- 응력(열, 구조)을 통해 수명 예측
- 수정 가능한 임베디드 라이브러리
- 검증된 파손 시간 예측
A computational fluid dynamics (CFD) solver for electronics thermal management. It predicts airflow, temperature and heat transfer in IC packages, PCBs, electronic assemblies, enclosures and power electronics.
- Unstructured, body-fitted meshing
- Built-in high-fidelity CFD solver
- Comprehensive thermal reliability solution
- Industry leading multiscale multiphysics
- Board-level electrothermal coupling
- Extensive libraries for thermal physics
구조 및 연성 거동에 대한 심층 해석을 제공하는 유한 요소 해석 (FEA) 솔루션 제품군을 사용하여 광범위한 구조 해석요구를 해결합니다.
- 사용하기 쉬운 다목적 툴
- 지속적이고 신뢰할 수 있는 솔버 기술
- 다이나믹 통합 플랫폼
A specialized tool for simulating power and signal integrity as well as EMI analysis of IC/PCB packages. Solve for power delivery systems and high-speed channels in electronic devices.
- Electrothermal and mechanical analysis
- IBIS and IBIS-AMI SerDes analysis
- Virtual compliance
- Impedance, crosstalk and EMI scanning
- Automated decoupling capacitor Optimization
Ansys Mechanical에 통합된 강력한 Explicit 시뮬레이션 도구를 사용해 보십시오. 다양한 기능과 재료 모델을 통해 확장성이 뛰어난 복잡한 모델을 구현할 수 있습니다.
- 고도로 비선형적해석
- 과도 변형 문제 해석
- 비압축성 CFD(ICFD), 전자기(EM) 및 CESE/압축성 CFD 및 Chemistry 솔버에 의한 다중물리 문제 해결
고주파, 고속의 전자부품을 설계하는 3D 전자기장 솔버. FEM, IE, 점근 및 하이브리드 솔버는 RF, 마이크로파, IC, PCB및 EMI 문제를 해결합니다.
- 멀티 레이어 패키지 솔빙
- PCB 및 패키지에 대한 3D 레이아웃 워크플로우
- 고주파 전자기기 솔버
- 3D 컴포넌트를 통한 IP 보호
Ansys는 하나의 통합 툴로 주요 안전 분석 방법을 구현합니다. 안전 표준에 따라 요구되는 분석 작업을 효율적이고 일관된 방식으로 실행할 수 있도록 지원합니다.
- 하나의 통합된 툴에 주요 안전 분석 방법을 통합
- ISO 26262, IEC 61508, ARP4761, MIL-STD 882E와 같은 표준 준수
- 항상 일관성 있는 시스템 설계를 기반으로 수행되는 안전 분석
- SAE J1739, VDA-AIAG FMEA 핸드북 등에 따른 품질 분석
- 완전한 엔드-투-엔드 추적성
- 요구사항 관리와 시스템 설계를 위해 파트너 및 타사 툴과 통합
“Across the board, it doesn't matter what tech trend you're looking at—5G, electrification, AVs, IIoT—PCB reliability is at the backbone of all those needs."
Printed Circuit Board (PCB) Solutions
Ansys solutions for PCB reliability include a multi-physics workflow that uses a suite of leading simulation tools. Using our workflow solutions, you can simulate electrical, thermal, and mechanical effects to determine product reliability.
- Ansys HFSS and SIwave to determine Power and Signal Integrity
- Ansys Icepak to assess Thermal Integrity
- Ansys Mechanical for Structural Analysis
- Ansys LS-DYNA for Drop-Test and Impact Studies
- Ansys Sherlock for Reliability (Life) Predictions of Electronics Systems
Featured Events
WEBINARS
Webinar On Demand
Reliability Analysis of PCBs with Ansys Icepak, HFSS 3D Layout, Mechanical, and Sherlock
In this webinar, learn how Ansys SIwave, Ansys Icepak, Ansys Mechanical and Ansys Sherlock can be used as a comprehensive multi-physics solution to optimize PCB reliability.
Webinar On Demand
Ansys Icepak and Ansys Sherlock for Temperature Cycling
This webinar will demonstrate an automated process of thermal modeling of printed circuit boards. It will present a workflow to translate ECAD data to a thermal and mechanical model in Ansys Icepak, followed by the transfer of results into Ansys Sherlock for solder fatigue analysis.
Webinar On Demand
Ansys 2021 R2: Ansys Sherlock and Electronics Reliability Update
This webinar covers product integrations, relevant updates for each tool that will enable faster and more efficient simulations and updates to key workflows that help users address important electronics reliability challenges.
Featured Resources
CASE STUDIES
WHITE PAPER
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