Determine the electronics reliability workflow that works for you and your team
Simulation isn’t a one size fits all. That’s why Ansys provides multiple electronics reliability workflows to fit your product and your reliability needs.
Solve your biggest thermal, electrical and mechanical reliability challenges.
Best practices for ensuring and predicting electronics reliability require comprehensive multi-physics simulations. Ansys ensures reliability success by developing solutions and workflows that overcome today’s biggest simulation and design challenges.
Ansys Electronics Reliability solutions allow organizations to capture a wide-range of parts, materials, simulation and other data, as well as access to critical, simulation-ready material and component data.
Reliability predictions based on physics of failure (PoF) principles resides at the core of the Ansys Electronics Reliability portfolio. Using Ansys simulation tools, electronics manufacturers can determine how long it takes for a product to fail and why the failure occurred.
Ansys Electronics Reliability tools allow engineers to create comprehensive simulation workflows that include high-levels of automation.
Integrated workflows between Ansys Sherlock, Icepak, Mechanical, LS-DYNA, and more provide the simulation results necessary to optimize product designs and ensure reliability in the field.
用于电子热管理的计算流体动力学(CFD)求解器。它可以预测IC封装、PCB、电子装配体、外壳和电力电子设备中的气流、温度和热传递。
通过一套有限元分析(FEA)解决方案提供针对结构和耦合场行为的深入分析,满足广泛的结构分析需求。
使用Ansys Mechanical中集成的强大显式仿真工具。大量功能和材料模型使复杂模型具有极大的可扩展性。
用于设计高频和高速电子元件的 3D 电磁场求解器。其 FEM、IE、渐近和混合求解器可解决 RF、微波、IC、PCB 和 EMI 问题。
Ansys能够在统一的集成工具中实现关键的安全分析方法。它支持高效、一致执行安全标准要求的分析活动。
Simulation isn’t a one size fits all. That’s why Ansys provides multiple electronics reliability workflows to fit your product and your reliability needs.
Ansys solutions for PCB reliability include a multi-physics workflow that uses a suite of leading simulation tools. Using our workflow solutions, you can simulate electrical, thermal, and mechanical effects to determine product reliability.
This webinar will demonstrate an automated process of thermal modeling of printed circuit boards. It will present a workflow to translate ECAD data to a thermal and mechanical model in Ansys Icepak, followed by the transfer of results into Ansys Sherlock for solder fatigue analysis.
This webinar covers product integrations, relevant updates for each tool that will enable faster and more efficient simulations and updates to key workflows that help users address important electronics reliability challenges.