Determine the electronics reliability workflow that works for you and your team
Simulation isn’t a one size fits all. That’s why Ansys provides multiple electronics reliability workflows to fit your product and your reliability needs.
Electronics Reliability
Solve your biggest thermal, electrical and mechanical reliability challenges.
ANSYS APPLICATIONS
Optimize and Predict Electronics Reliability
Best practices for ensuring and predicting electronics reliability require comprehensive multi-physics simulations. Ansys ensures reliability success by developing solutions and workflows that overcome today’s biggest simulation and design challenges.
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Extract Detailed Geometries from any ECAD file
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Perform Complex Multiphysics Analyses
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Predict Time to Failure Before Prototyping
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Implement Automation and Optimization
Electronics Reliability Just Got Easier
Design Democratization
Ansys Electronics Reliability solutions allow organizations to capture a wide-range of parts, materials, simulation and other data, as well as access to critical, simulation-ready material and component data.
Robust Reliability Predictions
Reliability predictions based on physics of failure (PoF) principles resides at the core of the Ansys Electronics Reliability portfolio. Using Ansys simulation tools, electronics manufacturers can determine how long it takes for a product to fail and why the failure occurred.
Workflow Automation
Ansys Electronics Reliability tools allow engineers to create comprehensive simulation workflows that include high-levels of automation.
Electrical, Thermal and Mechanical Analysis
Integrated workflows between Ansys Sherlock, Icepak, Mechanical, LS-DYNA, and more provide the simulation results necessary to optimize product designs and ensure reliability in the field.
Featured Products
在设计早期阶段，在组件级、板级和系统级为电子产品硬件提供快速准确的使用寿命预测，有助于实现面向未来的设计。
- 焊接疲劳分析
- 在几分钟内完成ECAD到FEA/CFD的转换
- 将应力（热机械）转化为寿命预测
- 嵌入式、可填充、可修改的库
- 经过验证的故障时间预测
用于电子热管理的计算流体动力学（CFD）求解器。它可以预测IC封装、PCB、电子装配体、外壳和电力电子设备中的气流、温度和热传递。
- 非结构化、贴体网格划分
- 内置高保真度CFD求解器
- 综合全面的热可靠性解决方案
- 行业领先的多尺度多物理场
- 板级电热耦合
- 丰富的热物理库
通过一套有限元分析（FEA）解决方案提供针对结构和耦合场行为的深入分析，满足广泛的结构分析需求。
- 易于使用的多功能工具
- 持久可靠的求解器技术
- 动态集成平台
面向电源和信号完整性仿真以及IC/PCB封装EMI分析的专用工具。解决电子设备中的供电系统和高速通道。
- 电热和机械分析
- IBIS 和 IBIS-AMI SerDes 分析
- 虚拟合规 阻抗、串扰和EMI扫描
- 自动解耦电容器优化
使用Ansys Mechanical中集成的强大显式仿真工具。大量功能和材料模型使复杂模型具有极大的可扩展性。
- 处理高度非线性仿真
- 仿真极端变形问题
- 使用不可压缩CFD（ICFD）、电磁学（EM）和CESE/可压缩CFD和化学求解器解决多物理场问题
用于设计高频和高速电子元件的 3D 电磁场求解器。其 FEM、IE、渐近和混合求解器可解决 RF、微波、IC、PCB 和 EMI 问题。
- 解决多层封装
- PCB 和封装的 3D 布局工作流程
- 高频电磁求解器
- 通过 3D 组件进行 IP 保护
Ansys能够在统一的集成工具中实现关键的安全分析方法。它支持高效、一致执行安全标准要求的分析活动。
- 关键安全性分析方法，一体化集成工具
- 符合ISO 26262、IEC 61508、ARP4761和MIL-STD 882E等标准
- 基于始终一致性的系统设计开展安全性分析
- 根据SAE J1739、VDA-AIAG FMEA手册等开展质量分析。
- 完整的端到端可追溯性
- 与合作伙伴和第三方工具集成，进行需求管理和系统设计
“Across the board, it doesn't matter what tech trend you're looking at—5G, electrification, AVs, IIoT—PCB reliability is at the backbone of all those needs."
Printed Circuit Board (PCB) Solutions
Ansys solutions for PCB reliability include a multi-physics workflow that uses a suite of leading simulation tools. Using our workflow solutions, you can simulate electrical, thermal, and mechanical effects to determine product reliability.
- Ansys HFSS and SIwave to determine Power and Signal Integrity
- Ansys Icepak to assess Thermal Integrity
- Ansys Mechanical for Structural Analysis
- Ansys LS-DYNA for Drop-Test and Impact Studies
- Ansys Sherlock for Reliability (Life) Predictions of Electronics Systems
Featured Resources
WEBINARS
Webinar On Demand
Ansys Icepak and Ansys Sherlock for Temperature Cycling
This webinar will demonstrate an automated process of thermal modeling of printed circuit boards. It will present a workflow to translate ECAD data to a thermal and mechanical model in Ansys Icepak, followed by the transfer of results into Ansys Sherlock for solder fatigue analysis.
Webinar On Demand
Ansys 2021 R2: Ansys Sherlock and Electronics Reliability Update
This webinar covers product integrations, relevant updates for each tool that will enable faster and more efficient simulations and updates to key workflows that help users address important electronics reliability challenges.
CASE STUDIES
WHITE PAPER
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