Determine the electronics reliability workflow that works for you and your team
Simulation isn’t a one size fits all. That’s why Ansys provides multiple electronics reliability workflows to fit your product and your reliability needs.
Electronics Reliability
Solve your biggest thermal, electrical and mechanical reliability challenges.
ANSYS APPLICATIONS
Optimize and Predict Electronics Reliability
Best practices for ensuring and predicting electronics reliability require comprehensive multi-physics simulations. Ansys ensures reliability success by developing solutions and workflows that overcome today’s biggest simulation and design challenges.
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Extract Detailed Geometries from any ECAD file
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Perform Complex Multiphysics Analyses
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Predict Time to Failure Before Prototyping
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Implement Automation and Optimization
Electronics Reliability Just Got Easier
Design Democratization
Ansys Electronics Reliability solutions allow organizations to capture a wide-range of parts, materials, simulation and other data, as well as access to critical, simulation-ready material and component data.
Robust Reliability Predictions
Reliability predictions based on physics of failure (PoF) principles resides at the core of the Ansys Electronics Reliability portfolio. Using Ansys simulation tools, electronics manufacturers can determine how long it takes for a product to fail and why the failure occurred.
Workflow Automation
Ansys Electronics Reliability tools allow engineers to create comprehensive simulation workflows that include high-levels of automation.
Electrical, Thermal and Mechanical Analysis
Integrated workflows between Ansys Sherlock, Icepak, Mechanical, LS-DYNA, and more provide the simulation results necessary to optimize product designs and ensure reliability in the field.
Featured Products
在早期設計階段，為元件、電路板和系統層級的電子硬體提供快速準確的壽命預測，讓您的設計永不過時。
- 焊錫疲勞分析
- 在數分鐘內將 ECAD 轉換為 FEA/CFD
- 將應力 (熱應力、機械應力) 轉化為壽命預測
- 可嵌入、可輸入、可修改的資料庫
- 經過驗證的故障壽命預測
用於電子產品散熱管理的計算流體動力學 (CFD) 求解器。可預測 IC 封裝、PCB、電子組件、外殼與電力電子設備中的氣流、溫度及熱傳遞。
- 非結構化、貼體網格
- 內建高傳真度的 CFD 求解器
- 全方位熱能可靠性解決方案
- 領先業界的多尺度多重物理量
- 板階電熱耦合
- 廣泛的熱物理資料庫
想解決多樣的結構分析需求，需要一套有限元分析 (FEA) 方案，該解決方案提供針對結構和耦合場行為的深入分析。
- 使用便利的多用途工具
- 一貫、可靠的求解器技術
- 動態的整合平台
用於模擬電源與訊號完整性，以及 IC/PCB 封裝 EMI 分析的專業工具。為電子裝置中的電力傳輸系統和高速通道求解。
- 電熱和機械分析
- IBIS 和 IBIS-AMI SerDes 分析
- 虛擬合規性
- 阻抗、串擾和 EMI 掃描
- 自動去耦電容器最佳化
採用整合在 Ansys Mechanical 中的強大通用顯式動力模擬軟體。大量的功能和材料模型可使複雜的模型具有極大的可擴充性。
- 處理極度非線性的模擬
- 模擬極端變形問題
- 使用不可壓縮流 (ICFD)、電磁學 (EM) 和 CESE /可壓縮流 和化學求解器解決多物理問題
用於設計高頻和高速電子元件的 3D 電磁場求解器。其 FEM、IE、漸近和混合求解器可解決 RF、微波、IC、PCB 和 EMI 問題。
- 解決多層封裝
- 適用於 PCB 和封裝的 3D 配置工作流程
- 高頻電磁求解器
- 透過 3D 元件的 IP 保護
Ansys 在單個整合工具中，導入關鍵安全分析方法。這個方法能支援以有效且一致的方法來執行安全標準所要求的分析活動。
- 關鍵安全分析方法，全部包含在單個整合式工具
- 符合 ISO 26262、IEC 61508、ARP4761 和 MIL-STD 882E 等標準
- 以具備一致性的系統設計為基礎，進行安全性分析
- 根據 SAE J1739、VDA-AIAG FMEA 手冊等進行的品質分析
- 完整的端對端可追溯性
- 與合作夥伴和第三方工具整合，以管理要求並設計系統
“Across the board, it doesn't matter what tech trend you're looking at—5G, electrification, AVs, IIoT—PCB reliability is at the backbone of all those needs."
Printed Circuit Board (PCB) Solutions
Ansys solutions for PCB reliability include a multi-physics workflow that uses a suite of leading simulation tools. Using our workflow solutions, you can simulate electrical, thermal, and mechanical effects to determine product reliability.
- Ansys HFSS and SIwave to determine Power and Signal Integrity
- Ansys Icepak to assess Thermal Integrity
- Ansys Mechanical for Structural Analysis
- Ansys LS-DYNA for Drop-Test and Impact Studies
- Ansys Sherlock for Reliability (Life) Predictions of Electronics Systems
Featured Resources
WEBINARS
Webinar On Demand
Ansys Icepak and Ansys Sherlock for Temperature Cycling
This webinar will demonstrate an automated process of thermal modeling of printed circuit boards. It will present a workflow to translate ECAD data to a thermal and mechanical model in Ansys Icepak, followed by the transfer of results into Ansys Sherlock for solder fatigue analysis.
Webinar On Demand
Ansys 2021 R2: Ansys Sherlock and Electronics Reliability Update
This webinar covers product integrations, relevant updates for each tool that will enable faster and more efficient simulations and updates to key workflows that help users address important electronics reliability challenges.
CASE STUDIES
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