Determine the electronics reliability workflow that works for you and your team
Simulation isn’t a one size fits all. That’s why Ansys provides multiple electronics reliability workflows to fit your product and your reliability needs.
Electronics Reliability
Solve your biggest thermal, electrical and mechanical reliability challenges.
ANSYS APPLICATIONS
Optimize and Predict Electronics Reliability
Best practices for ensuring and predicting electronics reliability require comprehensive multi-physics simulations. Ansys ensures reliability success by developing solutions and workflows that overcome today’s biggest simulation and design challenges.
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Extract Detailed Geometries from any ECAD file
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Perform Complex Multiphysics Analyses
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Predict Time to Failure Before Prototyping
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Implement Automation and Optimization
Electronics Reliability Just Got Easier
Design Democratization
Ansys Electronics Reliability solutions allow organizations to capture a wide-range of parts, materials, simulation and other data, as well as access to critical, simulation-ready material and component data.
Robust Reliability Predictions
Reliability predictions based on physics of failure (PoF) principles resides at the core of the Ansys Electronics Reliability portfolio. Using Ansys simulation tools, electronics manufacturers can determine how long it takes for a product to fail and why the failure occurred.
Workflow Automation
Ansys Electronics Reliability tools allow engineers to create comprehensive simulation workflows that include high-levels of automation.
Electrical, Thermal and Mechanical Analysis
Integrated workflows between Ansys Sherlock, Icepak, Mechanical, LS-DYNA, and more provide the simulation results necessary to optimize product designs and ensure reliability in the field.
Featured Products
Ansys Sherlock is the only reliability physics-based electronics design tool that provides fast and accurate life predictions for electronic hardware at the component, board and system levels in early stage design.
Ansys Icepak is a CFD solver for electronics thermal management. It predicts airflow, temperature and heat transfer in IC packages, PCBs, electronic assemblies/enclosures and power electronics.
Solve broad structural analysis needs with a suite of finite element analysis (FEA) solutions that provides in-depth analysis of structural and coupled-field behaviors.
A specialized tool for power integrity, signal integrity and EMI analysis of IC packages and PCBs. Solves power delivery systems and high-speed channels in electronic devices.
Ansys LS-DYNA is the industry-leading explicit simulation software used for applications like drop tests, impact and penetration, smashes and crashes, occupant safety, and more.
Multipurpose, full wave 3D electromagnetic (EM) simulation software for designing and simulating high-frequency electronic products such as antennas, components, interconnects, connectors, ICs and PCBs.
Ansys implements key safety analysis methods in one integrated tool. It supports the efficient and consistent execution of the analysis activities that are required by safety standards.
“Across the board, it doesn't matter what tech trend you're looking at—5G, electrification, AVs, IIoT—PCB reliability is at the backbone of all those needs."
Printed Circuit Board (PCB) Solutions
Ansys solutions for PCB reliability include a multi-physics workflow that uses a suite of leading simulation tools. Using our workflow solutions, you can simulate electrical, thermal, and mechanical effects to determine product reliability.
- Ansys HFSS and SIwave to determine Power and Signal Integrity
- Ansys Icepak to assess Thermal Integrity
- Ansys Mechanical for Structural Analysis
- Ansys LS-DYNA for Drop-Test and Impact Studies
- Ansys Sherlock for Reliability (Life) Predictions of Electronics Systems
Featured Events
WEBINARS
Webinar On Demand
Reliability Analysis of PCBs with Ansys Icepak, HFSS 3D Layout, Mechanical, and Sherlock
In this webinar, learn how Ansys SIwave, Ansys Icepak, Ansys Mechanical and Ansys Sherlock can be used as a comprehensive multi-physics solution to optimize PCB reliability.
Webinar On Demand
Ansys Icepak and Ansys Sherlock for Temperature Cycling
This webinar will demonstrate an automated process of thermal modeling of printed circuit boards. It will present a workflow to translate ECAD data to a thermal and mechanical model in Ansys Icepak, followed by the transfer of results into Ansys Sherlock for solder fatigue analysis.
Webinar On Demand
Ansys 2021 R2: Ansys Sherlock and Electronics Reliability Update
This webinar covers product integrations, relevant updates for each tool that will enable faster and more efficient simulations and updates to key workflows that help users address important electronics reliability challenges.
Featured Resources
CASE STUDIES
WHITE PAPER
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