Using Multiphysics Simulation for Optimum EMI and Thermal Performance of a Chassis Enclosure


High-density PCBs found in large data centers, sensitive military and aerospace platforms, and other systems that use high-performance electronics require optimized chassis enclosures that cool and control the electromagnetic interference (EMI) emission and susceptibility characteristics of a system achieving required performance and reliability.

Optimal enclosures must address electrical, mechanical and thermal issues simultaneously. Engineering teams need to be aware of how design features impact the overall system. For instance, grating over a fan intake designed to mitigate EMI could restrict the flow of air from the fan, allowing temperatures inside the enclosure to rise to unacceptable levels. Increasing the fan speed to maintain a specific internal temperature could satisfy the EMI and thermal requirements, but also produce more noise.

During this webinar, Ansys presents a multiphysics approach to comprehensive PCB and enclosure design that addresses SI/PI, EMI and thermal performance using multiple simulation products from Ansys including HFSS, SIwave and Icepak. Electromagnetic analysis will examine emissions from unintentional signals from common-mode noise sources, cross-talk coupling to I/O traces (PCB, PKG and IC levels), power planes and other board structures. Ansys Icepak thermal control, with advanced solver technology and robust meshing options, provides fast and accurate thermal results for electronics cooling applications. Engineers will see the trade-offs between EMI shielding and providing sufficient cooling for reliable operation. Examples will demonstrate how multi-disciplinary engineering teams can use coupled analyses to study three interrelated physical phenomena and develop enclosures that comply with electrical, mechanical and thermal standards.


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