Cloud computing reduces by 80 percent the time required for a coupled CFD and structural simulation.
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As consumer electronics manufacturers squeeze more and more functionality into smaller and smaller packages, thermal management is a critical design consideration. Here, Alan Wong discusses challenges in the cooling industry — and explains why the world’s leading electronics companies and other innovators rely on Aavid for custom thermal management solutions and, increasingly, engineering services.
Electronics are pervasive in our world today. From electric machines to high-speed electronic devices to antennas and wireless communication, the demand continues to grow. However, designing innovative products to work reliably in the real world becomes more difficult with the need to reduce energy consumption, avoid interference with other devices and decrease development time. Leading companies leverage engineering simulation to quickly bring to market pioneering products that meet and exceed expectations.
Engineers wanted to eliminate the use of thermal sensors on prototype engines by determining the heat flux with ANSYS Fluent, then coupling Fluent to Rolls-Royce’s proprietary structural simulation code, thereby solving structural and thermal design problems simultaneously using an iterative process. But this solution required HPC, and HPC use at Rolls-Royce was at maximum capacity.
HPC in the cloud reduces runtime for a complex multiphase CFD model with realistic particle loading from five days to two days.
Extreme temperature and pressure differences outside the aircraft while in-flight and on the ground must be accommodated to keep passengers comfortable and safe. Systems-level simulation and detailed thermal analysis are combined to meet industry standards.
HPC solutions enable high-fidelity insight into car performance in shorter turnaround times for Red Bull Racing.