A Via Runs Through It - Article - ANSYS Advantage - V11 I3

Signal integrity has emerged as a major issue in the design of high-speed electronics. While signal crosstalk has been a challenge for electrical engineers for some time, the proliferation of electronics in our lives amplifies the negative consequences of bad design practices. The ANSYS Electronics Desktop, which includes enhancements to ANSYS HFSS and ANSYS SIwave, is an essential tool for engineers looking to address electronic system reliability issues, such as signal integrity, power integrity and EMI/EMC. Interconnect Engineering, Inc. used these simulation tools to analyze a customer case involving a DDR3-800 board. They determined that unexpected crosstalk was originating in the BGA vias, and solved the problem by routing layers closer to the primary side of the PCB.


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