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Ansys at DAC 2024

Join Us at the Design Automation Conference

Dates: June 23rd-27th
Booth #1308

 

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DAC Power Integrity Signoff

Leading in Power Integrity Signoff with Breakthrough Innovation

Ansys delivers the industry’s broadest range of foundry-certified golden signoff tools for semiconductor, electronic, and complete system design, including the latest 2nm nodes.

Stop by our booth to learn how our new SigmaDVD technology radically changes how leading customers analyze dynamic voltage drops.

See how the latest IR-ECO and IR-STA joint developments have integrated the industry’s best signoff engines, PrimeTime(tm) and RedHawk-SC(tm).

Industry-Proven 3D-IC Thermal and Multiphysics Analysis

When designing 2.5D/3D-IC systems, the distinction between chip, package, and system blurs and merges, requiring design engineers to overcome novel multiphysics challenges like Thermal Integrity, Mechanical Integrity, Electromagnetic Signal Integrity, and multi-die Power Integrity.

Talk to our experts about the Ansys RedHawk-SC Electrothermal(tm) platform for Thermal prototyping and signoff.

DAC Thermal Multiphysics Analysis
DAC Analog Signal Analysis

Unique Analog Mixed Signal Analysis and Optimization Capabilities

Ansys has significantly expanded its suite of analog analysis tools to include full-chip parasitic visualization and root-cause debugging with Diakopto ParagonX(tm). Transistor-level power integrity and ESD integrity have been supercharged by moving to the cloud-optimized SeaScape platform. RaptorX and HFSS are the industry’s most accurate solutions for high-speed, high-accuracy electromagnetic modeling—both on-chip and at the system level.

WE'RE SHOWING THE LATEST IN DESIGN TECHNOLOGY

Ansys Redhawk-SC performs IC electrothermal simulations

Address Power Integrity

EM/IR signoff analysis is exponentially more difficult with Dynamic Voltage Drop (DVD), but the new EM/IR analysis and debugging capabilities in the RedHawk-SC ™ family handle it easily.

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Ansys Signal Power & Integrity

Handle 3D-IC Electrothermal

Heat dissipation is a primary concern for all 2.5D/3D designs, and RedHawk-SC Electrothermal™ includes power integrity, fluid dynamics simulation for thermal cooling, mechanical simulation, and electromagnetic analysis.

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Ansys Electronics Desktop Student Is Added to Free Software Downloads

Analyze and Measure System Reliability & Hardware Security

From power integrity, signal integrity, electromagnetic and thermal simulation, Ansys solutions analyze and measure the vulnerability of silicon circuits to hardware side-channel attacks.

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Modeling Coupling Between Cables and Platforms for Electromagnetic Compatibility with Ansys EMA3D Cable

Manage Electromagnetic Coupling & Interference:

Wi-Fi, 5/6G, and high-speed digital backplanes require accurate electromagnetic modeling, and RaptorX™ delivers the speed and capacity to analyze today's largest silicon designs in a single run.

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Enable RTL Power Analysis & Optimization

Hardware emulators execute real applications, generating enormous quantities of vector data. PowerArtist™ analyzes these vast data streams to extract critical vector subsets that capture peak power and reduce power consumption.

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zemax camera lenses exploded view

Script, Process and Optimize Photonics

The industry's most complete optical design and analysis flow.

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DAC Analog Card

Advanced Parasitic Visualization, Debug, and Root-Cause Analysis

High-capacity parasitic debug and visualization for top-level AMS designs. A rich suite of analysis tools quickly identify the root cause of performance issues using only the layout DSPF as input.

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See What Ansys Can Do For You

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