We're Covering the Latest Technology Trends Researched by Ansys Experts
The semiconductor and electronics industries collide with 3D-IC technology, enabling companies to design differentiating bespoke silicon. The advent of 3D-IC requires more physics domains in a multiphysics challenge with new tools and approaches to building electronic design teams. At DAC 2023, we’ll share the latest 3nm power integrity signoff technologies, dynamic voltage drop coverage, thermal signoff for chips & PCBs, advanced 2.5D/3D packaging, and photonic design.