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Ansys Best-In-Class Electromagnetic Simulation Software

If you work with 5G/6G antenna design, RF, microwave, PCB, package, or IC design, we have a complete electronics simulation solution for you. Ansys electromagnetic software solutions help you solve any electromagnetic, signal integrity, thermal and electro-mechanical, parasitic, cabling and vibration challenges in your designs.

Chat with an Ansys EM Expert to learn how you can reduce your design-cycle and time-to-market by ensuring your electronics design is validated, cost-effective, operable and certification-ready.

Watch how our new Mesh fusion technology in Ansys HFSS reduces simulation time and increases the simulation speed of solving large EM structures.

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Innovation Demands Ansys HFSS

ANYWAVES Uses Ansys Simulation Software to Develop Next-Generation Miniature Antennas

Since its launch, ANYWAVES has relied on multiphysics digital simulation. The company chose Ansys to help deploy this technology. 

ANYWAVES uses Ansys HFSS electromagnetic (EM) simulation software to study the electronic operation of the antenna as a whole. Ansys HFSS is able to merge meshes of different scales (from nanometers to meters), which allows all components to be combined – from the antenna electronic circuits to the satellite envelope – and the EM interactions can be predicted in the same simulation. 

The combination of the software allows ANYWAVES to have complete simulations that are true to the real performance of the antennas.

Global Innovators Leverage Ansys

Microsoft solved an adaptively converged mesh at 5GHz in under 30 hours using Ansys HFSS

“I am excited to announce that Ansys HFSS has completely solved an adaptively converged mesh (15 passes) for an entire RFIC (5.5 x 5.5mm) (see figure 1) at 5GHz in under 30 hours. This model has 64 ports distributed across the entire IC, which represents the most challenging conditions for the adaptive refinement process to solve. We were able to do this by bringing together two new significant technologies:”

  1. HFSS Layout automated IC-specific meshing in Ansys HFSS
  2. Ansys Cloud on Microsoft Azure

“It is so rewarding to see a problem of this size and complexity solved on Azure, putting this level of HPC power in the hands of engineers when they need it the most.”, says Merrie Williamson, Microsoft VP Azure Apps and Infrastructure. “This is a great example of two partners blending their strengths to serve their joint customers, and I’m eager to see the impact this will make on companies tackling the new wave of IC-design challenges posed by 5G and beyond.”

July 2022

What's New

The Ansys 2022 R2 update brings major enhancements and new functionality to HFSS, including a Flex PCB workflow, support for encrypted components in IC design and further improvements to simulation turnaround time.

Flex pcb Workflow
Flex PCB Support in 3D Layout

The new HFSS 3D Layout Flex PCB workflow ensures resounding success of any product or system using flex PCBs connecting systems and components.

IC Inductor Simulation View
Encrypted Chip IP Support

Engineers working with foundry technology files for defining IC stackups can work with encrypted components in HFSS 3D Layout.

Hfss improved mesh
More Performance Optimizations

Boosting HFSS performance by reducing design and simulation turnaround time benefits HFSS users, especially engineers who solve designs at a large scale in size and/or complexity.