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Ansys Best-In-Class Electromagnetic Simulation Software

If you work with 5G/6G antenna design, RF, microwave, PCB, package, or IC design, we have a complete electronics simulation solution for you. Ansys electromagnetic software solutions help you solve any electromagnetic, signal integrity, thermal and electro-mechanical, parasitic, cabling and vibration challenges in your designs.

Chat with an Ansys EM Expert to learn how you can reduce your design-cycle and time-to-market by ensuring your electronics design is validated, cost-effective, operable and certification-ready.

Watch how our new Mesh fusion technology in Ansys HFSS reduces simulation time and increases the simulation speed of solving large EM structures.

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Innovation Demands Ansys HFSS

ANYWAVES Uses Ansys Simulation Software to Develop Next-Generation Miniature Antennas

Since its launch, ANYWAVES has relied on multiphysics digital simulation. The company chose Ansys to help deploy this technology. 

ANYWAVES uses Ansys HFSS electromagnetic (EM) simulation software to study the electronic operation of the antenna as a whole. Ansys HFSS is able to merge meshes of different scales (from nanometers to meters), which allows all components to be combined – from the antenna electronic circuits to the satellite envelope – and the EM interactions can be predicted in the same simulation. 

The combination of the software allows ANYWAVES to have complete simulations that are true to the real performance of the antennas.

Global Innovators Leverage Ansys

Microsoft solved an adaptively converged mesh at 5GHz in under 30 hours using Ansys HFSS

I am excited to announce that Ansys HFSS has completely solved an adaptively converged mesh (15 passes) for an entire RFIC (5.5 x 5.5mm) (see figure 1) at 5GHz in under 30 hours. This model has 64 ports distributed across the entire IC, which represents the most challenging conditions for the adaptive refinement process to solve. We were able to do this by bringing together two new significant technologies:

  1. HFSS Layout automated IC-specific meshing in Ansys HFSS
  2. Ansys Cloud on Microsoft Azure

It is so rewarding to see a problem of this size and complexity solved on Azure, putting this level of HPC power in the hands of engineers when they need it the most.”, says Merrie Williamson, Microsoft VP Azure Apps and Infrastructure. “This is a great example of two partners blending their strengths to serve their joint customers, and I’m eager to see the impact this will make on companies tackling the new wave of IC-design challenges posed by 5G and beyond.”

July 2021

What's New

In Ansys 2021 R2, Ansys HFSS continues to deliver groundbreaking technologies to address 3D IC package design challenges as well as advancements in 5G and autonomous simulation. To learn more, register for the Ansys 2021 R2 HFSS Update webinar.

Phi Plus Meshing
Phi Plus Meshing

Phi Plus meshing technology brings unrivaled speed and robustness to solving 3D IC package challenges, especially geometries like wire bond type packages, and is HPC enabled. Additionally, Phi Plus utilizes the Mesh Fusion algorithm at the component level, with parallel processing for faster solutions.

Ansys HFSS SBR+ for 3D dielectrics
Ansys HFSS SBR+ for 3D Dielectrics

HFSS SBR+, as an asymptotic electromagnetic solver, enables efficient simulation of non-uniform, thick 3D dielectric structures such as antenna radomes, electromagnetic lenses, and plastic automotive bumper fascia. This new feature expands the range of designs that can be modeled with the shooting and bouncing ray technique of HFSS SBR+.

5G mmWave Antenna Far Field Processing
5G mmWave Antenna Far Field Processing

This feature provides increased speed for far field antenna post processing. It is seful for multi-port antenna simulations such as radar and 5G mmWave array antenna design. In a 5G application, this allows you to quickly extract the simulation’s far field data from a large array antenna analysis and perform massive MIMO calculations.