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ZF - Solder Joint Digital Twin

Customer Spotlight Webinar With ZF

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About this Webinar

With the ever-increasing complexity and pressure to reduce development time and resources, simulation techniques have been developed at ZF to predict the reliability of solder joints within its ZF electronic developments. Adopting a risk-based approach, Ansys Sherlock is used to detecting PCB components with reliability concerns and determine the corresponding board-level lifetime performance. In system-level analysis, complex stress interactions are considered to assess the reliability of an electronic product in its operating environment in consideration of failure mechanisms of individual component interconnections. These Digital Twins help ZF to understand the physics of failure and to make design and material decisions early in the development process, which enables rapid validation against customer performance requirements. 

Application Fields

Electronics Reliability, PCB Engineering, Virtual Development and Validation


John Coates - Chief Engineer, Core Technology Engineering, ZF Electronics & ADAS