Simulating Deformation Due to Heating in Printed Circuit Board - Demo

Determining possible deformation by heat in a printed curcuit board before the design is finalized will hellp avoid failure during operation. This step-by-step demonstrates how ANSYS Mechanical simulation can predict thermal deformation of a PCB using ECAD data long before manufacturing.
I want to receive updates and other offers from Ansys and its partners. I can unsubscribe at any time. ANSYS Privacy Notice