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Ansys at DesignCon 2024    

Booth #819

Join us at DesignCon from January 31- February 1, 2024, at the Santa Clara Convention Center, Santa Clara, CA. Please stop by our booth, #819, for presentations and demonstrations.

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Simulation from Silicon to Satellite

For 5G, autonomous vehicles, smart products, homes, cities, and factories to become reality, the enabling electronics technologies must deliver unprecedented levels of reliability. Engineers face immense product reliability and performance challenges with innumerable sensors, microprocessors, and communication components. Engineering simulation is critical in helping high-tech companies deliver innovative and reliable products that achieve and exceed their target performance, energy efficiency, cost, and speed-to-market goals.

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    Optimize Power, Performance and Cost
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    Increase Product Reliability
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    Accelerate Innovation
Silicon to the city
professor-eric-bogatin-headshot.jpg

Join us at Ansys Booth #819 for a meet and greet with guest speaker, Professor Eric Bogatin, University of Colorado, Boulder!

Presentation Title: Three Cool Demos of SI Effects with HFSS

Thursday, February 1st | 12:30 PM - 2:00 PM

Wednesday, January 31

TimeTitlePresenter
11:30 AMTowards a Comprehensive, Multiphysics Design Solution for Co-packaged OpticsRaha Vafaei, Lead Product Marketing Manager, Ansys
1:30 PM2024 R1 Updates - ElectronicsJuliano Moligni, Lead Product Manager, Ansys
2:30 PMMachine Learning Solver as a ServiceKliment Minchev, R&D Engineer II, Ansys
3:30 PMThe Simulation Magic of 3D-IC Heterogenous Integration: Multiscale, Multi-Stage, MultiphysicsLang Lin, Principal Product Manager, Ansys

Thursday, February 1

TimeSpeakerPresenter
11:30 AMTowards a Comprehensive, Multiphysics Design Solution for Co-packaged OpticsJames Pond, Ansys Fellow, Ansys
1:30 PMThree Cool Demos of SI Effects with HFSSEric Bogatin, Professor, University of Colorado, Boulder
2:30 PMMachine Learning Solver as a ServiceKliment Minchev, R&D Engineer II, Ansys
3:30 PMThe Simulation Magic of 3D-IC Heterogeneous Integration: Multiscale, Multi-Stage, MultiphysicsLang Lin, Principal Product Manager, Ansys

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