LS-DYNA Conference & Users Meeting

Sessions

• Session 1: Multiphysics Solutions in the Healthcare Sector using LS-DYNA

  • In recent years, the importance of high-fidelity simulations in the healthcare sector has received increased attention due to changes in the regulatory bodies. These changes encourage the use of simulation to back bench results. The expectations are that simulation supports and, in some cases, replace laboratory testing as models improve. In the long-term, simulation could also replace some in-vivo testing. Of the broad spectrum of healthcare applications, LS-DYNA has recently focused on those that involve cardiac modeling. These problems are all Multiphysics in nature and present challenges like reproducing the realistic physiological responses of the human body. The goal is to provide a tool to simulate a large population of healthy and diseased patients to test medical devices. These devices include pacemakers, prosthetic heart valves, and aortic stent grafts. In the latest releases of LS-DYNA, several new features support the statement that LS-DYNA is fully committed to helping the healthcare sector. From the Fluid Structure Interaction (FSI) solver to the first release of the Electrophysiology module (EP) in R12, there's a steady increase in features and improvements. This talk will present the latest additions showcasing applications and future roadmaps. Some developers will be present in the audience, providing an excellent opportunity for an in-person technical discussion.
  • Presenter: Dr. Facundo Del Pin, Principal R&D Engineer

• Session 2: Modeling battery abuse in LS-DYNA

  • Safety is essential in developing large-format, energy-dense, lithium-ion (Li-ion) batteries used in electrified vehicles. Computer-aided engineering (CAE) tools that predict the response of a Li-ion battery pack to various abusive conditions can support analysis during the design phase and reduce the need for physical testing. In particular, simulations of the multi-physics response of external or internal short circuits can lead to optimized system designs for automotive crash scenarios. We will present the battery abuse modeling capabilities of LS-DYNA.
  • Presenter: Pierre L'Eplattenier, Principal R&D Engineer

• Session 3: Advances of multi-scale multi-physics and multi-stage modeling in LS-DYNA

  • CAE software is experiencing a revolutionary change from traditional finite element simulation to multi-scale multi-physics and multi-stage modeling. This presentation introduces several emerging techniques such as particle methods, robust discontinuity approach, RVE analysis, machine learning, and co-simulation for advanced virtual product development, processes, and performance analysis. We'll discuss the opportunities and challenges of applications in both old and new areas. Following this overview, we'll showcase the applications pertinent to the semiconductor industry like solder reflow, wafer back grinding, and multi-scale drop testing. This demonstrates the spectrum of problems in semiconductor manufacturing and reliability where LS-DYNA solutions are widely applied.
  • Presenter: CT Wu, Sr. Principal R&D Engineer & Dr. Arkaprabha Sengupta, Lead Application Engineer

• Session 4: Machine Learning Approach to Simulate Injection-Molded Composites

  • We present a data-driven multiscale modeling approach that integrates the injection molding simulation, material homogenization, and mechanistic machine learning technique. Released in LS-DYNA R14 and LS-Prepost 4.10, this new simulation feature is quite promising for the design and analysis of injection-molded short-fiber-reinforced composite structures.
  • Presenter: Dr Haoyan Wei, R&D Engineer

• Session 5: Recent Developments for Aerospace and Defense Applications

  • This presentation includes recent developments and examples for aerospace and defense applications, emphasizing transient, significant deformation problems. We'll cover Lagrangian, Eulerian, and arbitrary Lagrangian-Eulerian applications.
  • Presenter: Dave Benson, Ansys Fellow

• Session 6: What High-Performance Computing (HPC) Provides

  • In this presentation, we will give an overview of the new features of improving runtime, detecting bottlenecks, and troubleshooting clusters. Ansys and Cloud providers share the performance of the latest CPUs, compilers, and MATH libraries, validation, scaling study, and tuning on cloud computing.
  • Presenter: Jason Wang, Sr. Principal R&D Engineer

• Session 7: New features for Implicit Analysis and Material Models

  • New features for Implicit Analysis and Material Models
  • See an update about the latest developments in linear and nonlinear implicit solution schemes and sophisticated material models. Plus, we'll show new keywords, enhancements, and potential accuracy, efficiency, and robust improvements.
  • Presenter: Dr. Tobias Erhart, Consultant