Helping Nokia engineers
transform 5G and beyond
Here you'll find valuable resources, so you're more productive with simulation workflows. We’re here to help you manage the complexities of product development and deliver game-changing insights by empowering you with the right tools and resources.
Nokia presents internal workflow
Installed Performance of 5G Massive MIMO Phased Antenna Array: Effects of Camouflage Tube-Structure
Presentation by Tomi Haapala, Antenna System Architect, Nokia Networks
IDC & Ansys: How to Accelerate Product Innovations and Successfully Scale with AI
In this presentation, IDC, Ansys, Infineon and Monolith discuss:
- How AI impacts product innovation in your business and the type of success users of AI already have achieved
- How to introduce and scale for AI innovation in organizations
- Key learnings from organizations leading in the field of AI.
Solutions
How to Design Base Station (or Microcell) Antenna Arrays for 5G Wireless Networks
In this White Paper you will discover a step-by-step workflow outlining hybrid solutions in HFSS that will help you create high-fidelity designs of antennas, arrays and microcells.
Ansys HFSS Blog Articles
5G Antenna Technology for Smart Products
Pivotal Commware designs the next generation of these beamforming antennas or cellular base stations and other applications, at a fraction of the cost of existing methods. The company’s engineers use Ansys HFSS to create antenna designs that meet design requirements on the first or second pass, substantially reducing the time required to bring new antennas to market in this highly competitive industry.
5G Antenna Webinars
Ansys Topology Optimization - Reinvent your product development process
A first-ever interactive topology optimization tool leveraging the gold standard of Ansys simulation to uncover design solutions through shape optimization, without the computational cost.
Resources
Optimize and Predict Electronics Reliability
Best practices for ensuring and predicting electronics reliability require comprehensive multi-physics simulations. Ansys provides reliability success by developing solutions and workflows that overcome today’s most significant simulation and design challenges.
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Extract Detailed Geometries from any ECAD file
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Perform Complex Multiphysics Analyses
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Predict Time to Failure Before Prototyping
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Implement Automation and Optimization
Featured Key Webinars
Ansys Icepak - Cooling Simulation Software for Electronic Components
Ansys Icepak is a CFD solver for electronics thermal management. It predicts airflow, temperature, and heat transfer in IC packages, PCBs, electronic assemblies/enclosures, and power electronics.
Beat The Heat with Ansys Icepak
Preventing PCB Failures Due to Thermal and Mechanical Stresses
The potential for failure in electronic systems due to thermal and mechanical loading of printed circuit boards (PCBs) is escalating due to steadily increasing power dissipation combined with smaller board sizes. It has not been practical to accurately simulate PCB deformation because too much computing power is required to solve a finite element model containing the whole board geometry. A new Ansys multiphysics methodology overcomes this problem by simplifying the PCB geometry while tracking the material properties of each segment of the board. Engineers can use this new methodology to accurately predict the deformation generated by thermal-mechanical stresses, random vibration, and mechanical shock within the timeframe of a typical design iteration.
Electro-Thermal Analysis Using Icepak in Ansys Electronics Desktop
With the native integration of Ansys Icepak into the Ansys Electronics Desktop, Ansys users benefit from a highly streamlined electromagnetic-thermal analysis workflow that promotes better collaboration between electrical and thermal engineers. With seamless coupling between Icepak and the Ansys Electromagnetic (EM) tool suite, accurate and detailed heat losses, determined by EM calculations, can be easily included in the thermal calculations via intuitive right-click operations.
Watch an overview of Ansys AEDT Icepak and get a panoramic feel for performing electromagnetic-thermal analysis using Ansys Electronics Desktop.
Ansys SIwave - Signal Integrity, Power Integrity, and EMI Analysis for PCB Design
Ansys SI Wave is a specialized tool for power integrity, signal integrity, and EMI analysis of IC packages and PCBs. It solves power delivery systems and high-speed channels in electronic devices.
Electromigration Analysis with SIwave
224 Gbps or Bust: How Samtec Leverages Ansys HFSS for High-Speed Interconnect Design
In today’s real world, the underpinning of global communications networks is the signal channels routing data at the fastest rates possible. Since 2020, 224 Gbps channel data rates have been a reality. While years from production, the race is developing 224 Gbps semiconductor and high-speed interconnect solutions.
De-Risking High-Speed Serial Links from On-Chip Electromagnetic Crosstalk and Power Distribution Issues
High speed/frequency RF transceivers and SoCs for 5G, mobile, AI, automotive, and networking applications are increasingly susceptible to electromagnetic (EM) cross-coupling effects. Learn how on-chip EM solutions can accurately capture all electromagnetic phenomena for mitigating the risk of electromagnetic crosstalk-induced performance degradation and failure in high-speed, high-frequency, and low-power RFICs and SoCs. See how NVIDIA addresses high-speed serial link design challenges that come with denser routings and aggressive floorplans, including on-chip EM crosstalk and large di/dt induced supply noise.
Resources
Ansys Minerva - Simulation process and data management (SPDM) made easy
Boost engineering productivity with efficient simulation process and data management.
With Ansys Minerva, you’ll be able to secure critical simulation data, provide process and decision support, and deliver immediate benefits by connecting powerful simulation and optimization solutions to your existing ecosystem of tools and processes. Because Ansys Minerva is available on-premise and cloud deployment, connecting team members regardless of geography and functional silos.
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Capture and Manage Knowledge
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Vendor-Neutral Architecture
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Collaborate Across the Entire Organization
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Scalable and Configurable
Get in touch with your Ansys Team
Resources
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See What Ansys Can Do For You
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