2020

Webinar

SI/PI/Thermal Challenges and opportunities of advanced packaging from 2.5D to 3D

ANSYS2020 Innovation Conference Keynote SI/PI/Thermal Challenges and opportunities of advanced packaging from 2.5D to 3D.

創意電子
HSTD 副處長
陳佳良博士

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SI/PI/Thermal Challenges and opportunities of advanced packaging from 2.5D to 3D

SHARE THIS WEBINAR

See What Ansys Can Do For You

See What Ansys Can Do For You

Contact us today

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