2020

Webinar

SI/PI/Thermal Challenges and opportunities of advanced packaging from 2.5D to 3D

ANSYS2020 Innovation Conference Keynote SI/PI/Thermal Challenges and opportunities of advanced packaging from 2.5D to 3D.

創意電子
HSTD 副處長
陳佳良博士

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SI/PI/Thermal Challenges and opportunities of advanced packaging from 2.5D to 3D

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