Power, performance, area (PPA) and reliability are key metrics in an era of semiconductors driven by:
- Artificial intelligence (AI)
- Autonomous systems
- Augmented/virtual reality (AR/VR)
- High-performance computing
Engineers use these metrics to design semiconductors that meet the ubiquitous connectivity, low latency and fast data rates needed to process data at the edge and send it around a network.
To achieve this performance, engineers need to leverage low-power fin field effect transistor (FinFET) and 2.5/3D integrated circuit (2.5D/3D-IC) packaging technologies.
However, the interactions of multiple physics pose significant challenges when designing semiconductors for high-performance applications. Some of these interactions include the impact of:
- Power on thermal profiles
- Thermal profiles on reliability
- Power-noise on timing
- Electromagnetic cross-talk on performance
Traditional, margin-based siloed methodologies cannot accurately model the cross-coupling multiphysics effects that can cause silicon failures.
As a result, engineers need multiphysics simulations to ensure the reliability and performance of these complex electronic systems. These simulations enable engineers to capture various failure mechanisms and ensure first-time product success.
Multiphysics Simulations Enable Semiconductor Design Success
Variability has become the new enemy of advanced technology nodes. It takes on many forms, including variability in:
- Process due to small geometries
- Voltage drop due to changing workloads
- Current distribution due to electromagnetic effects
- Temperature due to self-heating and Joule heating
These variabilities amplify multiphysics problems that directly impact silicon performance. As a result, margin-based siloed simulation methodologies fail to design the highest performing silicon chips.
However, ANSYS’ comprehensive chip, package and system multiphysics solutions are optimized to help engineers discover and solve these issues to achieve the required PPA and reliability goals.
To learn more, watch the video below. Or join ANSYS at the Design Automation Conference (DAC) to attend discussions on:
- Addressing Voltage Variability and Timing Challenges in Advanced FinFET Designs
- Multiphysics Signoff for Chip, Package and System
- De-risking High Speed Designs from Electromagnetic Cross-talk Issues
- Design Innovation Through Multiphysics Simulation