ANSYS 19.2 Release Highlights

Designing Consumer Products for a 5G Network Requires Multiphysics Simulations

A temperature map from ANSYS Icepak

Designing consumer products for the 5G network will be tricky.

These devices will operate at a higher frequency and will be subjected to larger signal power — in both magnitude and distribution densities. This results in your device experiencing an increased heat load.

Cell phones and other consumer products get hot enough as it is. Last week a call with family nearly burned my fingerprints off. Increasing these loads without risking the device’s electronics — or my fingers — will be challenging.

Multiphysics simulations can ensure our consumer products on the 5G network will feel as cool as they look.

How Multiphysics Simulations Improve the Design of Consumer Products on the 5G Network

A Vector plot form ANSYS Icepak.

When you design consumer products for the 5G network, heat is the enemy.

It degrades the product’s performance and reliability.

To address this heat, you need to analyze the electrothermal and mechanical characteristics of the printed circuit board (PCB).

Multiphysics simulations can calculate power loss across the PCB while considering all its components and heatsinks. These simulations predict whether the temperatures mapped onto the integrated circuit (IC) are within safe operating limits. This data is then used to predict the PCB’s overall reliability.

ANSYS helps you perform multiphysics simulations of these electronic components. The software enables you to determine your electromagnetic losses (heat sources) and predict how they contribute to the system’s performance. From there, you can use the software to mitigate the heat coming from the PCB using optimization tools.

To learn more how to use ANSYS software to optimize electronic components, read the white paper Electrothermal Mechanical Stress Reference Design Flow for Printed Circuit Boards and Electronic Packages, or join Charlotte Blair, lead application engineer at ANSYS, for her talk at EDI CON on Profiling Heat with an Integrated Coupled Electrothermal Simulation.