Theresa Duncan

For the 2023 R2 software release, we’ve made substantial updates across the Fluids product collection.

The Ansys Reliability Engineering Services team delivers innovative, practical solutions to electronics reliability challenges facing many industries today.

Level Up is back with its third annual engineering conference focused on connecting current Ansys users with R&D experts, peers, and industry leaders in simulation.

Ansys Minerva is purpose-built to streamline and accelerate the process of identifying and eliminating failure modes across complex electronic product systems.

Major advancements have been made in this release to close the reliability loop among all Ansys electronics reliability products, notably Ansys Icepak, Ansys LS-DYNA, Ansys Mechanical, and Ansys Sherlock.

Learn all about the latest software updates to the Ansys Electronics Reliability product portfolio, which includes Sherlock, Mechanical, LS-DYNA, and Icepak.

Register for Level Up 2.0 to learn about Ansys Mechanical, Ansys’ finite element analysis simulation software that enables users to solve complex structural engineering problems.

See how the latest updates in Ansys Sherlock and electronics reliability in Ansys 2021 R2 help users deliver on their product development goals.

Learn how Ansys' team of reliability experts can work one-on-one with you to develop customized reliability solutions for your specific product development challenges.

Learn why meshing is an important step in performing an accurate Finite Element Analysis (FEA) simulation and get tips on how to prep your CAD geometry for meshing.

Learn how Ansys' trace reinforcement workflow can significantly improve printed circuit board (PCB) model fidelity at the board level.

Hybrid pulse power characterization (HPPC) testing can be applied to determine the dynamic performance over the usable voltage ranges of a battery cell — resulting in accurate battery parameter identification to create robust battery models for simulation.

Ansys has extended its Electronics Reliability solutions to address a wider variety of electrical, thermal and mechanical reliability issues.

Use simulation in combination with physical testing to virtually guarantee your electronics’ reliability.

SAE J3168 describes a baseline process to assess board-level reliability and durability of electronics with respect to five major potential failure mechanisms.

Composites can be exceedingly difficult to simulate, usually requiring multiple simulation tools to solve and model composite layers and properties.

The Ansys Mechanical Level Up virtual conference takes skill building and professional development to the next level.

Learn how tire simulation optimizes winter tire design for better handling in the snow and ice.

Learn how accelerated life testing can provide faster results for electronic failure analysis.

Learn how to prevent solder fatigue.