4th Annual ANSYS Innovation Conference

May 8, 2019

9:00 AM - 3:30 PM (EST)

REGISTER ›

Venue:
Brookstreet Hotel
525 Legget Drive
Ottawa, ON K2K 2W2
Canada

Contact:
Krista Loeffler

Designing advanced driver assistance systems (ADAS), Internet of Things (IoT), 5G and other high-performance digital systems are driving extreme integration of radio frequency (RF) and wireless communications. Simulation plays a key role in creating reliable, optimized wireless communications, 5G workflows and components — let's explore how!

Join us as we return to Ottawa for our 4th Annual ANSYS Innovation Conference on May 8, 2019! This one-day conference will provide detailed insight into how leading companies are utilizing simulation to advance their product development. We will bring together ANSYS users, partners, developers, and industry experts for networking, learning, and sharing of new ideas.

What You Will Learn

  • Experience new simulation capabilities that provide unprecedented design insight as they speed your time to market
  • Incorporate various productivity enhancement tools and techniques into your engineering department’s workflow
  • Gain insights into 5G system development with physics-based simulation and cover critical design issues, such as antenna performance, semiconductor reliability, and thermal integrity
  • Identify signal integrity issues early in the design cycle for electronics IC packages, PCBs, connectors and other complex interconnects
  • Modify antenna design, predict antenna efficiency and the overall thermal and EM performance of the product based on electromagnetic and thermal coupling solutions

Agenda

Time Topic
8:30 AM - 9:00 AM Registration and Breakfast
9:00 AM - 9:15 AM ANSYS Welcome
Daniel Vasalani, Regional Sales Director, ANSYS
9:15 AM - 9:45 AM Keynote Presentation
Morris Repeta, Principle Engineer/Wireless Manager, Huawei
9:45 AM - 10:00 AM Networking Break
  TRACK 1: RF Antenna/Microwave TRACK 2: Signal & Power Integrity
10:00 AM - 10:45 AM ANSYS Simulation Vision & Workflow for 5G
Laila Salman, Lead Technical Specialist, ANSYS
SI/PI Simulation Automation: A Growing Opportunity
Isaac Waldron, Lead Application Engineer, ANSYS
10:45 AM - 11:30 AM Dual-Polarized Wideband RET Multi-Beam Base Station Antenna
Linping Shen, Senior Antenna Engineer, CCI
Signal Integrity and Power Integrity analysis with EDA tools
Kaisheng Hu, Senior Signal Integrity Engineer, Ciena
11:30 AM - 12:00 PM The Usability of ANSYS 3D Components in Modeling
Electrically Large Environments with SBR+

Laila Salman, Lead Technical Specialist, ANSYS
EMI Scanner and Electromigration in SIwave 2019 R1
Isaac Waldron, Lead Application Engineer, ANSYS
12:00 PM - 1:00 PM Lunch
1:00 PM -1:45 PM ANSYS Mechanical for Electronics Design
Jiaping Zhang, Lead Application Engineer, ANSYS
SIwave and Icepak in ANSYS Electronics Desktop
Isaac Waldron, Lead Application Engineer, ANSYS
1:45 PM - 2:30 PM mm-Wave Homogenous Flat Lens Antenna System
Exploiting Mainstream PCB Process for 5G Access Point

Wenyao Zhai, RF/Microwave/mmWave Design Engineer, Huawei

Semtech
Ahmed Abdellatif, Senior Packaging Engineer, Semtech

2:30 PM - 2:45 PM Networking Break
2:45 PM - 3:30 PM 2019 New Technology
Jiaping Zhang, Lead Application Engineer, ANSYS