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Ansys Icepak in Ansys Electronics Desktop Advanced

Course Overview

Ansys Icepak provides flow and thermal management solutions for many types of electronic design applications. The primary goal of this course is to build upon the content discussed in the 'Ansys Icepak in Ansys Electronics Desktop Getting Started' course and cover advanced features of Ansys Icepak in the Ansys Electronics Desktop (AEDT) user environment. Students will be introduced to the world of electronics thermal modeling through a combination of lectures, workshops, and examples/demonstrations.

Prerequisites

Teaching Method

Lectures and computer practical sessions to validate acquired knowledge.

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Learning Outcome

Following completion of this course, you will be able to:

  • Import MCAD geometry into AEDT Icepak and use defeaturing tools
  • Model an inclined PCB. Perform electrothermal analysis using HFSS 3D Layout - AEDT Icepak workflow
  • Use advanced meshing techniques
  • Perform a transient simulation
  • Setup and perform Optimetrics analysis
  • Learn about special applications like MRF modeling, turbulence models, toolkits, and ACTs

Available Dates

Currently, no training dates available

Learning Options

Training materials for this course are available with an Ansys Learning Hub Subscription. If there is no active public schedule available, private training can be arranged. Please contact us.

Agenda

This is a 2-day classroom course covering both tutorials and workshops. For virtual training, this course is covered over 5 x 2-hour sessions with lectures only.

Virtual Classroom Session 1

  • Lecture: Advanced MCAD import
  • Workshop: SpaceClaim - AEDT Icepak workflow

Virtual Classroom Session 2

  • Lecture: Advanced ECAD import
  • Workshop: HFSS 3D Layout - AEDT Icepak workflow

Virtual Classroom Session 3

  • Lecture: Advanced meshing
  • Workshop: Advanced meshing

Virtual Classroom Session 4

  • Lecture: Transient simulations
  • Lecture: Optimetrics
  • Workshop: Transient simulation
  • Workshop: Optimetrics

Virtual Classroom Session 5

  • Lecture: Special applications (Advanced Fan Modeling, Turbulence Models, Toolkits and ACTs)

Topics Covered
  • MCAD import and defeaturing
  • Inclined PCB modeling
  • HFSS 3D Layout - AEDT Icepak workflow for electrothermal analysis
  • Manual meshing
  • Transient simulations
  • Optimetrics
  • Special applications (Advanced fan modeling, Turbulence models, Toolkits and ACTs)