Thermal and Structurally Robust Electronics Design

With unparalleled breadth and depth in multiphysics simulation, ANSYS offers a comprehensive solution for ensuring the thermal and structural robustness of automotive electronics.

  • Thermal management, based on the world-leading ANSYS Fluent CFD solver, the fastest and most-validated solution on the market, gives you:
    • The ability to capture all complex geometries
    • The ability to import ECAD geometries
    • The ability to couple with electronic and structural (FEA) analysis tools
  • Electro-thermal-structural multiphysics features include:
    • Drag-and-drop multiphysics couplings
    • Flexible coupling methods
    • Fast, accurate data mapping
    • Automated solver coordination
    • Deep electromagnetics, fluid, and structural solver technology and capabilities

SIWave power delivery results

SIWave power delivery results

Icepak temperature results

Icepak temperature results

Mechanical stress results

Mechanical stress results

Electronics Design