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Previous Releases with Tested System Information | ANSYS Web Page Solutions

Previous Releases with Tested System Information ANSYS 2020 R1 Certified and Supported Computing Platforms ANSYS 2020 R1 - Platform Support by Application / Product (PDF) ANSYS 2020 R1 - 3Dconnexion Devices Certification (PDF) ANSYS 2020 R1 - Browser Support (PDF) ANSYS 2020 R1 - CAD Support (PDF) ANSYS 2020 R1 - Graphics Cards Tested (PDF) ANSYS 2020 R1 - GPU Accelerator Capabilities (PDF) ANSYS 2020 R1 - Job Schedulers and Queuing Systems Support (PDF) ANSYS 2020 R1 - Message Passing Interface Support for Parallel Computing (PDF) ANSYS 2020 R1 - Remote Display and Virtual Desktop Support (PDF) ANSYS 2019 R3 Certified and Supported Computing Platforms ANSYS 2019 R3 - Browser Support (PDF) ANSYS 2019 R3 - CAD Support (PDF) ANSYS 2019 R3 - 3Dconnexion Devices Certification (PDF) ANSYS 2019 R3 - Graphics Cards Tested (PDF) ANSYS 2019 R3 - GPU Accelerator Capabilities (PDF) ANSYS 2019 R3 - Job Schedulers and Queuing Systems Support (PDF) ANSYS 2019 R3 - Message Passing Interface Support for Parallel Computing (PDF) ANSYS 2019 R3 - Platform Support by Application / Product (PDF) ANSYS 2019 R3 - Remote Display and Virtual Desktop Support (PDF) ANSYS 2019 R2 Certified and Supported Computing Platforms ANSYS 2019 R2 - Browser Support (PDF) ANSYS 2019 R2 - CAD Support (PDF) ANSYS 2019 R2 - 3Dconnexion Devices Certification (PDF) ANSYS 2019 R2 - Graphics Cards Tested (PDF) ANSYS 2019 R2 - GPU Accelerator Capabilities (PDF) ANSYS 2019 R2  - Message Passing Interface Support for Parallel Computing (PDF) ANSYS 2019 R2 - Job Schedulers and Queuing Systems Support (PDF) ANSYS 2019 R2 - Platform Support by Application (PDF) ANSYS 2019 R2 - Remote Display and Virtual Desktop Support (PDF) ANSYS 2019 R1 Certified and Supported Computing Platforms ANSYS 2019 R1 - Browser Support (PDF) ANSYS 2019 R1 - CAD Support (PDF) ANSYS 2019 R1 - 3Dconnexion Devices Certification (PDF) ANSYS 2019 R1 - Graphics Cards Tested (PDF) ANSYS 2019 R1 - GPU Accelerator Capabilities (PDF) ANSYS 2019 R1 - Message Passing Interface Support for Parallel Computing (PDF) ANSYS 2019 R1 - Job Schedulers and Queuing Systems Support (PDF) ANSYS 2019 R1 - Platform Support by Application (PDF) ANSYS 2019 R1 - Remote Display and Virtual Desktop Support (PDF) ANSYS 19.2 Certified and Supported Computing Platforms ANSYS 19.2 - Browser Support (PDF) ANSYS 19.2 - CAD Support (PDF) ANSYS 19.2 - 3Dconnexion Devices Certification (PDF) ANSYS 19.2 - Graphics Cards Tested (PDF) ANSYS 19.2 - GPU Accelerator Capabilities (PDF) ANSYS 19.2 - Message Passing Interface Support for Parallel Computing (PDF) ANSYS 19.2 - Job Schedulers and Queuing Systems Support (PDF) ANSYS 19.2 - Platform Support by Application (PDF) ANSYS 19.2 - Remote Display and Virtual Desktop Support (PDF) ANSYS 19.1 Certified and Supported Computing Platforms ANSYS 19.1 - Browser Support (PDF) ANSYS 19.1 - CAD Support (PDF) ANSYS 19.1 - 3Dconnexion Devices Certification (PDF) ANSYS 19.1 - Graphics Cards Tested (PDF) ANSYS 19.1 - GPU Accelerator Capabilities (PDF) ANSYS 19.1 - Message Passing Interface Support for Parallel Computing (PDF) ANSYS 19.1 - Job Schedulers and Queuing Systems Support (PDF) ANSYS 19.1 - Platform Support by Application (PDF) ANSYS 19.1 - Remote Display and Virtual Desktop Support (PDF) ANSYS 19.0 Certified and Supported Computing Platforms ANSYS 19.0 - Browser Support (PDF) ANSYS 19.0 - CAD Support (PDF) ANSYS 19.0 - 3Dconnexion Devices Certification (PDF) ANSYS 19.0 - Graphics Cards Tested (PDF) ANSYS 19.0 - GPU Accelerator & Co-Processor Capabilities (PDF) ANSYS 19.0 - Message Passing Interface Support for Parallel Computing (PDF) ANSYS 19.0 - Job Schedulers and Queuing Systems Support (PDF) ANSYS 19.0 - Platform Support by Application (PDF) ANSYS 19.0 - Remote Display and Virtual Desktop Support (PDF) ANSYS 18.2 Certified and Supported Computing Platforms ANSYS 18.2 - Browser Support (PDF) ANSYS 18.2 - CAD Support (PDF) ANSYS 18.2 - 3Dconnexion Devices Certification (PDF) ANSYS 18.2 - Graphics Cards Tested (PDF) ANSYS 18.2 - GPU Accelerator & Co-Processor Capabilities (PDF) ANSYS 18.2 - Message Passing Interface Support for Parallel Computing (PDF) ANSYS 18.2 - Job Schedulers and Queuing Systems Support (PDF) ANSYS 18.2 - Platform Support by Application (PDF) ANSYS 18.2 - Remote Display and Virtual Desktop Support (PDF) ANSYS 18.1 Certified and Supported Computing Platforms ANSYS 18.1 - Browser Support (PDF) ANSYS 18.1 - CAD Support (PDF) ANSYS 18.1 - 3Dconnexion Devices Certification (PDF) ANSYS 18.1 - Graphics Cards Tested (PDF) ANSYS 18.1 - GPU Accelerator & Co-Processor Capabilities (PDF) ANSYS 18.1 - Message Passing Interface Support for Parallel Computing (PDF) ANSYS 18.1 - Job Schedulers and Queuing Systems Support (PDF) ANSYS 18.1 - Platform Support by Application (PDF) ANSYS 18.1 - Remote Display and Virtual Desktop Support (PDF) ANSYS 18.0 Certified and Supported Computing Platforms ANSYS 18.0 - Browser Support (PDF) ANSYS 18.0 - CAD Support (PDF) ANSYS 18.0 - 3Dconnexion Devices Certification (PDF) ANSYS 18.0 - Graphics Cards Tested (PDF) ANSYS 18.0 - GPU Accelerator & Co-Processor Capabilities (PDF) ANSYS 18.0 - Message Passing Interface Support for Parallel Computing (PDF) ANSYS 18.0 - Job Schedulers and Queuing Systems Support (PDF) ANSYS 18.0 - Platform Support by Application (PDF) ANSYS 18.0 - Remote Display and Virtual Desktop Support (PDF) ANSYS 17.2 Certified and Supported Computing Platforms ANSYS 17.2 - Browser Support (PDF) ANSYS 17.2 - CAD Support (PDF) ANSYS 17.2 - 3Dconnexion Devices Certification (PDF) ANSYS 17.2 - GPU Accelerator and Co-Processor Capabilities (PDF) ANSYS 17.2 - Graphics Cards Tested (PDF) ANSYS 17.2 - Interconnects Support (PDF) ANSYS 17.2 - Job Schedulers & Queuing Systems Support (PDF) ANSYS 17.2 - Platform Support by Application (PDF) ANSYS 17.2 - Remote Display Support (PDF) ANSYS 17.1 Certified and Supported Computing Platforms ANSYS 17.1 - Browser Support (PDF) ANSYS 17.1 - CAD Support (PDF) ANSYS 17.1 - Graphics Cards Tested (PDF) ANSYS 17.1 - Interconnects Support (PDF) ANSYS 17.1 - Job Schedulers & Queuing Systems Support (PDF) ANSYS 17.1 - Platform Support by Application (PDF) ANSYS 17.1 - Remote Display Support (PDF) ANSYS 17.0 Certified and Supported Computing Platforms ANSYS 17.0 - Browser Support (PDF) ANSYS 17.0 - CAD Support (PDF) ANSYS 17.0 - Graphics Cards Tested (PDF) ANSYS 17.0 - Interconnects Support (PDF) ANSYS 17.0 - Job Schedulers & Queuing Systems Support (PDF) ANSYS 17.0 - Platform Support by Application (PDF) ANSYS 17.0 - Remote Display Support (PDF) ANSYS 16.2 Certified and Supported Computing Platforms ANSYS 16.2 - Browser Support (PDF) ANSYS 16.2 - CAD Support (PDF) ANSYS 16.2 - Graphics Cards Tested (PDF) ANSYS 16.2 - Remote Display Support (PDF) ANSYS 16.2 - Interconnects Support (PDF) ANSYS 16.2 - Platform Support by Application (PDF) ANSYS 16.1 Certified and Supported Computing Platforms ANSYS 16.1 - Browser Support (PDF) ANSYS 16.1 - CAD Support (PDF) ANSYS 16.1 - Graphics Cards Tested (PDF) ANSYS 16.1 - Remote Display Support (PDF) ANSYS 16.1 - Interconnects Support (PDF) ANSYS 16.1 - Platform Support by Application (PDF) ANSYS 16.0 Certified and Supported Computing Platforms ANSYS 16.0 - Browser Support (PDF) ANSYS 16.0 - CAD Support (PDF) ANSYS 16.0 - Electronics Support (PDF) ANSYS 16.0 - Graphics Cards Tested (PDF) ANSYS 16.0 - Remote Display Support (PDF) ANSYS 16.0 - Interconnects Support (PDF) ANSYS 16.0 - Platform Support by Application (PDF)

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Site Map | Ansys

Ansys.com Site Map Products | Free Trials Fluids Ansys BladeModeler Ansys CFX Ansys Chemkin-Pro Ansys Ensight Ansys FENSAP-ICE Ansys Fluent Ansys Forte Ansys Model Library Ansys Polyflow Ansys Turbo Tools Ansys TurboGrid Ansys Vista TF Structures Ansys Act Ansys Additive Print Ansys Additive Suite Ansys Aqwa Ansys Autodyn Ansys LS-DYNA Ansys Mechanical Ansys Motion Ansys nCode DesignLife Ansys Sherlock Semiconductors Ansys Exalto Ansys Path FX Ansys Pathfinder Ansys Pharos Ansys PowerArtist Ansys RaptorX Ansys RedHawk Ansys RedHawk-SC Ansys Totem Ansys Variance FX Ansys VeloceRF Electronics Ansys Electronics Enterprise Ansys Electronics Pro 2D Ansys HFSS Ansys Icepack Ansys Maxwell Ansys Motor-CAD Ansys Q3D Extractor Ansys SIwave Platform Ansys Cloud Ansys DesignXplorer Ansys High-Performance Computing Ansys Meshing Ansys Minerva Ansys Multiplas Ansys optiSLang Multiphysics Simulation Embedded Software Ansys SCADE Architect Ansys SCADE Display Ansys SCADE LifeCycle Ansys SCADE Solutions for ARINC 661 Ansys SCADE Suite Ansys SCADE Test Ansys SCADE Vision Systems Ansys medini analyze Ansys medini analyze for Cybersecurity Ansys Twin Builder Ansys VRXPERIENCE Materials Ansys GRANTA EduPack Ansys GRANTA MI Enterprise Ansys GRANTA MI Pro Ansys GRANTA Selector Academic Free Student Software Student Support Resource Tools for Educators Academic Blog 3D Design Ansys Discovery Ansys SpaceClaim Optical Ansys OMD Ansys SPEOS Ansys Store Solutions Solutions by Role Engineers Executives IT Professionals Accessibility Licensing Platform Support Simulation Environment Ecosystem On-Demand IT Webcasts On-Demand Cloud Webcasts Technical Enhancements and Customer Support (TECS) Product Designers Managers Professors Students Solutions by Industry Automotive Aerospace & Defense Construction Consumer Goods Energy Healthcare High-Tech Industrial Equipment & Rotating Machinery Materials & Chemical Processing Technology Trends 5G Autonomous Engineering Electrification Support Academic Apache Design Discovery Granta medini Platform Scade SpaceClaim SPEOS and VRXPERIENCE Services Training Ansys Learning Hub Consulting & Professional Services Reliability Engineering Services About Ansys Ansys Advantage Magazine Ansys Blog Business Ethics Contacts & Locations Customer Portal Dimensions Magazine Events Investor Relations News Center Ansys Partner Ecosystem Careers Quality Assurance Ansys Startup Program

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Engineering Simulation Software Products | Ansys Web Page Products

Engineering What's Next Tons of new features and enhancements have been added to Ansys products to improve computer aided engineering (CAE) capabilities, helping you streamline product development life cycles and boost product performance. SEE WHAT'S NEW IN ANSYS 2020 R2 Which Ansys products will best fit your needs? Not sure which solver to choose for your initiative? Whether you’re looking for Advanced Magnetic Modeling, Explicit Dynamics, Fluid- Structure Interaction, Digital Twins and every solution in between…this handy guide will provide a capabilities matrix of Ansys products. DOWNLOAD ANSYS CAPABILITIES MATRIX Products from A - Z Our innovative products are built to meet all your essential business needs -- and evolve as your business needs grow. A | B | C | D | E | F | G | H | I | J | K | L | M | N | O | P | Q | R | S | T | U | V | W | X | Y | Z | A | B | C | D | E | F | G | H | I | J | K | L | M | N | O | P | Q | R | S | T | U | V | W | X | Y | Z | -->

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Data Subject Rights Policy | ANSYS

Last updated 30 April 2018 1. Data Subject Rights. Where ANSYS processes personal data about individuals (including personal data of customers, contacts, employees, other workers and others), certain data protection rights are provided under data protection laws. An individual may exercise these rights by making a request to ANSYS (a "Data Rights Request"). Data subject rights (outlined more fully in Section 9, below) include: 1.1 Access to a copy of the personal data retained by ANSYS; 1.2 Erasure of personal data retained by ANSYS (this right is also referred to as the "right to be forgotten"); 1.3 Ceasing processing activities of personal data by or behalf of ANSYS based on some objection; 1.4 Rectification (correction) of personal data retained by ANSYS; 1.5 Restriction of the processing activities for personal data by ANSYS; 1.6 Portability of personal data from ANSYS to another entity; 1.7 Excluding the individual from automated decision-making by ANSYS; and 1.8 Removing the individual from any direct marketing by ANSYS. The details outlined below describe how ANSYS, as a data controller (the entity determining the purpose and manner in which data is processed), will respond to any Data Rights Requests. 2. Responsibility to respond to a Data Rights Request 2.1 The data controller of an individual's personal data is primarily responsible for responding to a Data Rights Request and for helping the requestor to exercise their rights under applicable data protection laws. For example, where an employee makes a Data Rights Request to ANSYS, ANSYS is the data controller for the personal data held and processed about the employee in the employment relationship. 2.2 Although ANSYS does not currently offer products and services for which ANSYS acts as a data processor, if ANSYS processes an individual's personal data as a data processor, such as on behalf of a customer who is the data controller, ANSYS must promptly inform the data controller of the Data Rights Request and provide reasonable assistance to help the requestor exercise his or her rights in accordance with the data controller's duties under applicable data protection laws. 3. Personal data ANSYS shares with third parties 3.1 If ANSYS shares personal data with third parties (such as data processors), it is ANSYS' responsibility to inform those third parties of any Data Rights Request to rectify, delete, or restrict personal data unless it would involve disproportionate effort or it is impossible. 3.2 If requested, ANSYS must provide details of those third parties to which a requestor's personal data has been disclosed. 4. How to make a Data Rights Request 4.1 Any Data Rights Requests, as outlined by this policy, may be directed to privacy@ansys.com. 4.2 If, as an ANSYS employee, you receive a Data Rights Request from another ANSYS employee, former employee, customer, or others the request should immediately be sent to the ANSYS Data Privacy Officer at privacy@ansys.com, together with the date on which the request was received and any other details provided by the requestor. 4.3 Any questions regarding Data Rights Requests should be directed to the ANSYS Data Privacy Officer at privacy@ansys.com. 5. Verification process 5.1 The Data Privacy Officer or others who may assist in the process will make an initial assessment of any Data Rights Request to assess whether ANSYS is the data controller or a data processor and will verify that the request is valid. Any Data Rights Request must be made by the individual about whom the personal data pertains and verification of identity may be required. 5.1.1 If it is determined that a customer or other third party is the data controller in relation to a Data Rights Request, ANSYS will notify the appropriate data controller of the request as soon as possible and will assist the data controller with complying with such request (in accordance with any contract terms or other obligations outlined by applicable data protection law). 5.1.2 If it is determined that ANSYS is the data controller in relation to a Data Rights Request, the requestor will be contacted in writing to confirm receipt of the request and seek confirmation of identity (if not already validated). 5.2 Where ANSYS is not exempt under applicable data protection laws from fulfilling a Data Rights Request, and following receipt of any further information needed to satisfy the request, ANSYS will respond to the request as outlined below. 6. Exemptions to a Data Rights Request 6.1 A data controller may decline to act on a Data Rights Request if the request is excessive and/or manifestly unfounded (for example because of repeated requests for the same data). Where ANSYS is permitted to decline a request, ANSYS must be able to demonstrate that the request is excessive and/or manifestly unfounded. 6.2 In some cases, specific additional exemptions may apply. Where specific exemptions apply to particular Data Subject Rights, these exemptions are more fully explained below. 6.3 If ANSYS is exempt from the requirement of fulfilling a Data Rights Request, ANSYS will notify the requestor that it intends to decline the request and the basis for the exemption. 7. Timeframe for responding to Data Rights Requests 7.1 Data Subject Requests must usually be responded to without undue delay and no later than one (1) month following receipt of the request. Where a request is particularly complex, additional time may be required. 7.2 Where a request cannot be completed in the typical timeframe, ANSYS is entitled to extend the response period by up to two (2) additional months provided ANSYS gives the requestor notice within the original timeframe of the intent to respond and the reason for the delay. 8. Fee for Data Rights Requests 8.1 ANSYS is not permitted to charge for responding to a Data Rights Request unless the request is determined excessive and/or manifestly unfounded or ANSYS is otherwise exempt from the obligation to act on the request (as outlined above). In such cases and where ANSYS agrees to respond to a request, a reasonable fee may be charged based on the administrative costs of providing the information or taking the action requested. 9. Data Rights Requests in more detail 9.1 Requests for access to personal data The right of access: Right of an individual to obtain confirmation of whether a data controller processes personal data about him or her and, if so, to be provided with the details of the personal data processed and specific aspects of processing activities related to such personal data, and to receive a copy of such details. 9.1.1 Information to be provided in response to a request 9.1.1.1 An individual is entitled to request a copy of the personal data about him or her held and being processed by a data controller. Such data must be provided in intelligible form. 9.1.1.2 Information provided in response to a request should include: (i) A description of the personal data and categories of personal data concerned; (ii) The estimated period for which the personal data will be stored; (iii) The purposes for which the personal data is being held and processed; (iv) The recipients or types of recipients to whom the data is, or may be, disclosed by the data controller; (v) Confirmation of the individual's right to request rectification or deletion of the personal data or to restrict or object to processing of the data; (vi) Confirmation of the individual's right to lodge a complaint with a competent data protection authority; (vii) Details about the source of the personal data if it was not collected from the individual; (viii) Details about whether the personal data is subject to automated decision-making (including profiling); and (xi) Where personal data is transferred from the European Economic Area to a country outside of the European Economic Area, the appropriate safeguards implemented by the data controller related to such transfers in accordance with applicable data protection laws. 9.1.2 Format of requests 9.1.2.1 An access request does not require any prescribed format or reference to data protection law to qualify as a valid request, although this can be helpful in identifying the type of request. 9.1.2.2 An access request does not need to be made in writing but it is helpful for record-keeping purposes and to clarify the request. If made in writing, the requestor should provide an email address and confirmation of whether the data requested can be sent via email (or otherwise specify preferred means by which the data may be received). 9.1.2.3 Requests made electronically (e.g. by email) may be responded to electronically (in a commonly used format, such as by attaching pdf documents to an email) unless the individual stipulates otherwise (such as by requesting the data be provided orally or by postal service). 9.1.3 Exemptions 9.1.3.1 ANSYS will not decline to comply with an access request unless it can demonstrate that it is not in the position to identify the requestor or it is otherwise exempt from its obligations to comply (as outlined in Section 6). 9.2 Requests to rectify personal data The right to rectification: Right of an individual to obtain rectification, without undue delay, of inaccurate personal data a controller may process about him or her. 9.2.1 Rectification by ANSYS- If ANSYS holds inaccurate or incomplete data about an individual, the individual is entitled to request that the data is rectified. 9.2.2 Rectification by third parties- If ANSYS rectifies an individual's data in response to a request, ANSYS will seek to notify third parties with whom ANSYS has shared this data (i.e. data processors). 9.2.3 Supplementary statements to complete information- If a request to rectify data involves ensuring the data is complete, ANSYS may consider including a statement made by the requestor to provide the complete data. 9.3 Requests to delete personal data ("right to be forgotten") The right to erasure: Right of an individual to require a controller to delete personal data about him or her on specific grounds – for example, where the personal data is no longer necessary to satisfy the purposes for which it was collected. 9.3.1 Circumstances in which right to erasure may apply An individual may request that a data controller delete their personal data in the following circumstances: 9.3.1.1 The personal data is no longer necessary for the purpose for which it was collected, used or otherwise processed; 9.3.1.2 The personal data was unlawfully processed by data controller; 9.3.1.3 Processing occurred on the basis of consent from the individual and they withdraw consent (and no other legitimate grounds for processing the data exists); 9.3.1.4 The individual objects to the processing (see below) and no overriding legitimate grounds exist for processing the data; 9.3.1.5 The personal data needs to be deleted to comply with the data controller's legal obligations; and/or 9.3.1.6 The personal data was collected in connection with services offered on the data controller's website. 9.3.2 Erasure of personal data by third parties 9.3.2.1 If ANSYS deletes an individual's data in response to a request, ANSYS will seek to notify third parties with whom ANSYS has shared this data (i.e. data processors). 9.3.2.2 It is unlikely that ANSYS will have made personal data public but in this case and if obligated to delete the personal data pursuant to a Data Rights Request, ANSYS will also take reasonable steps, including technical measures (taking into account available technology and the cost of implementation), to inform other controllers storing, using or otherwise processing the personal data of this request for deletion, including deletion of any links to, copies or replication of this personal data. 9.3.3 Exemptions 9.3.3.1 In addition to the general exemptions outlined in Section 6, ANSYS is exempt from the obligation to delete personal data where the processing of the data is necessary for: (i) Compliance with ANSYS' legal obligations; (ii) Establishing, exercising or defending legal claims; (iii) Scientific, historical or statistical purposes, and where erasure of the data would make this processing impossible or seriously impair it; (v) Public interest reasons including (1) performance of a task carried out in the public interest, (2) exercise of official authority vested in ANSYS, or (3) for public health reasons or archiving in the public interest (although these exemptions are unlikely to apply to ANSYS); and/or (vi) Exercising the right of freedom of expression and information. 9.4 Right to object to processing The right to object: Right of an individual to object, on grounds related to his or her particular situation, to a controller's processing of personal data about him or her, if processing is based on the legitimate interests of the controller. 9.4.1 Circumstances in which individuals can object to processing 9.4.1.1 If ANSYS relies upon the grounds that use, storage or processing of personal data is in its legitimate interests, an individual may object to that processing. 9.4.1.2 Individuals can also object to processing where such processing is required to perform a task in the public interest or to exercise an official authority vested in the controller. 9.4.2 Exemptions 9.4.2.1 In addition to the general exemptions outlined in Section 6, ANSYS is exempt from the obligation to cease processing of personal data following an objection if: (i) ANSYS can demonstrate compelling legitimate interests for processing the data that override the interests, rights and freedoms of the individual; (ii) The processing is required to establish, exercise or defend a legal claim; and/or (iii) The processing is for scientific, historical or statistical purposes carried out in the public interest. 9.5 Right to object to direct marketing The right to object to direct marketing: Right of an individual to object to direct marketing, including profiling related to direct marketing. 9.5.1 ANSYS will seek to stop using personal data for direct marketing if it receives such a request from customers, partners, and others. ANSYS is unlikely to send direct marketing communications to employees and other workers in the context of their employment relationship or engagement. 9.6 Right to restriction The right to restriction: Right of an individual to require a controller to restrict processing of personal data about her or her on specific grounds. 9.6.1 ANSYS will consider requests to restrict processing, although this is less likely to apply in the employment relationship (and/or the relationship with other workers). 9.6.2 Individuals may seek a restriction on ANSYS' processing of their personal data where, for example, they await a response to their request for access to their personal data. 9.7 Right to data portability The right to data portability: Right of an individual to receive his or her personal data from a controller in a structured, commonly used and machine-readable format in order to transfer that data to another controller, where the processing is 1) based on the consent of the individual, and 2) carried out by automated means. 9.7.1 ANSYS will consider requests to exercise the right of data portability, although this is less likely to apply in the employment relationship (and/or the relationship with other workers). 9.8 Right not to be subject to automated decision-making (including profiling) The right not to be subject to automated decision-making: Right of an individual to object to an automated decision made about the individual which has a legal or other similar effect on the individual. Individuals can ask for manual, human review in the decision-making process. 9.8.1 ANSYS will consider requests to perform a human review, rather than using automated decision-making, although this is much less likely to apply in the employment relationship (and/or the relationship with other workers). blockquote p { color: #222; } blockquote { border: none; margin-left: 40px; } p { font-family: sans-serif; font-size: .9rem; }

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Aerospace & Defense Webinar Series | Ansys

The aerospace and defense (A&D) industry has been at the leading edge of the development and adoption of simulation technology since the introduction of computerized tools. The reason is simple: It works in a high-reward/high-risk design space, in which the cost of failure is too high. An engineering success like the Space Shuttle’s first manned flight would have been impossible without the extensive use of reliable and accurate computer simulations that guaranteed all systems and components were working correctly. In this webinar series, we will explore how ANSYS simulation technology is used by the A&D industry to design and analyze a wide number of cutting-edge applications, and how simulation can help make these products better and safer. Upcoming Webinars Heat Flux Measurements in Hypersonic Environments Wed, Aug 19th, 2020 11:00 a.m. EST Measurement of heat flux on a hypersonic test article (ground or flight) poses many challenges, from determining the best location for the measurements, ensuring survivability and increasing reliability to test article integration with minimal disturbance to the vehicle’s TPS and to the sensor’s performance. In this webinar, we give an overview of the numerous challenges of measuring heat flux to a hypersonic vehicle/test article. A simple “roadmap,” with lessons learned is presented for implementing these sensors in the hypersonic environment. The roadmap shows how simulation technology for mechanical, thermal and fluid analysis has been used to compress the design process and the testing phase. Simulation delivers deeper insight into the physical processes involved and leads to design changes that avoid costly failures. Register   Better Designs for Supersonic Business Jets Wed Sept 16th, 2020 11:00 a.m. EST Learn how Ansys is helping the A&D industry prepare a new chapter in supersonic commercial aircraft design. This presentation summarizes external aero nearfield sonic boom prediction on the NASA X-59 geometry as presented at the AIAA Sonic Boom workshop. We also discuss the Ansys supersonic panel flutter capability. Comparisons to NASA wind tunnel data are included. Register   Webinars on Demand Overset Meshing Technology for the A&D Industry A common difficulty in simulating CFD problems with large relative motion between components is how to adequately handle the mesh deformation. These problems have largely been handled through complicated remeshing or mesh smoothing methods. Overset meshing provides an alternative approach to these problems. Additionally, overset meshing may be useful for certain geometries that may be better represented by separate component meshes or for design exploration studies involving repetitive reconfiguration of parts. In this webinar, we discuss the basics of overset meshing in Ansys Fluent and present best practices. We will also review recent validation studies and novel example cases for external aerodynamics, projectile motion, store separation and marine applications. View on Demand   Entering a New Era: Using Simulation Technology for Aircraft Electrification Join us for this free webinar that provides a detailed look at how cutting-edge simulation technology is radically advancing aircraft electrification. You will learn how pervasive engineering simulation aids in cost reduction and increased product reliability through digital exploration during the design and operation phases of product development cycle. Additionally, this webinar discusses simulation technologies that will help you model and develop electric aircraft components. Learn how to use cutting-edge simulation solutions to slash development costs and boost product reliability. Understand how to conduct in-depth digital exploration during key product development cycle phases. Discover the latest tools and techniques for modeling and creating next-generation electric aircraft components. View on Demand  Improving Spacecraft Fuel Tank Design: Reducing Sloshing in Rockets Join us for this free webinar that dynamically showcases ANSYS’ capabilities for simulating the physics of sloshing, including advanced preprocessing tools for geometry discretization (ANSYS SpaceClaim and ANSYS Fluent). Additionally, it spotlights ANSYS’ strong portfolio of solution methods for modeling turbulent multiphase flows and discusses insightful post-processing tools for handling flow physics (ANSYS EnSight). Lastly, the webinar applies selected real-world case studies, including examining the behavior of fuel sloshing within a spacecraft’s tank during launch and while in low-Earth orbit flight. Learn how to simulate the physics of sloshing with sophisticated preprocessing tools for geometry discretization. Discover powerful simulation solutions for modeling turbulent multiphase flows. Harness cutting-edge post-processing tools for effectively handling flow physics. View on Demand Radically Improving Engineering Productivity in the Aerospace and Defense Industry With ANSYS Fluent 2020 R1 This cutting-edge webinar explores how aerospace and defense industry engineers will significantly improve their productivity with exciting new enhancements featured in ANSYS Fluent’s 2020 R1 release. Through live demonstrations and success stories from early users, you will learn how Fluent substantially reduces hands-on development time and drastically boosts efficiency with a single-window, task-based workflow and a dynamic Mosaic-enabled meshing technology. Additionally, real-world case studies will highlight how Fluent’s upgraded proprietary numerics make tackling even the most challenging hypersonic problems seem easy. Join us for this free webinar to learn how Fluent can take your day-to-day productivity to the next level. Learn how Mosaic meshing technology combines the ease of automated meshing with the efficiency and accuracy of flow-aligned grids. Understand how Fluent's new proprietary numerics stabilize and accelerate convergence for hypersonic flows. Discover how Fluent's new adjoint workflow can automate your aerodynamic shape optimization problems. View on demand Unstructured Meshing Workflows for the Aerospace and Defense Industries We will explore how the aerospace and defense industries can utilize ANSYS technologies for automated unstructured meshing workflows, including: CAD Import and geometry preparation capabilities in ANSYS SpaceClaim Watertight geometry workflow for task-based automated meshing for external flows Fault tolerant meshing workflow for task-based automated meshing of models containing "dirty" CAD: using wrapper technology to speed complex meshing tasks Validation examples of the new Mosaic Poly-Hexcore mesh topology Presented by: Andy Wade Andy Wade is a technical program manager in our meshing development unit. He has been with ANSYS for 14 years, having spent 13 years in technical services as an engineer. He has extensive experience working with CFD analysts and method developers using ANSYS software in a wide range of application areas with a focus on the aerospace and defense industries. View on demand Aircraft Engine Icing Recent events of high-altitude turbofan engine malfunctions characterized by sudden power loss and flameouts have been attributed to ice crystal formation in the compressor core. The understanding of ice accretion on rotor/stator blades is paramount and needs to be accounted for and integrated into the gas turbine design process. Designing optimal anti/de-icing systems requires detailed understanding of complex icing phenomena and their interaction with air flow and ingested particles. Regulatory certification processes are often underpinned with expensive ice tunnel and flight tests with limited data points. High-fidelity CFD/icing models can help engineers develop a better understanding of complex icing processes and design better systems at a fractional cost. ANSYS icing solutions empower engineers with high fidelity CFD/icing models to account for ice accretion and flow interactions early in the design phase in a seamless manner while harnessing the power of high-performance computing. Attend this webinar to get an overview of ANSYS icing solutions with a focus on ice crystal formation in turbomachinery compressors. Presenters: Vinod Rao is a Senior Application Engineer at ANSYS, where he has been working for over six years on advanced aerospace, turbomachinery and automotive applications. His main areas of expertise include aeromechanics, aircraft icing, turbomachinery applications and aeroacoustics. Shezad Nilamdeen is a Senior Developer at ANSYS. He has been working in CFD and turbomachinery icing physics for 10 years. He is the ANSYS representative and contact for the Engine Icing Working Group. Shezad holds a Masters degree in Mechanical Engineering from McGill University. View on demand Thermal FSI of a Sounding Rocket Through Atmosphere Sounding rockets frequently contain scientific equipment that needs to survive the thermal consequences of re-entering the Earth’s atmosphere at hypersonic velocities. Traditional thermal protection systems have been designed using uncoupled simulation methods that consider the exterior aerodynamic heating and the interior thermal behavior separately, but this may cause simulation results to be incomplete and even misleading. Join us for our upcoming webinar to discover how fluid–structure interaction (FSI) can provide a better understanding of thermal performance in aerospace and defense engineering This webinar will consider a typical sounding rocket with simplified internal components subjected to atmospheric re-entry aerodynamic conditions. It will illustrate the capabilities and workflow approaches that can be used to evaluate the thermal performance using ANSYS structural and CFD simulation tools connected via the Ansys Systems Coupling environment. Presented by: Walter Schwarz, PhD Walter Schwarz is an engineering simulation expert with over 30 years of experience in the areas of flow modeling, heat transfer and turbulence. He is a lead application engineer for the ANSYS Customer Excellence (ACE) team. Dr. Schwarz received his Ph.D. in mechanical engineering (thermosciences group) from Stanford University. Before joining Fluent Inc. in 1996, Dr. Schwarz worked at Westinghouse in the nuclear industry, and was an assistant professor of mechanical engineering at Stevens Institute of Technology. View on demand The New Fluent Experience with Mosaic Meshing for the Aerospace and Defense Industries We will explore how the aerospace and defense industries can optimize their current workflow and increase productivity with exciting new enhancements in the 19.2 release of ANSYS Fluent. Through live demonstrations and success stories from early users, learn how Fluent reduces hands-on time and raises efficiency with a single-window, task-based workflow and Mosaic-enabled meshing technology: Watertight geometries can be prepped and meshed in a single-window Fluent interface. Task-based workflow guides you through the simulation process by presenting best practices in an organized interface. New users learn faster, while experienced analysts gain efficiency. Mosaic uses high-quality polyhedra to combine any type of boundary layer mesh with autogenerated hex mesh Presented by: Luke Munholand, PhD Luke Munholand, Ph.D. is a lead application engineer at ANSYS. For more than 14 years he has provided technical guidance to customers who seek maximum value for their simulation effort. Luke specializes in computational fluid dynamics for the defense and biotechnology areas. View on demand Addressing the Challenges of the Design of Hypersonic Vehicles with Simulations The recent surge in the interest in hypersonic technology has highlighted the need to accurately and efficiently simulate these complex flowfields using CFD tools. Computer simulations for the design and analysis of hypersonic vehicles is critical since it is often impossible to reproduce the high-Mach number, high-enthalpy conditions in a wind tunnel. Simulating the hypersonic flow regime with CFD tools presents several challenges, ranging from the accurate modeling of the complex physical phenomena, such as compressibility effects, shock-boundary layer interaction, high temperatures, dissociation and ionization of air, ablation of solid surfaces and, ultimately, magnetohydrodynamics effects, to the stabilization of the numerical algorithms used to solve the governing equations. In this seminar we will show how ANSYS CFD tools are used to simulate high speed flows and to design hypersonic vehicles, by touching on the capabilities of the CFD tools and describing case studies. Presented by: Valerio Viti Valerio Viti is a A&D industry leader at ANSYS. Valerio has been with ANSYS for 12 years working in the application of CFD tools to the Aerospace and Defense, Power generation and HVAC industries. Valerio holds a PhD in Aerospace Engineering from Virginia Tech and a Masters in Aeronautics from The City University of London View on demand Multiphysics Simulation For The Aerospace Industry Modern trends in the development of aircraft and defense vehicles, such as increased power density, miniaturization, lightweighting, advanced materials and environmental sustainability are driving the need for Pervasive Engineering Simulation. Upfront digital exploration and building of digital twins require a comprehensive simulation platform that enables the modeling of complex physical and physics-based interaction of systems. Robust, fast, scalable and versatile workflows for multiphysics simulations offer tremendous value to companies in their product development and operation cycles. This webinar presents the ANSYS multiphysics solution specifically for the A&D engineer. We will highlight how the ANSYS solution works and showcase fluid-structure interaction (FSI) case studies and examples from the A&D industry. Presented by: Sreedevi Krishnan Sreedevi Krishnan is a computational fluid dynamics (CFD) application engineer at ANSYS. She has been with ANSYS for 10 years, working mostly with advanced automotive applications. Her main areas of expertise are volume of fluid (VOF) methods and FSI. Sree holds a Ph.D. in mechanical engineering from the University of Iowa. View on demand Addressing Challenges of High-Speed Vehicle Design Using Physics-Based Simulation Technology In this webinar, we focus on the numerical study of the external aerodynamics of two cruise missile geometries. The first is a generic high-supersonic/low-hypersonic geometry. The study analyzes the main flow features to better understand the physical phenomena that govern the behavior of canard geometries at different angles of attack. The second geometry is an aerospike. It uses an aerodynamic spike on the nose of the missile to offset the shockwave in front of the main body and effectively reduce pressure and temperature loads on the radome. The study explores the complex flow field around the missile and includes a sensitivity analysis. Presenters: Vinod Rao is a computational fluid dynamics (CFD) specialist at ANSYS, where he has been working for over six years on advanced aerospace, turbomachinery and automotive applications. His main areas of expertise include aeromechanics/fluid-structure interaction (FSI), compressible flows, aircraft icing and aeroacoustics. Valerio Viti is an A&D industry lead at ANSYS. Valerio has been with ANSYS for 12 years working in the application of CFD tools in the aerospace and defense, power generation and HVAC industries. Valerio holds a Ph.D. in aerospace engineering from Virginia Tech and a master’s in aeronautics from City, University of London. View on demand Designing Safer Ships Using Simulation: Ship-Hull Stability Prediction by ANSYS CFD As part of the certification process, marine surface vessels and industrial floating structures undergo rigorous stability tests to insure the maximum safety and operability under extreme weather conditions. In this webinar, we will demonstrate how CFD analysis can be used to gain insight into the stability performance of a representative Navy vessel using ANSYS Fluent. The free surface effects on the vessel were simulated using the Volume of Fluid Method, while the vessel motion was resolved using the 6-DOF solver. Presented by: Zoran Dragojlovic Zoran Dragojlovic is a senior application engineer supporting ANSYS computational fluid dynamics (CFD) tools and related workflows as a part of ANSYS Customer Excellence (ACE) team. Zoran has over 20 years of engineering experience including nuclear energy research, semiconductor manufacturing process design and consulting. Since joining ANSYS in 2012, Zoran has been contributing to application support, training and mentoring. View on demand Improving the Design of Fuel Cells for the Aerospace and Defense Industry Fuel cells can produce electricity from an external source of fuel and oxidizer. They are clean, quiet and highly efficient. Polymer electrolyte membrane (PEM) fuel cells (FCs) operate at lower temperatures than other types of fuel cells and are frequently employed in vehicles and personal mobility applications in the aerospace and defense industry. This webinar will focus on the application of the PEMFC module in ANSYS Fluent to both simple and complex fuel cell geometries to help understand the effects of geometric and operating parameters on device performance and thermal management. Presented by: Kurt Svihla Kurt Svihla is a senior application engineer at ANSYS with a Ph.D. in chemical engineering from Florida State University. He has worked with ANSYS computational fluid dynamics tools for more than 18 years and has supported clients in the nuclear, biotechnology and chemical process industries. View on demand Accurate Prediction of Panel Flutter Applicable to Supersonic or High Lift Flight: Results and Comparison to NASA Wind Tunnel Data Avoiding flutter of an aircraft's skin is important for safe and robust operation. Traditional panel flutter prediction tools fall short for conditions where the boundary layer thickness varies. ANSYS’ fluid–structure interaction (FSI) capability accurately predicts panel flutter under the most challenging conditions. ANSYS simulation results will be compared to NASA supersonic wind tunnel data. The simple simulation process and surprisingly small computational requirements for accurate results will also be summarized. Prime applications for the ANSYS FSI capability include next generation supersonic transports heralded by NASA's (X-59) low boom demonstrator or high lift flight conditions of subsonic aircraft. Presented by: Luke Munholand, Ph.D. Luke Munholand, Ph.D. is a lead application engineer at ANSYS. For more than 14 years he has provided technical guidance to customers who seek maximum value for their simulation effort. Luke specializes in computational fluid dynamics for the defense and biotechnology areas. Coauthor: Vinod Rao Vinod Rao is a computational fluid dynamics (CFD) specialist at ANSYS, where he has been working for over six years on advanced aerospace, turbomachinery and automotive applications. His main areas of expertise include aeromechanics/fluid–structure interaction (FSI), compressible flows, aircraft icing and aeroacoustics. View on demand Reduced Order Modeling (ROMs) for Aerospace Industry Assessing the performance of aircraft components with systems-level models has always been a part of the aircraft design process. A systems simulation is a collection of models, simulations and algorithms that predict how all the parts in a system will work together. The fidelity of the model improves if the detailed physics governing the performance of the components can be closely represented in the system model. However, the very nature of 3D modeling is time-intensive and not practical to incorporate in a full systems-level model you need to simulate a system in real time. Reduced Order Models (ROMs) are mathematical simplifications of 3D models that preserve the essential information needed for system simulations. Solving a ROM for a given input can be orders of magnitude faster than solving a 3D model. This makes ROMs ideal for many applications, like design of experiments (DOE), systems simulations, digital twins and runtime generations of real-time applications.. This webinar will present an overview of ROM technology available with the ANSYS platform, along with some examples and a demo of the ROM workflow for CFD.. Presented by: Sreedevi Krishnan Sreedevi Krishnan is a computational fluid dynamics (CFD) application engineer at ANSYS. She has been with ANSYS for 10 years, working mostly with advanced automotive applications. Her main areas of expertise are volume of fluid (VOF) methods and FSI. Sree holds a Ph.D. in mechanical engineering from the University of Iowa. View on demand Prediction and Remediation to Aircraft Icing via Simulations Icing on aircraft surfaces, appendages, sensors and engines are safety-critical aspects of aircraft design that impact the whole supply chain. Achieving regulatory certification is a complex and time-consuming process involving simulation models, icing tunnels and flight testing. Recent regulatory changes and industry focus around high-altitude ice crystals and supercooled large droplets (SLD) have further challenged the design process and the time to market for new aircraft and technology. ANSYS provides a unique combination of advanced computational fluid dynamics and icing simulation expertise in a common working environment. The solution captures real-world behavior in 3D, using the most efficient simulation workflow available and an extensive database of industry validation. In addition, the simulation outputs are designed to comply with the FAA’s Appendices C, D and O. ANSYS icing simulation enables companies and engineers to develop products faster, test designs earlier in the development cycle, reduce the number of physical prototypes and produce a better solution than would be possible using traditional design methods. Please join us for this webinar to learn about the capabilities and applications of ANSYS software for in-flight icing. Presented by: Miraj Desai Miraj Desai graduated with a bachelor’s and master’s in aerospace/Mechanical Engineering from Embry-Riddle Aeronautical University. After working in industry, he joined ANSYS in 2015 and has experience in external flow modeling with extensive experience with in-flight icing. Miraj is a regular attendee and participant of SAE AC-9C icing meetings and participates within AIAA committees to use simulation for aircraft certification. View on demand

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Voluntary Product Accessibility Templates | ANSYS Web Page Solutions

Accessibility Voluntary Product Accessibility Templates (VPAT) helps federal contracting officials make preliminary assessments regarding the accessibility of commercial electronic and information technology products and services as required by Section 508 of the Rehabilitation Act. ANSYS understands the importance of Section 508 and has completed VPATs for the following commercial products: Voluntary Product Accessibility Template ANSYS CFD HPC within ANSYS Workbench ANSYS CFD PrepPost within ANSYS Workbench ANSYS CFD within ANSYS Workbench ANSYS CFX within ANSYS Workbench ANSYS Designer ANSYS DesignModeler within ANSYS Workbench ANSYS DesignXplorer with ANSYS Workbench ANSYS ECAD Translators ANSYS Explicit STR with ANSYS Workbench ANSYS Fluent within ANSYS Workbench ANSYS HFSS ANSYS HPC within ANSYS Workbench ANSYS Icem CFD Hexa within ANSYS Workbench and ANSYS Icem CFD Tetra within ANSYS Workbench ANSYS LS DYNA PC within ANSYS Workbench ANSYS Maxwell ANSYS Mechanical HPC with ANSYS Workbench ANSYS Mechanical within ANSYS Workbench ANSYS Multiphysics within ANSYS Workbench ANSYS Q3D Extractor ANSYS Simplorer ANSYS TPA ANSYS TurboGrid within ANSYS Workbench Geometry Interface for Parasolid within ANSYS Workbench Geometry Interface for SolidWorks within ANSYS Workbench Geometry Interface for Creo Parametric with ANSYS Workbench Note that the ANSYS Academic products are bundles that typically contain more than one of the above listed commercial products. Because there is no difference in the graphical user interface and simulation workflow of the academic versions of our commercial products, the VPAT for a commercial product also applies to that product if it is contained within an academic product bundle. Please reference the ANSYS Academic product features table to understand what products are bundled & then use the above list to identify the VPAT for each bundled product (if one is listed).

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ANSYS HFSS | Solve RF Interference Issues

High-Frequency Electromagnetic Solvers ANSYS HFSS uses the highly accurate finite element method (FEM), the large-scale method of moments (MoM) technique and the ultra-large-scale asymptotic method of shooting and bouncing rays (SBR) with advanced diffraction and creeping wave physics for enhanced accuracy (SBR+). The ANSYS HFSS simulation suite has the following solvers to tackle manifold EM problems involving electrically small to enormous structures: HFSS Frequency Domain Time Domain Integral Equations Hybrid Technologies HFSS SBR+ Shooting and Bouncing Ray Physical Optics Physical Theory of Diffraction Uniform Theory of Diffraction Creeping Wave ANSYS HFSS HFSS contains multiple simulation engines in one package, each targeted toward a specific application or simulation output. HFSS Hybrid Technologies The FEM-IE hybrid technology is built upon HFSS FEM, IE MoM and the patented ANSYS domain decomposition method (DDM) to solve electrically large and complex systems. By applying the appropriate solver technology, local regions of high geometric detail and complex materials are addressed with finite element HFSS, while regions of large objects or installed platforms are addressed with 3D MoM HFSS-IE. The solution is delivered in a single setup through a single, scalable and fully coupled system matrix.   Finite Element Method (Frequency Domain) This is the high-performance 3D, full-wave, frequency domain electromagnetic solver based on the proven finite element method. Engineers can calculate SYZ parameters and resonant frequency; visualize electromagnetic fields; and generate component models to evaluate signal quality, transmission path loss, impedance mismatch, parasitic coupling and far-field radiation. Typical applications include antennas/mobile communications, integrated circuits, high-speed digital and RF interconnects, waveguides, connectors, filters, EMI/EMC, etc. Finite Element Transient (Time Domain) The Finite Element Time Domain solver is used to simulate transient EM field behavior and visualize fields and system responses in typical applications like time domain reflectometry (TDR), lightning strikes, pulsed ground-penetrating radar (GPR), electrostatic discharge (ESD) and electromagnetic interference (EMI). It leverages the same finite element meshing approach as the frequency domain solver, without the need to switch meshing technologies to switch simulation domains. The transient solver complements the frequency domain HFSS solver, and enables engineers to understand the EM characteristics on the same mesh in both time and frequency domains. Integral Equations The integral equations (IE) solver employs the 3D Method of Moments (MoM) technique for efficiently solving open radiation and scattering problems. It is ideal for radiation studies like antenna design and/or antenna placement, and for scattering studies such as radar cross section (RCS). The solver can employ either multilevel fast multipole methods (MLFMM) or adaptive cross-approximation (ACA) to reduce memory requirements and solve times, allowing this tool to be applied to very large problems. HFSS Fast Mode For the early part of a product’s design cycle — where rapid simulation results can provide invaluable insight regarding design trends — HFSS includes a fast simulation mode. The fast mode tunes the solver and adaptive mesher to return results as fast as possible, without significantly compromising solution accuracy. Then, as the design nears completion, a simple slider bar setting sets the HFSS solver to return validation-level signoff accuracy using the industry tested, gold-standard accuracy capability of HFSS.   ANSYS HFSS SBR+ SBR+ is the only commercial electromagnetic solver to empower Shooting & Bouncing Ray (SBR) technology with simultaneous and consistent implementations of Physical Theory of Diffraction (PTD), Uniform Theory of Diffraction (UTD), and Creeping Wave for simulating installed antenna performance on electrically large platforms that are hundreds or thousands of wavelengths in size. SBR uses a ray tracing technique to model induced surface currents on the antenna platform or scattering geometry composed of conductors and dielectrics. With the SBR+ solver, engineers can obtain fast and accurate prediction of far field installed antenna radiation patterns, near-field distributions and antenna-to-antenna coupling (S-parameters) on electrically medium, large and enormous platforms. Transmissions and reflections can be modeled in large structures like vehicles, aircraft, radomes, etc. HFSS SBR+ also provides efficient radar signature modeling, including ISAR images of electrically large targets. Physical Theory of Diffraction The Physical Theory of Diffraction (PTD) wedge correction feature is used for correcting PO currents along sharp edges of installed antenna platforms to refine EM field diffraction. Uniform Theory of Diffraction Engineers can model Uniform Theory of Diffraction (UTD) edge diffraction rays created by illuminated geometry edges and identified by PTD wedges. This is important for cases where the significant parts of the scattering geometry are otherwise shadowed from direct or multi-bounce illumination. Creeping Wave Physics for RCS and Installed Antenna Analysis ANSYS HFSS SBR+ is the only commercial asymptotic field solver to offer creeping wave physics for both radar signature and installed antenna modeling. Creeping waves provide an important component of radar scattering from objects with curvature. When a radar signal impinges on a rounded target, the currents induced on the object reach around the back and create delayed signal echoes. In modeling electrically large targets, ray-tracing approaches like HFSS SBR+ must be employed to model the radar signature, but traditional ray-tracing approaches have no way to model the backside currents or their influence on target scattering. Creeping wave physics is a ground-breaking addition to HFSS SBR+ to capture this important characteristic of radar scattering. It yields unprecedented accuracy for radar signature modeling of large targets. Creeping waves are also used to model the installed antenna performance when integrated into curved surfaces found on aircraft fuselages, rockets and missile bodies, automobile bodies and ship topsides. They are used to model radiation in shadowed regions for shooting and bouncing ray (SBR) simulations. SBR is accurate for modeling radiation in regions directly lit by the antenna or indirectly through multi-bounce interactions. However, for the back lobe or deep sidelobe regions shadowed from view by the curved host platform it is essential to use creeping wave physics to extend the ground-induced currents beyond line of sight across these smoothly curved surfaces. The analysis contributes to a higher-fidelity characterization of the back radiation. Increased accuracy of modeling antenna-to-antenna coupling is another benefit of this capability. ACT Extensions RadarPre and RadarPost for Radar Processing Delivered with HFSS HFSS and HFSS SBR+ provide you with a powerful capability to model radar cross section (RCS) and time domain radar response for large targets like aircraft, automobiles and ships. Radar signatures involving time domain range profiles, inverse synthetic aperture radar (ISAR) plots and waterfall/sinograph plots yield insight into radar design and stealth. The RadarPre and RadarPost toolkits simplify and speed the process of setting up these complex radar simulations and provide streamlined post-processing for graphically rich analysis results. The RadarPre and RadarPost ACT toolkits are delivered with the standard installation of the ANSYS Electronics Desktop. Accelerated Doppler Processing Accelerated Doppler processing (ADP) accelerates simulation of long-, medium- and short-range pulse-Doppler and chirp-sequence frequency-modulated continuous-wave (FMCW) radars used in ADAS, autonomous vehicles and other near-field radar systems by more than 100x. ADP includes integrated range-Doppler image map post-processing and animation in the ANSYS Electronics Desktop. In addition to ADP, a gain and self-coupling antenna link streamlines the complete radar design process, so radar sensor simulation results can be used seamlessly in installed performance modeling and in radar-environment range-Doppler simulations. The workflow simplifies the collaboration between radar sensor designers and the OEMs that incorporate the sensors on vehicles and in large-environment radar simulations. Accelerated Doppler processing is available as part of the ANSYS Electronics Enterprise product suite.   Reliability and Automatic Adaptive Meshing Engineers know and rely on ANSYS HFSS to provide accurate solutions automatically. The key to this reliability is automatic adaptive mesh refinement, which generates an accurate solution based on the physics and electromagnetics of the design. This contrasts with other electromagnetics (EM) simulation tools where the engineer is expected to know how to mesh the structure to get an accurate solution. Automatic adaptive meshing is a highly robust meshing technique that produces an efficient mesh for guaranteed accuracy as quickly as possible. You need only import or draw the geometry, and specify materials, boundary conditions, excitations and the frequency band of interest, and HFSS takes care of the rest. To minimize the need for “healing and cleaning” of imported CAD geometry, powerful TAU flex meshing technology is included within HFSS. TAU flex quickly produces a reliable initial mesh from the “dirtiest” of models, so you can quickly advance through the solution process with the accurate and reliable solver technology of HFSS. 3D Components ANSYS 3D Components represent discrete subcomponents of a larger simulation that can be easily re-used for electromagnetic simulations in ANSYS HFSS. 3D Components can encapsulate geometry, material properties, boundary conditions, mesh settings, excitations and discrete parametric controls. They are convenient for design re-use for devices such as antennas, connectors and surface mount devices like chip capacitors, inductors and discrete LTCC filters. To enable industry-wide collaboration, ANSYS 3D Components can be created with password protection, file encryption and creation settings to discreetly control which features are visible to a component end-user. However, the HFSS simulation engine is fully aware of the entire component within the simulation, and therefore provides a fully coupled and complete electromagnetic simulation result. An ANSYS 3D Component can be likened to a building block of a simulation implemented as a plug-and-play module. Since 3D Components provide a fully coupled electromagnetic analysis, they have a distinct advantage over an S-parameter model which only delivers a response of a component on its test fixture. A system integrator just adds the component onto a system such as a 3D Component of an antenna on an aircraft to simulate the installed performance of the antenna. They can do this with the confidence that the simulation results represent a fully coupled and accurate model simulated with ANSYS HFSS. Vendors and developers of discrete components can create simulation-ready 3D Components in ANSYS HFSS and provide them to end-users who can reference them in larger system simulation. With this ability to collaborate through 3D Components, vendors can provide their customers with HFSS simulation-ready models, giving them a valuable edge in enabling first-pass design success. Modelithics®, an ANSYS partner, offers a licensed library of HFSS 3D components. The library includes models for the Barry QFN package, RJR QFN package, Coilcraft inductors, Johanson capacitor, Mini-Circuits filter and Gigalane coax connector. More information can be found on the Modelithics website at www.Modelithics.com/model/models3D. Advanced Phased Array Antenna Simulation In ANSYS HFSS, engineers can simulate infinite and finite phased-array antennas with all electromagnetic effects, including mutual coupling, array lattice definition, finite array edge effects, dummy elements, element blanking and more, through advanced unit cell simulation. A candidate array design can examine input impedances of all elements under any beam scan condition. Phased array antennas can be optimized for performance at the element, subarray or complete array level based on element match (passive or driven) far-field and near-field pattern behavior over any scan condition of interest. Infinite array modeling involves one or more antenna elements placed within a unit cell. The cell contains periodic boundary conditions on the surrounding walls to mirror fields, creating an infinite number of elements. Element scan impedance and embedded element radiation patterns can be computed, including all mutual coupling effects. The method is especially useful for predicting array-blind scan angles that can occur under certain array beam steering conditions. Finite array simulation technology leverages domain decomposition with the unit cell to obtain a fast solution for large finite-sized arrays. This technology makes it possible to perform complete array analysis to predict all mutual coupling, scan impedance, element patterns, array patterns and array edge effects. 3D Component Finite Array Domain Decomposition Method ANSYS is the first to offer a novel solution for accurate and reliable analysis of antenna arrays used in such diverse applications as 5G mmWave, radar design including automotive radar sensors, and satellite communications. This breakthrough technology known as 3D Component Domain Decomposition method (3D Comp DDM) empowers engineers to conquer large and complex antenna array problems efficiently. It supports the HFSS gold standard adaptive meshing technique which the electronics industry relies upon for accurate and reliable results. Simulating a large complex antenna array through conventional techniques can take a long time or return unreliable and limited-value results owing to infinite array assumptions. On the other hand, 3D Comp DDM enhances the simulation process offering a robust, reliable, and efficient solution for modeling large arrays while capturing finite array truncation effects. It exploits the repetitive nature of an array’s geometry requiring only single instances of antenna elements, implemented as HFSS 3D Components, to be adaptively meshed and virtually repeated into the array lattice to produce a single global solution. A cornerstone feature is a patented non-conformal finite element meshing and solving technique. When combined with a highly intuitive antenna array UI, it offers tremendous flexibility in design with the option to include element types of differing shape, form and materials. Moreover, edge treatment considerations such as pattern distortion and tapering due to an enclosing radome can be fully accounted, leading to a highly accurate characterization of multiscale array-radome assemblies. This technology is ideal for capturing the full electromagnetic behavior of large complex antenna arrays. High-Performance Computing Electronics HPC ANSYS Electronics HPC enables parallel processing for solving the toughest and most challenging models — models with great geometric detail, large systems and complex physics. ANSYS goes well beyond simple hardware acceleration to deliver groundbreaking numerical solvers and HPC methodologies optimized for multicore machines, with scalability to take advantage of full compute cluster power. The amount of HPC required is based simply on the total number of cores used in the analysis, irrespective of which HPC technology is employed. Multithreading: ANSYS Electronics HPC takes advantage of multiple cores on a single computer to reduce solution time. Multithreading technology speeds up the initial mesh generation, matrix solves and field recovery. Spectral Decomposition Method: The spectral decomposition method (SDM) accelerates frequency sweeps by distributing multiple frequency points in parallel over compute cores and nodes. You can use this method in tandem with multithreading to speed up extraction of individual frequency points, while SDM parallelizes multi-frequency point extraction. Domain Decomposition Method: The domain decomposition method (DDM) accelerates the solution for larger and more complex geometries by distributing a simulation across multiple cores and networked nodes. This method is primarily designed to tackle larger problem size using distributed memory. It can also be combined with multithreading and SDM to provide improvements in simulation scalability and throughput. Periodic Domain Decomposition: Periodic domain decomposition applies DDM to finite periodic structures such as antenna arrays or frequency selective surfaces. This method virtually duplicates the geometry and mesh of the periodic structure’s unit cell and then applies the DDM algorithm to the resulting finite sized array to solve for the unique fields for all elements. Simulation capacity and speed are substantially increased. This method can be combined with multithreading and SDM to further accelerate the solution. Hybrid Domain Decomposition Method: Hybrid DDM uses the domain decomposition method on models consisting of finite element (FE) and integral equation (IE) domains. The HFSS IE solver add-on lets you create HFSS models that can solve extremely large EM problems. This methodology combines the virtues of FEM’s ability to handle complex geometries plus MoM’s efficient solutions for antenna and radar cross section analysis. Hybrid DDM can be combined with multithreading and SDM to provide further solution acceleration. Distributed Direct Matrix Solver: The distributed direct matrix solver is a distributed memory parallel technique for HFSS and the HFSS-IE solvers. The matrix solution is distributed across multiple cores or MPI-integrated computers. It results in solutions with improved scalability through increased MPI memory access, and enhanced speed through increased MPI networked core access for highly accurate direct matrix solver solutions. These distributed memory matrix solvers can be combined with multithreading and SDM to further increase simulation throughput. Distributed Memory Matrix Solver: The distributed memory matrix solver (DMM) is a distributed memory parallel technique for HFSS, including the finite element method (FEM) and integral equations (IE). The matrix solution is distributed across multiple cores of MPI-integrated compute nodes. It results in a reduced memory footprint per node and improves scalability and speed through increased MPI memory access and networking. The DMM solver is integrated in the Auto-HPC technology and can be orthogonally combined with the spectral decomposition method (SDM) to further increase simulation throughput. HPC in the Cloud: The ANSYS Cloud service makes high-performance computing (HPC) extremely easy to access and use. It was developed in collaboration with Microsoft Azure, a leading cloud platform for HPC. It has been integrated into the Electronics Desktop, so you can access unlimited, on-demand compute power from the design environment. Application brief: Cloud Computing for ANSYS Electromagnetic Designs To learn more about cloud computing, visit the ANSYS Cloud page. DDM distributes mesh subdomain solutions to multiple, including networked, compute cores. By solving these subdomains in parallel, you can realize a significant increase in simulation capacity and speed. Optimized User Environment The full-featured 3D solid modeler and layout interface enables you to work in a layout design flow, or to import and edit 3D CAD geometry. HFSS 3D Modeler: The 3D interface enables you to model complex 3D geometry or import CAD geometry for simulation of high-frequency components, such as antennas, RF/microwave components and biomedical devices. You can extract scattering matrix parameters (S, Y, Z parameters), visualize 3D electromagnetic fields (near- and far-field) and generate ANSYS Full-Wave SPICE models that link to circuit simulations. HFSS 3D Layout: HFSS 3D Layout is an optimized interface for layered geometry of PCBs, IC packages and on-chip passives. It is suitable for analyzing the signal integrity of PCBs and packages, including full-wave or radiative effects. Applications range from high-speed serial links with complex breakout regions and poorly referenced transmission lines, to patch antennas and millimeter-wave circuits. Engineers can draw or import geometry to analyze electromagnetic behavior, display radiated fields, investigate impedances and propagation constants, explore S-parameters or calculate insertion and return loss. The model is assembled and rendered in a Layout environment; however, all effects are rigorously simulated, including 3D features such as trace thickness and etching, bond-wires, and solder balls. Layout geometry is primarily described in 2.5D with a stack-up and specialized primitives such as vias, pins, traces and bond-wires. The editor is completely parametric, so trace widths or thicknesses can be easily varied or parameterized for sweeps, optimization or design-of-experiments (DOE). The HFSS solver within 3D Layout includes many features targeted specifically for PCB and package structures. These features include advanced meshing technology optimized for layered geometry and integrated circuit elements and S-parameters for modeling of discrete components. To accurately predict a system’s performance, analyzing the electronic interaction between components and subsystems in an integrated environment can be critical. HFSS 3D Layout allows for creation of a PCB assembly, connecting boards, ICs and discrete components. With this approach, you can pick and place 3D connector models on a PCB without the need to create a schematic. Electrical engineers have long used schematic-based design entry to connect models together for printed circuit boards, IC packages and components. This works well for relatively simple designs, but becomes tedious and error prone for larger and more complex designs. With layout-driven assembly, pin connections are automatically established based on the geometry. Once an assembly is created, HFSS 3D Layout can invoke a range of solvers appropriate for each component, or geometries can be merged and solved together. From the HFSS 3D Layout interface, you can access an expanding list of solvers, which include HFSS, SIwave and Planar EM. This allows for iterative design using fast SIwave solves, and rigorous verification using HFSS, all from the same design and geometry. RF Systems and Circuits When combined with HFSS, circuits and RF systems simulation technologies create an end-to-end high-performance workflow for RF, EMI/EMC and other applications. It includes EMIT, a unique multifidelity approach for predicting RF system performance in complex RF environments with multiple sources of interference. EMIT also provides the diagnostic tools needed to quickly identify root-cause RFI issues and mitigate problems early in the design cycle. These state-of-the-art circuit solvers address RF, analog, digital and mixed-signal designs with accuracy, high execution speed and robust capability to handle circuits with thousands of active and passive elements. Listed below are the features available in these simulation technologies. More information about these solutions can be found at the following applications: EMI RFI RF Desense EMIT RF link budget analysis Built-in wireless propagation models RF co-site and antenna coexistence analysis Automated diagnostics for rapid root-cause analysis Quick assessment and comparison of potential mitigation measures RF radio and component libraries Multi-fidelity behavioral radio models Antenna-to-antenna coupling models Circuit Analyses Linear Transient DC analysis with multiple continuation options Multitone harmonic balance analysis Shooting Method Oscillator analysis Autonomous Plus Driven Sources Option Time varying noise and phase noise analyses Envelope analyses Multicarrier Modulation Support Load pull analysis and model support Periodic transfer function analysis Transient analysis ANSYS EMIT solves the complete RF environment, including radio frequency interference. SI Circuits When combined with HFSS, SI Circuits can be used for analyzing signal integrity, power integrity and EMI issues caused by shrinking timing and noise margins in PCBs, electronic packages, connectors and other complex electronic interconnects. HFSS with SI Circuits can handle the complexity of modern interconnect design from die-to-die across ICs, packages, connectors and PCBs. By leveraging the HFSS advanced electromagnetic field simulation capability dynamically linked to powerful circuit and system simulation, engineers can understand the performance of high-speed electronic products long before building a prototype in hardware. This approach enables electronics companies to achieve a competitive advantage with faster time to market, reduced costs and improved system performance. The SI Circuits adds transient circuit analysis to HFSS. This enables engineers to create high-speed channel designs that include the driving circuitry as well as the channel. The driving circuitry can be transistor level, IBIS-based or ideal sources. When performing an analysis on these channels, you can select from a variety of analysis types: Linear network analysis (included with HFSS) Transient analysis QuickEye and VerifEye analyses for fast eye generation in high-speed channel design, bathtub curves, jitter and eye masks Monte Carlo analysis supporting Spectre® and HSPICE® functionality DC analysis with automated convergence Dynamic links with ANSYS Q3D Extractor and ANSYS SIwave IBIS-AMI analysis and model support DDR3 simulation performed with the ANSYS SI option, showing DQ, DQS and timing eye patterns. Multidomain System Modeling ANSYS Simplorer is a powerful platform for modeling and simulating system-level digital prototypes integrated with ANSYS Maxwell, ANSYS HFSS, ANSYS SIwave and ANSYS Q3D Extractor. Engineers can verify and optimize performance of their software-controlled, multidomain systems. With flexible modeling capabilities and tight integration to ANSYS 3D physics simulation, Simplorer provides broad support for assembling and simulating system-level physical models to help engineers connect conceptual design, detailed analysis and system verification. Simplorer is ideal for electrified system design; power generation; conversion; storage and distribution applications; EMI/EMC studies and general multidomain system optimization and verification. Simplorer Features: Circuit simulation Block diagram simulation State machine simulation VHDL-AMS simulation Integrated graphical modeling environment Model Libraries Analog and power electronics components Control blocks and sensors Mechanical components Hydraulic components Digital and logic blocks Application-specific libraries Aerospace electrical networks Electric vehicles Power systems Characterized manufacturers components Reduced order modeling Power electronic device and module characterization Co-Simulation with MathWorks Simulink EMI Solution The EMI solution within ANSYS SIwave and ANSYS HFSS quickly identifies potential trouble spots and investigates them with proper what-if experiments for actionable design-rule violations in PCBs and packages, thus eliminating errors and speeding time to market. It constitutes two segments — the EMI Scanner and EMI Xplorer. The EMI Scanner provides automatic and customizable EMI design rule checks of PCBs and quickly identifies areas of potential interference on PCB designs prior to simulation. EMI issues are traditionally difficult to detect and simulating these problems requires hours of computational time. EMI Scanner is fast, efficient and beneficial for identifying EMI problems so you can avoid costly testing and time-intensive simulations. The EMI Xplorer complements the EMI Scanner in ANSYS SIwave and ANSYS HFSS and examines the shades of gray in a violation to determine how severe it might be. Depending upon the result of the analysis performed in EMI Xplorer, mitigation measures are taken in SIwave or HFSS as necessary. Many types of violations on a PCB are analyzed by the EMI Xplorer where you can easily adjust the design rule parameters or define additional rules as needed. It allows you to study the impact of rule violations on trace impedance, losses, edge current, noise voltage etc., without changing the original design. As an example, consider a critical net crossing a split in an adjacent reference plane. The design rule mandates adding at least two stitching capacitors within some maximum distance of the crossing. EMI Xplorer calculates the voltage across the split for the actual, desired and worst-case scenarios pertaining to the specified distance to the stitching capacitors. You can then perform multiple what-if experiments in EMI Xplorer to analyze these scenarios and ensure that the voltage across the gap is below the desired limit. EMI Xplorer minimizes potential board- and package-level EMI problems prior to running the final verification with time-consuming 3D simulations.   ANSYS Electronics Desktop The ANSYS Electronics Desktop environment houses the ANSYS gold-standard electromagnetics simulation applications. Tight integration among the simulators yields unprecedented ease of use for setup and solution of complex simulations for design and optimization. It is the native desktop for HFSS, Maxwell, Q3D Extractor, Twin Builder and other simulators. More information is available on this page.   Optimetrics Parameterization and optimization are key enablers for Simulation-Driven Product Development. Parametric analysis provides a thorough understanding of the design space based on your design variables, so that you can make better engineering decisions. Optimization algorithms enable the software to automatically find better designs. Parameterization and optimization capabilities available with HFSS include: Parametric analysis User-specified range and number of steps for parameters Automatic analysis of parameter permutations Automated job management across multiple hardware platforms and reassembly of data for parametric tables and studies Optimization User-selectable cost functions and goal objectives, including: Quasi-Newton method Sequential nonlinear programming (SNLP) Integer-only sequential nonlinear programming Sensitivity Analysis Design variation studies to determine sensitivities to: Manufacturing tolerances Material properties Tuning User-controllable slide-bar for real-time tuning display and result Statistical Analysis Design performance distribution versus parameter values Pareto-front analysis of electric machine Network Data Explorer Network Data Explorer provides a convenient way to plot and analyze large sets of single-ended or mixed-mode S-, Y- and Z-parameter data and export that data in a variety of different formats. It also acts as a front end to ANSYS Full-Wave SPICE: S-parameter data can be converted to passive, causal, SPICE-compatible models using ANSYS' patented state-space ROM technology. For low frequency applications, Network Data Explorer offers visualization, analysis and manipulation tools for network data pertaining to 3D and 2D eddy current solutions.   ANSYS HFSS - Packages HFSS is available as part of the Electronics Pro, Premium and Enterprise product suite. Listed below is a sampling of capabilities at each level that are most relevant for designing high-frequency applications. Electronics Pro 2D: 2D Extraction EMIT Nexxim Circuit (DC, Transient, RF) Electronics Premium HFSS: All HFSS 3D solvers ECAD and MCAD modeling and translation Advanced Circuit Analysis Electronics Pro 2D Electronics Enterprise: Electronics Premium (HFSS, SIwave, Maxwell, Q3D Extractor, Icepak) Accelerated Doppler Processing for SBR+ Design of Experiments SpaceClaim Design Modeler   --> The complete list of the Electronics Product Package contents is available in the table below. Electronics Product Package Contents Electronics Pro 2D Electronics Premium HFSS Electronics Premium Maxwell Electronics Premium Q3D Extractor Electronics Premium Icepak Electronics Premium SIwave Electronics Enterprise Electronics Desktop 2D Prep/Post Maxwell 2D, PExprt, RMxprt 2D Extractor Simplorer (Analog and Digital) EMIT Optimetrics Nexxim Circuit (DC, Transient, RF) Nexxim Circuit (SI)   Electronics Desktop 3D Prep/Post   ECAD & MCAD Translation   Network Data Explorer   HFSS           Maxwell 3D           Q3D Extractor           Icepak           SIwave (DC, AC)           SIwave (Transient, HFSS Regions, EMI, etc.)             Design of Experiments             SpaceClaim Design Modeler             Accelerated Doppler Processing            

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Ansys Cloud Free Trial Web Page Products

Ansys Cloud provides current Ansys Mechanical, Ansys Fluent and Ansys Electronics Desktop users with easy access to on-demand high-performance computing (HPC) in the cloud from within Ansys desktop applications. Without involvement from your information technology team, Ansys Cloud helps you solve with maximum computing power, slashing your time to solution. With an Ansys Cloud trial, you can experience running Ansys simulations in the cloud at no cost. Your trial includes a free 30-day subscription to Ansys Cloud service and 1,000 ANSYS Elastic Units for leveraging Ansys solvers and cloud hardware. About the Trial Requirements: An installation of Ansys 2019 R2 or later is recommended and a license of Mechanical, Fluent, or Electronics Desktop. Non-Ansys users can evaluate Ansys Cloud by leveraging built-in Virtual Display Infrastructure (VDI) functionality. Trial Features: During the trial period, leverage the many capabilities that bundles with a paid Ansys Cloud service subscription, including: Access Ansys Cloud Forum: Obtain answers to your questions about the service. Utilize Ansys Cloud’s web portal to download the desktop app. Solve your Mechanical, Fluent, Ansys HFSS, Ansys SIwave, Ansys Q3D, Ansys Icepak and Ansys Maxwell models on preconfigured virtual machines on Microsoft® Azure™. Monitor your job progress from within your desktop application or via the web portal. Visualize your 3D results in a cloud-based post-processor. Use Ansys Cloud’s remote desktop application to access all features of Ansys software completely via the cloud, including interactive pre- and post-processing. Store your simulation data in Ansys Cloud. Transfer data to and from Ansys Cloud. Receive complete technical support from Ansys flagship product and HPC experts Take advantage of our 24/7 customer support to resolve job issues in Ansys Cloud.

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Upcoming Ansys Webinars

Harness the full potential of ANSYS simulation to achieve your product goals by registering for an upcoming webinar. Choose from the many topics below or find additional webinars on the ANSYS calendar. Webinars for the academic community are listed below.--> --> Ansys Maxwell: An In-Depth Overview July 30, 2020, at 11 a.m. EDT / 3 p.m. GMT / 8:30 p.m. IST Learn about Ansys Maxwell’s enhanced key capabilities, such as automatic adaptive meshing, high-performance computing, multidomain system modeling, power electronic circuits, advanced material modeling and more. Learn More --> Ansys 2020 R2: System Coupling Overview August 4, 2020, at 11 a.m. EDT / 3 p.m. GMT / 8:30 p.m. IST Learn how Ansys System Coupling manages data exchange and coordinates independent solver executions to perform multiphysics simulations that accurately capture the complex interactions between physical models, typically simulated in separate solvers, that are critical in understanding the whole problem. Learn More --> Ansys 2020 R2: What’s New in Ansys Twin Builder August 4, 2020, at 11 a.m. EDT / 3 p.m. GMT / 8:30 p.m. IST This webinar highlights Ansys Twin Builder’s many exciting enhancements and provides a detailed look at using Twin Builder to construct, validate and deploy complete systems simulations and digital twins for predictive maintenance. Learn More --> Introduction to Ansys Chemkin-Pro August 4, 2020, at 11 a.m. EDT / 3 p.m. GMT / 8:30 p.m. IST Learn the basics of Ansys Chemkin-Pro, such as how it is typically used in conjunction with CFD and how to get started using it. Watch demonstrations of building an ignition-delay table, preparing a fuel model for use in CFD, and performing mechanism reduction and optimization. Learn More --> Watertight Meshing for Oil and Gas August 5, 2020, at 11 a.m. EDT / 3 p.m. GMT / 8:30 p.m. IST This webinar will showcase the simplicity of Ansys Fluent’s watertight geometry meshing workflow. Learn how this workflow guides you through the meshing process by presenting best practices in an organized interface. Learn More --> Accelerating Innovation in Medical Devices Through Simulation August 6, 2020, at 2 a.m. EDT / 6 a.m. GMT / 11:30 a.m. IST Learn about medical device development using a systems simulation solution for a wearable drug delivery device that illustrates the complexities of developing these multi-disciplinary systems. Learn More --> Ansys 2020 R2: Ansys Forte Update August 6, 2020, at 11 a.m. EDT / 3 p.m. GMT / 8:30 p.m. IST Learn how Ansys Forte can now quickly and accurately simulate positive-displacement compressors, generating a solution 3–5X faster than established methods. Learn More --> Power Electronics/Systems Design, Modeling and Analysis August 7, 2020, at 2 p.m. EDT / 6 p.m. GMT / 11:30 p.m. IST This webinar highlights Ansys’ suite of design, modeling and analysis tools for magnetics, power device characterization, cabling, bus bars, PCB parasitics, EMI/EMC and thermal solutions to address all aspects of power electronics and power systems. Learn More --> Particle Methods and Applications Using Ansys LS-DYNA August 12, 2020, at 2 a.m. EDT / 6 a.m. GMT / 11:30 a.m. IST Learn about the capabilities of mesh-free particle solvers and their applications using Ansys LS-DYNA. Learn More --> Ansys 2020 R2: FENSAP-ICE Update August 13, 2020, at 11 a.m. EDT / 3 p.m. GMT / 8:30 p.m. IST Learn how Ansys FENSAP-ICE can be used to simulate ice cracking and shedding for rotating components including fan blades, propellers and helicopter rotors. We also discuss support for Ansys CFX conjugate heat transfer (CHT) analysis to assess anti-icing performance. Learn More --> Ansys 2020 R2: Cloud Updates August 18, 2020, at 11 a.m. EDT / 3 p.m. GMT / 8:30 p.m. IST Learn how new features in Ansys Cloud help you leverage HPC resources, including compatibility with Ansys LS-DYNA; access to a Virtual Desktop for post-processing in the cloud; and the ability to connect existing Ansys licenses to the Ansys Cloud. Learn More --> Planar Magnetic Transformers August 18, 2020, at 11 a.m. EDT / 3 p.m. GMT / 8:30 p.m. IST Learn how Ansys tools can solve a frequency-dependent, two-way coupled magnetic-thermal planar transformer model. Ansys Simplorer can then determine the efficiency of the device in a complete system model. Learn More --> Ansys 2020 R2: SpaceClaim Update August 19, 2020, at 11 a.m. EDT / 3 p.m. GMT / 8:30 p.m. IST Learn more about important Ansys SpaceClaim updates, including block recording and bidirectional CAD interfaces, constraint-based sketching and autoskinning of topology optimization results. Learn More --> Heat Flux Measurements in Hypersonic Environments August 19, 2020, at 11 a.m. EDT / 3 p.m. GMT / 8:30 p.m. IST Learn how to overcome the numerous challenges of measuring heat flux to a hypersonic vehicle/test article using Ansys simulation solutions. Learn More --> Ansys 2020 R2: Additive Solutions Update August 20, 2020, at 11 a.m. EDT / 3 p.m. GMT / 8:30 p.m. IST Learn about new features in Ansys Additive Suite that enable you to add your own user-defined materials; import EOS build files; and simulate cutoff, heat treatment and other advanced scenarios in Print to Workbench workflows Learn More --> Ansys 2020 R2: Discovery Live and AIM Update August 20, 2020, at 11 a.m. EDT / 3 p.m. GMT / 8:30 p.m. IST See what’s new in 3D design, including accelerated simulation speeds and enhanced topology optimization in Ansys Discovery Live, and a new option for analyzing an exponential pressure-penetration relationship in Ansys Discovery AIM. Learn More -->

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Simulation Capabilities | ANSYS Maxwell Web Page Products

Low Frequency Electromagnetic Field Simulation ANSYS Maxwell is a premier low-frequency electromagnetic field simulation solution which uses the highly accurate finite element method to solve static, frequency-domain, and time-varying electromagnetic and electric fields. Maxwell includes a wide range of solution types for a complete design flow for your electromagnetic and electromechanical devices. Solvers included with ANSYS Maxwell: Magnetic transient — Nonlinear analysis with: Rigid motion — rotation, translational, non-cylindrical rotation External circuit coupling Permanent magnet demagnetization analysis Core loss computation Lamination modeling including manufacturing process dependency for 2D/3D Irreversible temperature dependency on demagnetization of permanent magnets Magnetic vector hysteresis Magnetoresistive modeling in 2D/3D AC electromagnetic — Analysis of devices influenced by skin/ proximity effects, eddy/displacement currents Magnetostatic — Nonlinear analysis with automated equivalent circuit model generation Electric field — Transient, electrostatic/current flow analysis with automated equivalent circuit model generation Automatic, Adaptive Meshing A key benefit of Maxwell is its automatic adaptive meshing techniques, which require you to specify only the geometry, material properties and the desired output to obtain an accurate solution. The meshing process uses a highly robust volumetric meshing technique and includes a multithreading capability that reduces the amount of memory used and accelerates time to solution. This proven technology eliminates the complexity of building and refining a finite element mesh and makes advanced numerical analysis practical for all levels of your organization. High-Performance Computing Adding an ANSYS Electronics HPC license to Maxwell opens a world of bigger, faster and higher-fidelity simulations. ANSYS goes well beyond simple hardware acceleration to deliver groundbreaking numerical solvers and HPC methodologies that are optimized for single multicore machines and scalable to take advantage of full cluster power. HPC in the Cloud The ANSYS Cloud service makes high-performance computing (HPC) extremely easy to access and use. It was developed in collaboration with Microsoft® Azure™, a leading cloud platform for HPC. It has been integrated into ANSYS Electronics Desktop, so you can access unlimited, on-demand compute power from the design environment. For more information visit the ANSYS Cloud page. Time Decomposition Method The Time Decomposition Method delivers computational capacity and speed for the full transient electromagnetic field simulations required for electric motors, planar magnetics and power transformers. This patent-pending technology enables you to solve all time steps simultaneously instead of sequentially, while distributing the time steps across multiple cores, networked computers and compute clusters. The result is a phenomenal increase in simulation capacity and speed. Multithreading Take advantage of multiple cores on a single computer to reduce solution time. Multithreading technology speeds up the initial mesh generation, direct and iterative matrix solves, and field recovery. Spectral Decomposition Method The majority of electromagnetic simulations require results such as RLC parameters, torque and loss. Spectral decomposition distributes the multiple frequency solution in parallel over compute cores to accelerate frequency sweeps. You can use this method in tandem with multithreading. Multithreading speeds up extraction of each individual frequency point, while spectral decomposition performs many frequency points in parallel. High Speed Simulation Performance for Induction Machine analysis using Time Decomposition Method Multidomain System Modeling Simplorer is a powerful platform for modeling, simulating and analyzing system-level digital prototypes integrated with ANSYS Maxwell, ANSYS HFSS, ANSYS SIwave, and ANSYS Q3D Extractor. Simplorer enables you to verify and optimize the performance of your software-controlled, multidomain systems. With flexible modeling capabilities and tight integration with ANSYS 3D physics simulation, Simplorer provides broad support for assembling and simulating system-level physical models to help you connect conceptual design, detailed analysis and system verification. Simplorer is ideal for electrified system design, power generation, conversion, storage and distribution applications, EMI/EMC studies and general multidomain system optimization and verification. Features: Circuit simulation Block diagram simulation State machine simulation VHDL-AMS simulation Integrated graphical modeling environment Power electronic device and module characterization Co-simulation with MathWorks Simulink Model libraries: Analog and power electronics components Control blocks and sensors Mechanical components Hydraulic components Digital and logic blocks Application-specific libraries: Aerospace electrical networks Electric vehicles Power systems Characterized manufacturers components Reduced Order Modeling   Multiphysics Maxwell's electromagnetic field solvers are linked through ANSYS Workbench to the complete ANSYS engineering portfolio. By coupling the electromagnetic field solution with other solvers, you can examine coupled physics phenomena and achieve the highest fidelity solution to eliminate reliability problems and design safe and effective products. The ANSYS platform manages the data transfer between physics solutions and handles solver interactions, so you can easily set up and analyze complex coupled-physics behaviors such as: Electromagnetic–Structural with deformed mesh feedback Electromagnetic–Structural with stress and strain feedback on magnetic properties Electromagnetic–Fluids Electromagnetic–Structural–Fluids Electromagnetic–Structural Dynamics–Acoustics Harmonic force coupling The transient 3D solver in ANSYS Maxwell is valuable for achieving the noise, vibration and harshness (NVH) goals of low frequency applications such as electric vehicles (EVs), transformers, traction drive trains, pumps, fans, turbomachinery, etc. This transient 3D solver supports element-based volumetric harmonic force coupling for many low frequency applications and improves their design to meet noise regulation guidelines. Maxwell is used for the transient electromagnetic simulation to calculate the forces which are directly mapped to ANSYS Mechanical through ANSYS Workbench for harmonic analysis. Optionally, an acoustic analysis can be performed to study noise. The forces from Maxwell are mapped as force vectors within the volume of the individual mesh elements, allowing a detailed and accurate form of mapping. This is because element-based mapping allows forces to be calculated for individual mesh elements, increasing the accuracy. Noise, vibration and harshness ANSYS Maxwell has a significant new capability for noise, vibration and harshness (NVH) analysis of electrical machines and transformers. NVH is an important analysis required by manufacturers of motors used in hybrid/electric vehicles, appliances, commercial transformers and other applications where quiet operation is an essential design parameter. Two-way transient magnetostriction coupling enables the magnetostrictive forces to be added to the magnetic forces and coupled to a mechanical design to predict acoustic noise. Read the Application Brief - Electric Machine Noise and Vibration Electric motor cooling system design: Path Lines, static pressure and temperature distributions (based on CFD solution) with power loss input (based on Maxwell solution) Expert Design Interfaces Maxwell includes two specialized design interfaces for electric machines and power converters. RMxprt – Rotating Electric Machines RMxprt calculates machine performance, makes initial sizing decisions and performs hundreds of "what if" analyses in a matter of seconds. In addition to providing classical motor performance calculations, RMxprt automatically generates geometry, motion and mechanical setup, material properties, core loss, winding and source setup for detailed finite element analysis in Maxwell. In addition, RMxprt automatically generates geometry, corresponding material properties assignment, boundaries and excitation conditions for detailed electronics cooling simulation using CFD in ANSYS Icepak. PExprt – Electronic Transformers and Inductors PExprt's template-based interface for transformers and inductors can automatically create a design from voltage waveform or converter inputs. The autodesign process considers all combinations of core shapes, sizes, materials, gaps, wire types and gauges, and winding strategies to optimize the magnetic design. PExprt creates Maxwell models to evaluate the magnetic properties based on finite element analysis. This enables you to assess quantities such as flux density in the core and current density distribution in the windings. Template-based solution with automatic Maxwell model generation for electric machines design analysis Template-based solution with Maxwell model creation for electronic transformers and planar magnetic configurations Optimetrics Parameterization and optimization are key enablers for Simulation-Driven Product Development. Parametric analysis provides a thorough understanding of the design space based on your design variables, so that you can make better engineering decisions. Optimization algorithms enable the software to automatically find better designs. Parameterization and optimization capabilities available with Maxwell include: Parametric analysis User-specified range and number of steps for parameters Automatic analysis of parameter permutations Automated job management across multiple hardware platforms and reassembly of data for parametric tables and studies Optimization User-selectable cost functions and goal objectives, including: Quasi-Newton method Sequential nonlinear programming (SNLP) Integer-only sequential nonlinear programming Sensitivity Analysis Design variation studies to determine sensitivities to: Manufacturing tolerances Material properties Tuning User-controllable slide-bar for real-time tuning display and result Statistical Analysis Design performance distribution versus parameter values Pareto-front analysis of electric machine Advanced Electromagnetic Material Modeling Accurately predicting performance of electric machines often depends on the operating temperature and loading history of its components. These effects can be accurately accounted for with Maxwell's advanced material modeling capabilities. Vector Hysteresis ANSYS Maxwell employs a vector hysteresis model to accurately predict the minor loops and losses for soft and hard magnetic materials and permanent magnets. The model accounts for both isotropic and anisotropic materials, laminated and non-laminated structures, and the magnetic behavior of ferromagnetic materials when the magnetic operating point history has significant impact on the performance of such devices. Temperature-Dependent Permanent Magnets ANSYS Maxwell's demagnetization analysis features enable you to study permanent magnet demagnetization characteristics extended into the third quadrant. External magnetic fields and heating can alter the magnetic properties of permanent magnets, leading to local demagnetization. You can combine these effects to accurately determine the performance of a machine. Core Loss Maxwell accurately computes core loss in magnetic materials. Electromagnetic degradation in laminate components and motor assemblies is difficult to predict because of the gap between virgin material data provided by the material supplier and the actual material performance when subjected to real operating conditions. Maxwell takes into account the feedback of the core-loss effect based on a unique algorithm that is predictable, reliable and easy to use. Magnetostriction Based on sequential load transfer couplings between ANSYS Maxwell and ANSYS Mechanical solvers, designers can model materials whose magnetic characteristics are strongly dependent on mechanical stress and strain. These effects cause energy loss due to frictional heating in ferromagnetic cores. The effect is also responsible for the low-pitched humming sound that can be heard coming from transformers, caused by oscillating AC currents, which produce a changing magnetic field. Similarly, for rotating electric machines, the reluctance forces and forces due to magnetostriction acting on the stator teeth are major causes of noise emission. Magnetic field distribution on hysteresis motor employing magnetic vector hysteresis modeling PM demagnetization study on IPM motor design illustrating different levels of performance (torque profile) prediction considering local demagnetization due to magnetic field and thermal load effects Core-loss distribution on power transformer laminated core and stator frame deformation due to electromagnetic conditions with corresponding frequency response for acoustic analyses GRANTA Materials Data for Simulation The ANSYS GRANTA Materials Data for Simulation dataset in ANSYS Electronics Desktop puts a wealth of materials information at your fingertips. You have easy access to a library of 700+ new generic materials and 500+ producer-specific materials to support modeling of electrical and electronic devices. The data set contains temperature-dependent mechanical and thermal properties, as well as electromagnetic materials properties. All materials data are simulation-ready, saving you the effort of finding, entering and transforming data into a suitable format before using it in your designs. Coverage includes ferrous and nonferrous metals, engineering plastics, various types of ceramics, concrete, glass, wood, composites, liquids, gases, solders and PCB laminates. This large materials database helps you make informed choices when developing products. A unified materials database across multiple solvers in Electronics Desktop and other ANSYS products ensures that you are drawing from the same materials properties when performing multiphysics simulations. In the core Materials Data for Simulation dataset , each record describes a generic material type that is representative of a broader class of material grades. This makes it easy to compare properties across the full range of material options and supports analysis during the early stages of the design process. In ANSYS Maxwell, you benefit from an additional set of 500+ records that provide B-H curves and core-loss data for producer-specific grades of magnetic materials that are relevant for electromechanical simulation, enabling more exact analysis. Utilizing accurate and reliable data collated by ANSYS Granta, leaders in materials information, improves device performance, accuracy and reliability, and avoids delays in product launch. Network Data Explorer Network Data Explorer provides a convenient way to plot and analyze large sets of single-ended or mixed-mode S-, Y- and Z-parameter data and export that data in a variety of different formats. It also acts as a front end to ANSYS Full-Wave SPICE: S-parameter data can be converted to passive, causal, SPICE-compatible models using ANSYS' patented state-space ROM technology. For low frequency applications, Network Data Explorer offers visualization, analysis and manipulation tools for network data pertaining to 3D and 2D eddy current solutions.   ANSYS Electronics Desktop The ANSYS Electronics Desktop environment houses the ANSYS gold-standard electromagnetics simulation applications. Tight integration among the simulators yields unprecedented ease of use for setup and solution of complex simulations for design and optimization. It is the native desktop for HFSS, Maxwell, Q3D Extractor, Twin Builder and other simulators. More information is available on this page.   ANSY Maxwell Packages Maxwell is available as part of the Electronics Pro, Premium and Enterprise product suite. Listed below is a sampling of capabilities at each level that are most relevant for designing low frequency applications. Electronics Pro 2D: 2D Low Frequency Static and Transient solvers Expert Design Interfaces for Rotating Machines and Transformers Analog and Digital Circuit Analysis Electronics Premium Maxwell: 3D Low Frequency Static and Transient solvers ECAD and MCAD modeling and translation Advanced Circuit Analysis Electronics Pro 2D Electronics Enterprise: Design of Experiments ANSYS SpaceClaim Design Modeler Electronics Premium (Maxwell, Icepak, HFSS, Q3D Extractor, SIwave) The complete list of the Electronics Product Package contents is available in the table below. Electronics Product Package Contents Electronics Pro 2D Electronics Premium HFSS Electronics Premium Maxwell Electronics Premium Q3D Extractor Electronics Premium Icepak Electronics Premium SIwave Electronics Enterprise Electronics Desktop 2D Prep/Post Maxwell 2D, PExprt, RMxprt 2D Extractor Simplorer (Analog and Digital) EMIT Optimetrics Nexxim Circuit (DC, Transient, RF) Nexxim Circuit (SI)   Electronics Desktop 3D Prep/Post   ECAD & MCAD Translation   Network Data Explorer   HFSS           Maxwell 3D           Q3D Extractor           Icepak           SIwave (DC, AC)           SIwave (Transient, HFSS Regions, EMI, etc.)             Design of Experiments             SpaceClaim Design Modeler             Accelerated Doppler Processing            

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