This video describes how to implement HPC license pools and packs within ANSYS SIwave.
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Learn how easy it is to access the power and performance of Ansys Cloud by submitting a batch solve directly from Ansys Fluent running on a local workstation. This demonstration shows you how to set up and run a CFD simulation on 32 cores involving an aircraft in Ansys Cloud and monitor it as it runs by accessing the full solver transcript. You can also see the convergence graph to watch the progress of the solver, investigate job timing information via the analytics view and explore any issues that occur in the debug view. When the simulation is complete, you can perform post-processing in the cloud.
For today’s product designs, simulations are larger and more numerically complex than ever. Meshes are finer, more geometric detail is required, and physical phenomena need sophisticated treatment. ANSYS HPC supports parallel processing, distributed solving, parametric analysis, multiphase models and other capabilities that speed numerically large analyses.
The Lenovo NeXtScale System addresses the increasing data and computing challenges coming along with ANSYS simulations by delivering dense performance across a variety of functions—from compute, I/O , storage, and acceleration—in more cost- and energy- efficient ways than ever before. AA
According to a recent survey, 40% of engineers limit the size or amount of detail for every simulation model due to compute capacity and turnaround time constraints. Recognizing this, smaller and mid-sized companies now seek more affordable, accessible and powerful hardware, making high-performance computing (HPC) a necessity. Nevertheless, many misconceptions still surround HPC and cloud deployment models as well as HPC and cloud licensing. These fallacies prevent adoption in product development scenarios where HPC — available on-premise and in the cloud — clearly provides a higher return on investment.
Join us for this free webinar which dispels leading misconceptions and provides insight to help you steer around possible failure points as you consider on-premise or cloud-based HPC.
Discover how to leverage on-demand cloud computing within structures, fluids and electronics tools to significantly reduce turnround time for compute-intensive problems.
Learn how to optimize the cost of your simulation usage by mixing elastic (usage-based) and traditional (lease or paid-up) licensing.
Receive guidance on certified remote displays and VDI solutions, as well as affordable turnkey HPC appliances that simplify on-premise HPC deployment.
Get tips on using the cloud to safeguard your data, cut costs and simultaneously migrate your workloads.
The need for speed for an engineer doing simulation is never ending. Asking “what hardware is best for simulation?” is met with the answer “how much can you spend?” The trend has been spending more money and buying a more powerful workstation.
But modern engineers are finding another solution, one that involves renting rather than buying. Massive arrays of computing power, millions of dollars’ worth of high-performance hardware, is available by the hour. If your monthly bill gets too high, you may be able to justify your personal, mini cluster of high-performance computing (HPC).
In this webinar, we reveal our research on all the fast hardware options. You will also hear from a leading authority on HPC from the simulation software industry on what works best for their software.
Tune in to discover the answers to these questions:
Am I wasting my time defeaturing?
What should I look for in a fast workstation?
What is an HPC cluster appliance and do I need it?
For whom does HPC make sense?
How do I justify HPC use or purchase?
Design for reliability is a key consideration for the successful signoff of next-generation FinFET system-on-chip (SoC) applications including autonomous vehicles, advanced driver assistance systems, 5G communication electronics, mobile and high-performance computing. Ansys provides comprehensive workflows with foundry-certified accuracy for multiphysics simulations across chips, packages and systems that capture the various failure mechanisms and provide signoff confidence for first-time silicon success.
Join us for this free webinar which provides a detailed analysis of Ansys’ multiphysics reliability signoff solution for next-generation FinFET SOCs.
Learn how Ansys addresses multiphysics reliability signoff challenges for advanced FinFET SoCs.
Discover how Ansys chip-package-system reliability signoff solutions address thermal, thermal-aware electromigration, failure in time and electrostatic discharge to create robust and reliable electronics systems.
Receive expert tips on using Ansys comprehensive workflows to capture failure mechanisms and deliver signoff confidence.