A roundup of media articles on engineering simulation.
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Data center servers, storage and networking equipment communicate over copper and optical cable assemblies joined by ever-faster connectors. Samtec leverages a comprehensive suite of simulation software from ANSYS to design and optimize next-generation, high-performance interconnect solutions across the entire signal channel.
It is not uncommon to have a design fail in the field due to signal integrity issues even though simulation shows it should work perfectly because the as-manufactured product differs from the design definition. To avoid this problem, the signal integrity engineer needs to understand what will actually be delivered and use simulation to verify that the frequency- and time-domain performance will meet the design requirements. Simulation can be used to address the question of how differences between as-designed and as-built vias might degrade time- and frequency-domain performance of printed circuit boards (PCBs).
Signal integrity has emerged as a major issue in the design of high-speed electronics. While signal crosstalk has been a challenge for electrical engineers for some time, the proliferation of electronics in our lives amplifies the negative consequences of bad design practices. The ANSYS Electronics Desktop, which includes enhancements to ANSYS HFSS and ANSYS SIwave, is an essential tool for engineers looking to address electronic system reliability issues, such as signal integrity, power integrity and EMI/EMC. Interconnect Engineering, Inc. used these simulation tools to analyze a customer case involving a DDR3-800 board. They determined that unexpected crosstalk was originating in the BGA vias, and solved the problem by routing layers closer to the primary side of the PCB.
Smart Modular Technologies engineers leverage the ANSYS Electronics Desktop platform to reduce the time required to perform signal integrity analysis of a high-speed printed circuit from days to hours. By using unified electromagnetic, thermal and structural simulation, engineers developed a reliable adapter.
Networking experts predict that, by 2021, 66 percent of all internet traffic will be used for high throughput services such as wireless docking, video streaming, cloud backup and virtual reality. Peraso Technologies enables users to cut the cord and go wireless by providing chipsets based on the emerging 802.11ad (WiGig) standard that delivers high-speed wireless throughput in a USB 3.0 stick form factor. Peraso engineers used ANSYS simulation software to solve thermal problems associated with packing high power transmitters into a tiny enclosure.
As electronics become more and more pervasive in our lives and businesses, the complexity of design increases exponentially, requiring advanced electronics simulation to develop the reliable products we can no longer flourish without.