Interview article with ANSYS about its new solution for high-performance computing (HPC) on the cloud.
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Cloud computing reduces by 80 percent the time required for a coupled CFD and structural simulation.
HPC in the cloud reduces runtime for a complex multiphase CFD model with realistic particle loading from five days to two days.
As consumer electronics manufacturers squeeze more and more functionality into smaller and smaller packages, thermal management is a critical design consideration. Here, Alan Wong discusses challenges in the cooling industry — and explains why the world’s leading electronics companies and other innovators rely on Aavid for custom thermal management solutions and, increasingly, engineering services.
The design of electrical machines for use in electric and hybrid electric vehicles (EV/HEV) is very much dependent on fl uctuation of cost of materials due to market pressures. Electric machines that use interior permanent magnets rely on rare earth metals that can vary drastically in price over a relatively short period of time. This unpredictability forces design engineers to look at alternative machine designs, such as three-phase induction motors, which are susceptible to fl uctuation in the price of copper.
Data center servers, storage and networking equipment communicate over copper and optical cable assemblies joined by ever-faster connectors. Samtec leverages a comprehensive suite of simulation software from ANSYS to design and optimize next-generation, high-performance interconnect solutions across the entire signal channel.
Using engineering simulation, big compute and 3-D printing, Optisys achieves orders-of-magnitude reduction in antenna size and weight while reducing development time. By leveraging ANSYS electromagnetic and structural simulation tools running on Rescale’s big compute platform, this startup’s engineers take full advantage of the design freedom offered by 3-D printing to meet radio frequency (RF) performance requirements for an integrated array antenna.