Solid-state drives are a cost-effective way to add fast memory to workstations.
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DENSO Corporation standardizes on ANSYS structural software to expedite global product development.
Rosenberger leverages mechanical and electrical simulation to provide a superior alternative to traditional spring pins for semiconductor testing.
Finite element analysis is used to study crack initiation on a serrated blade.
Technip automates evaluation of 20,000 simulation runs to ensure that subsea pipe structures can survive worst-case scenarios.
Moldex3D and ANSYS Mechanical team up to simulate microchip encapsulation. Despite recent trends in copper internal heat spreaders, a significant fraction of ICs are encapsulated by plastic, a process that is usually accomplished by transfer molding.Through the coupling of Moldex3D® from Coretech System Co. and ANSYS Mechanical simulation software, engineers can analyze the complicated physical phenomena inherent in the encapsulation process and further optimize the package design. The nonlinear capability of ANSYS Mechanical technology is critical.
Optimizing Linux clusters for ANSYS Mechanical software delivers fast turnaround on large problems.