Avoiding Excess Heat in TSV-Based 3-D IC Designs - Article - ANSYS Advantage - V4 I2

Engineers use coupled simulation tools to resolve thermal issues at through-silicon vias (TSVs) early in development of high-density 3-D IC modules.

Share:

I want to receive updates and other offers from Ansys and its partners. I can unsubscribe at any time. ANSYS Privacy Notice

Start a conversation with Ansys

Contact Us