Achieve Silicon-to-System Success at IDEAS Digital Forum
September 23-24, 2020
Ansys is at the forefront of semiconductor enablement in partnership with the world’s leading companies for AI and machine learning, high-performance computing, 5G, hardware security and autonomous vehicles.
Join us for the IDEAS Digital Forum — a place to catch up on the latest advances in semiconductors, meet executives, listen to thought leadership keynotes and learn from expert chip designers at the world’s major semiconductor companies.
IDEAS will give you technical insights into the most advanced IC design projects and show you how they use multiphysics to design, optimize and verify a broad array of project styles — including high-speed custom designs, low-power RTL analysis, 2.5D/3D-IC stacking and giant sub-7nm digital chip
Meet your industry peers and fellow designers at this premier virtual event for networking, sharing and learning the latest semiconductor design information.
Industry Keynotes and Panel
Tap into cutting-edge insights from industry leaders as they discuss technology and market trends for 5G, autonomous vehicles, AI/ML, high-performance compute and hardware security.
Technology Sessions
Learn about the latest methodologies and best practices for low-power chip design, 3DIC analysis, power integrity signoff, on-chip electromagnetics and more.
Latest Product Updates
Find out the latest product enhancements and explore the advanced technologies that solve your cutting-edge design challenges.
Technology Topics include:
Interaction of Voltage Drop and Timing
Advanced IR-Drop and Electromigration Diagnostic
Power and Signal Integrity Signoff for 2.5D/3D-ICs
Thermal Analysis of 2.5D/3D Packages
RTL Power Analysis and Vector Profiling
Electromagnetic Crosstalk and Modeling for High Speed Signals
Transistor-Level Power and ESD Checking
Ultra-High Capacity Distributed Analysis for Sub-7nm Technologies
Keynote Speakers
Len Orlando III, Air Force Research Laboratory Sensors Directorate, Wright Patterson AFB
Keynote: Securing Systems for Future Defense Applications
Prith Banerjee, CTO, Ansys
Keynote: Using Artificial Intelligence in Engineering Simulation
Vic Kulkarni, VP and Chief Strategist, Ansys
Opening Keynote: Accelerating Moore and Beyond Moore with Multiphysics
Victoria (Vicki) Mitchell, VP Engineering, Central Engineering Systems Group, Arm
Keynote: 2.5 and 3D – The Road Ahead
Dhiraj Mallick, VP of Engineering and Business Development, Cerebras Systems
Keynote: Accelerating AI Compute with Wafer Scale
Mallik Tatipamula, CTO, Ericsson
Keynote: 5G and beyond: Future technology and research challenges and opportunities
Subhasish Mitra, Professor, Stanford University
Keynote: Abundant-Data Computing: The N3XT 1,000X
Suk Lee, Senior Director Design Infrastructure Management Division, TSMC
Keynote: TSMC & ANSYS – A Partnership for Your Creativity
Allison MacDonald, Lead Experimental Physicist, D-Wave
Keynote: Building a Superconducting Quantum Annealing Processor
Ideas Workshop Session Speakers
