Join us at DesignCon from January 31- February 2, 2023, at the Santa Clara Convention Center, Santa Clara, CA. Please stop by our booth, #748 for a simulation demonstration.
For 5G, autonomous vehicles, smart products, homes, cities, and factories to become reality, the enabling electronics technologies must deliver unprecedented levels of reliability. With innumerable sensors, microprocessors, and communication components, engineers face immense product reliability and performance challenges. Engineering simulation plays a critical role in helping high-tech companies deliver innovative and reliable products that achieve and exceed their target performance, energy-efficiency, cost, and speed-to-market goals.
High tech electronics systems are the backbone for disruptive transformations occurring in industries ranging from mobility to energy, to the fourth industrial revolution and in silico healthcare. Ansys delivers high-tech electronics simulation applications spanning from the scale of silicon in semiconductor design and fabrication, to thermal and electronic reliability in packages and systems to electrically large environments such as cities.
Please join us for drinks and bites at our Sips & Simulation happy hour at DesignCon. Let’s celebrate being back together again and have fun with a simulation game to win prizes. Of course, there are raffle prizes for showing up, but a little competition is always fun.
Date: Wednesday, February 1, 2023
Time: 5:00 PM – 8:00 PM
Location: Santa Clara Convention Center, Mission City Ballroom, M3
RSVP today to reserve your spot!
| Time | Presentation | Speaker |
| 11:30 AM | Welcome to Ansys 2023.1 Come to the Ansys booth to learn about the new capabilities in 2023 R1. Ansys Electronics solutions continue to bring best-in-class technologies to address high performance PCB, 3D-IC, EMI/EMC, thermal, cabling, antenna and electromechanical design challenges. These challenges are overcome with significant advancements in 2023R1 by developing automated workflows, tools integrations, modeling and other leadership-reinforcing capabilities in electromagnetic simulation and computational Multiphysics.
| Matt Commens, Senior Manager Product Management, Ansys |
| 12:00 PM | Full system EMC analysis of an EV powertrain Technologies such as faster switching devices like SiC and new inverter designs to support faster rise time are required to improve the performance of new electric vehicles powertrain. As vehicles become progressively autonomous and more safety-critical functions are electrified, product engineers are counting on simulation to address electromagnetic interference (EMI) and electromagnetic compatibility (EMC) of large, interconnected electronic systems. In this presentation we will present how Ansys simulation technology is helping companies around the globe to slash development time and reduce EMC certification tests for electric vehicle powertrain.
| Julaino Mologni, Senior Product Manager, Ansys |
| 1:00 PM | Cutting Edge Analysis of 5G/6G RAN/EDGE Nodes Come to our booth to learn how Ansys Software is being used to simulate the complete system analysis of Radio Access Networks (RAN) from a Multiphysics approach. We will show how Ansys is uniquely positioned to tackle the simulation of electrical, thermal, mechanical, and optical challenges of these complex systems, but also to optimize the performance.
| Wade Smith, Manager, Applications Engineering, Ansys |
| 2:00 PM | Unified 3DIC Power and Thermal Integrity Analysis using Ansys RedHawk SC Platform and TSMC 3Dblox Architecture Design complexity of modern-day multi-chip and 3DIC structures poses tremendous design/verification and analysis challenges. Assembling a complex chiplet system chip-by-chip opens doors to user errors such as missing/incorrect connections, shorted nets, disconnected paths, etc. TSMC 3Dblox architecture aims to address this issue. We present how ANSYS RedHawk-SC and RedHawk-SC-ET work smoothly with TSMC 3Dblox and provide an unparalleled flow for system level EMIR and Thermal analysis. Presented flows using these toolsets mitigate user errors through automation of critical and time-consuming steps in the assembly and analysis process. 3DIC multi-physics is a high priority among the EDA community and the collaboration between these two industry leaders goes a long way in addressing these challenges.
| Prakash Vennam, Director, R&D, Ansys |
| 3:00 PM | A Smart Digital Bridge to Seamlessly Connect ECAD and Simulation Altium and Ansys have partnered to solve one of the most time-consuming and error-prone tasks in the product engineering process - communication between ECAD and Simulation. What used to be import/export and manual communication is now a seamless connection via a bi-directional integration. In this presentation, will discuss how this smart digital bridge enables PCB designers and simulation engineers to smoothly exchange data while continuing to work within their respective environments. You’ll see first-hand how this digital continuity throughout the product engineering process can reduce time-consuming and costly errors and ultimately accelerate electronic product development and time to market.
| Joao Beck, Director of Enterprise Technical Marketing, Altium |
| 4:30 PM | Accelerating mmWave Design with Synopsys, Ansys and Keysight Reference Flow using TSMC N16FFC Process Smartphone, automotive and IoT applications all demand 5G/6G wireless communication. This is driving the development of RF designs on leading-edge, high volume process technologies. Synopsys, Ansys and Keysight will present how they teamed up with TSMC to develop a millimeter wave (mmWave) design reference flow for the TSMC N16FFC process that streamlines the use of advanced CMOS technology for mmWave circuit designs.
We will describe how the mmWave design reference flow cuts design turnaround time using the Synopsys Custom Design Family which provides a modern, open ecosystem with best-in-class RFIC design tools from Ansys and Keysight for ElectroMagnetic (EM) design, extraction, and analysis.
| Keith Lanier, Synopsys Corey Mathis, Keysight Marc Swinnen, Product Management Director, Ansys |
| Time | Presentation | Speaker |
| 11:00 AM | Evaluating Measurement-Simulation correlation for high speed serial links We use simulation tools as a virtual prototype environment. A first step to gain confidence in the tool is to simulate something for which you know the answer. I will walk you thru a methodology to verify the performance of HFSS to simulate high speed serial link channels.
| Prof Eric Bogatin, Professor, University of Colorado |
| 11:30 AM | Tackling Power Delivery Challenges using Chip Model Analyzer CMA is a system simulator capable of analyzing a Power Delivery Network from its early stages up to a complete system with die models coming from RedHawk and Package/PCB models coming from SIwave or HFSS. This allows engineers to simulate more and earlier, without having to wait for external models coming in too late, and to simulate full systems, decreasing the chances of design failures.
| Felipe Castro, Senior Application Engineer, Ansys |
| 1:00 PM | Advancing security verification for automotive ICs and Secure edge computing This presentation provides a comprehensive introduction of side-channel analysis, including the common side channels that have been exploited by attackers and the general design countermeasures. Then I will present industry proven flows for fast and effective pre-silicon side channel leakage analysis (SCLA) with focus on physical level power and electromagnetic (EM) side channels. Finally, I will provide a demonstration of SCLA on a popular AES crypto design.
| Lang Lin, Principal Product Manager, Ansys |
| 2:00 PM | Electronic Photonic Design Automation (EPDA) We will give a brief introduction to integrated photonics, including a review of key applications, from datacoms to sensing and even quantum information technology. The integrated photonic ecosystem is supported by electronic photonic design (EPDA) workflows that have been rapidly maturing over the last decade. We will present some of the highlights of current EPDA workflows with a particular focus on photonic integrated circuit simulation, including electronic/photonic co-simulation and advanced statistical analysis. In addition, we’ll show how custom components can be simulated with physical solvers using direct links to layout and technology files to perform foundry-specific design optimization and parameter extraction for automated compact model creation and PDK development.
| James Pond, Distinguished Engineer, Ansys Lumerical |
| 3:00 PM | ML-augmented Simulation and Co-optimization for Electronics and Semiconductor Applications Machine Learning technology has been extensively used across Ansys products especially for Electronics and Semiconductor applications. Ansys provides an open and extendable framework through PyAnsys on all tools to facilitate customers building customized ML applications. OptiSLang optimization tool can also be used with not only Ansys Multiphysics tools but also other companies' tools for an integrated co-optimization framework. We have also built customized ML applications for large input/output space problems such as fast thermal simulation on 3DIC which will be discussed in this talk as well." | Norman Chang, Ansys Fellow, IEEE Fellow, Chief Technologist of ESOBU, Ansys |
| 4:00 PM | Multi-Die System Design and Multi-Physics Analysis This presentation highlights Synopsys’ multi-die system solution and our close collaboration with Ansys on the multi-physics requirements including electrical, thermal and mechanical analysis
| Frank Malloy, Principal Product Engineer, Synopsys |
| 5:00 PM | AutoDesk - F360 SI Extension | Matt Berggren, Director of Engineering for Fusion 360 Electronics at Autodesk, AutoDesk |
