With 2020 on the horizon, now is a great time to recap the most influential content of the year.
Given all of the ANSYS blog’s how-tos, tips and tricks, trends and more, it’s hard to determine the most important takeaways of the year.
For help, we’ve turned to the experts — our readers. And so, without further ado, let’s count down the top 5 ANSYS blogs of 2019.
5: How to Build Reduced Order Models of Computational Fluid Dynamics Simulations
Reduced-order models (ROMs) are able to deliver quick results from complex systems. In the simulation world, this translates to reducing a 3D model down to a 1D model.
This is critical so engineers can quickly:
- Integrate models into a large digital twin or systems simulation
- Chart a system’s outputs based on its inputs
- Visualize a product’s performance
To learn how to use ANSYS DesignXplorer's 3D ROM builder to create ROMs, read: How to Build Reduced Order Models of Computational Fluid Dynamics Simulations.
4: How to Mesh Watertight CFD Geometry in the New Fluent Task-Based Workflow
Creating watertight CFD geometry can be tricky. However, in 2019, a series of task-based workflows have been added to ANSYS Fluent to simplify the process.
For instance, in the task-based workflow for watertight geometries, users are presented with steps, including:
- CAD import
- Surface mesh
- Describe geometry
- Flow-volume extraction
- Volume meshing
These steps can quickly process a simple model, but what about more complex systems like air cooling of an electric motor?
To learn some tips and tricks to process complex geometry, read: How to Mesh Watertight CFD Geometry in the New Fluent Task-Based Workflow.
3: Five Trends in the Aerospace Industry
If you want to know the trends in any industry, talk to the thought leaders, engineers and companies that service that industry.
After chatting with these groups, we discovered five trends that aerospace companies are focusing on:
- Electric and hybrid engines
- Autonomous flight systems
- Maintenance, repair and operations (MRO)
- Additive manufacturing for lightweight parts
- Multiphysics simulations for the growing complexities in designs
To learn about these trends in detail, read: 5 Trends in the Aerospace Industry.
2: Top 5 Reasons for Solder Joint Failure
It isn’t easy to identify the factors affecting solder joint reliability on a printed circuit board assembly (PCBA). As a result, assessing this reliability has become a pain point for electronic design engineers.
Solder joint failure could be caused by:
- Unintended stresses from potting, underfills and conformal coatings
- Unexpected temperature cycling
- Mechanical overstress events
- PCBA over-constraint conditions
- Soldering defects
To learn how to determine which of these scenarios might be causing a particular failure, read: Top 5 Reasons for Solder Joint Failure.
1: What Is DFMEA?
Design failure mode and effects analysis (DFMEA) helps engineers systematically assess and evaluate system, product and process failures.
To be exact, it is used to identify the effects and outcomes of these failures while mitigating them from happening.
DFMEA has been used in various industries to continuously improve performances of various designs.
To learn which industries use DFMEA, how they use it and the common mistakes they make, read: What is DFMEA?