Joins us for an ANSYS Webinar

Roughness Effect on Next-Gen Cu Interconnects

June 30, 2020

10:30 AM (IST)




In the past, for computation of electrical parameters of on-chip and chip-to-chip interconnects, it has been usually assumed that the conductor surface is homogeneous with smooth outer surfaces. However, copper (Cu) suffers from surface roughness that aggravates conductor losses in high speed interconnects. The delay in interconnects depends mainly on the interconnect parasitics, which would therefore be aggravated due to surface roughness. This leads to reduced bandwidth and higher latency.

The goal of this webinar is to address the roughness-related effects on performance of on-chip and chip-to-chip Cu interconnects. Topics include:

  • Analytical models for extracting line parasitics (RLC p.u.l.) for deeply scaled on-chip interconnects and chip-to-chip interconnects with rough surfaces
  • Analytical models for the computation of resistivity and mean free path of on-chip interconnects at current and advanced technology nodes (i.e., 45nm, 22nm, 13nm, 7nm)
  • Signal integrity analysis using eye diagrams at different bit rates to find the increase in frequency dependent losses due to surface roughness
  • Computational overhead (simulation time, physical memory, matrix size, number of tetrahedrons) incurred for simulating on-chip and chip-to-chip Cu interconnects at different values of roughness and technology nodes.
  • The relationship between surface roughness and various performance metrics such as delay, EDP, BWD, and insertion loss.
  • A comprehensive analysis of the impact of interconnect surface roughness on the energy-budget in networks on chips (NoCs)

Roughness Effect on Next-Gen Cu Interconnects

Speaker Bio

Rohit Sharma speaker

Dr. Rohit Sharma joined the electrical engineering department at IIT Ropar in 2012, where he is currently an Associate Professor. During his tenure, he has initiated activities in the area of electronic packaging. He has established state-of-the-art labs for undergraduate studies and postgraduate studies. He is also the coordinator of the Indo-Taiwan Joint Research Centre on Artificial Intelligence and Machine Learning.

Before joining IIT Ropar, Dr. Sharma was a post-doctoral fellow at the Interconnect Focus Center, Georgia Institute of Technology and the Design Automation Lab, Seoul National University, Seoul. His current research interests include design of high-speed chip-chip and on-chip interconnects, graphene based nanoelectronic devices and interconnects, signal and thermal integrity in high-speed interconnects and application of machine learning in advanced packaging and systems.

He is an associate editor to the IEEE Transactions on Components, Packaging and Manufacturing Technology and a Program Committee member of all major IEEE Packaging conferences. Dr. Sharma is also the associate dean of International Relations at IIT, and has been leading the institute’s initiatives in global outreach and internationalization.

Who should attend

Students, Faculty members, Academic researchers, Professionals from semiconductor and embedded hardware design industries

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