Join us to learn about the new capabilities available in Icepak 2019.1. The new release includes powerful new features for the design of electronics cooling strategies and electro-thermal analysis. New features include:
- Electro-thermal analysis — Two-way closed loop coupling between HFSS, Maxwell, Q3D Extractor and Icepak
- Modeling of inclined PCB
- DCIR EM loss coupling
Don’t miss this webinar detailing all the significant advancements in Icepak.