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Shifting Left with ANSYS - ANSYS Advantage - V13 I1

In 2017, Synopsys® and ANSYS partnered to take the best of ANSYS’ power integrity and reliability offerings and create an integrated flow with Synopsys implementation to drive robust semiconductor design optimization. Following the release of RedHawk Analysis Fusion by Synopsys in 2018, customers have shared positive feedback on productivity and design quality impact that have helped drive further innovations on this platform. We sat down with John Lee, vice president and general manager of the semiconductors division at ANSYS, and Jacob Avidan, senior vice president of signoff products at Synopsys, to get their views on the results of this collaboration and how the ANSYS–Synopsys collaboration helps address the challenges of emerging technologies.

Author: Synopsys Type: Article Date:
Product Name: ANSYS RedHawk
Product Category: Semiconductors
Industry: High Tech
Sub Industry: Semiconductors


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Speeding 5G Network Infrastructure Design - ANSYS Advantage - V13 I1 - Article

As the world becomes more connected and digital, the need for more data and higher speed is evident. The increase in global internet traffic, along with decentralization of cloud and data centers, has driven wired and wireless networks to support 5G network infrastructures. 5G technology promises to enable 1,000 times more traffic, 10 times faster speed, and a 10 times increase in throughput. These systems are highly complex and push the boundaries of silicon and manufacturing technologies. eSilicon uses ANSYS’ chip-package-system modeling and simulation software in a design-and-verification methodology that serves this ever-evolving market with timeliness and precision.

Author: eSilicon Corporation Type: Article Date:
Product Name: ANSYS HFSS, ANSYS RedHawk, ANSYS SIwave
Product Category: Electronics - High Frequency Electromagnetics, Semiconductors, Electronics - Signal Integrity
Industry: High Tech
Sub Industry: Semiconductors, Semiconductor Design


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Safe Travels - Article - ANSYS Advantage - V12 I1

Automotive electronics have always had to withstand difficult environment conditions. Today, with the safety of the vehicle’s occupants increasingly dependent on these same electronics, the consequences of failure are greater than ever before. Engineering simulation is essential to diagnose and validate automotive electronics reliability before investing in expensive prototypes and field testing.

Author: ANSYS Type: Article Date:
Product Name: ANSYS Icepak, ANSYS RedHawk
Product Category: Semiconductors
Industry: Automotive


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Taking the Leap to 7nm: Risk or Reward? - Article - ANSYS Advantage - V11 I2

Benefiting from the advances in semiconductor process node improvements is no easy feat. A host of design challenges and risks accompany every new generation of process nodes. The 7nm node is by far the most advanced available today from all leading foundries. This process node fundamentally challenges the basic assumptions on margin-based design. At the same time, it also pushes the boundaries on power and performance benefits that are available to designers. With the 7nm node being the industry driver for the near future, designers are fundamentally rethinking their design implementation strategies using upfront simulations.

Author: ANSYS, Inc. Type: Article Date:
Product Name: ANSYS RedHawk
Product Category: Semiconductors


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Designing Supercomputers - Article - ANSYS Advantage - V10 I2

One of the greatest challenges in designing fast, data-intensive supercomputers is providing power to and removing heat from hundreds of thousands of computing cores. Fujitsu uses the ANSYS power and thermal toolset to simulate its next-generation 3-D IC semiconductor designs from before the systems have been fully defined until final signoff. The result is higher performance and fewer design turns.

Author: Fujitsu Limited Type: Article Date:
Product Name: ANSYS RedHawk
Product Category: Semiconductors
Industry: High Tech


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The Backbone of the IoT - Article - ANSYS Advantage - V10 I2

The rapid growth of the Internet of Things (IoT) is generating a huge increase in internet traffic. Companies that deliver the ultrahigh-speed systems-on-chip (SoCs) for multi-terabit networking equipment must provide the highest level of data integrity while meeting power, performance, bandwidth and cost requirements. The ANSYS semiconductor toolset enables ClariPhy to meet this challenge and deliver SoCs without additional fab spins.

Author: ClariPhy Communications, Inc. Type: Article Date:
Product Name: ANSYS SIwave, ANSYS RedHawk
Product Category: Semiconductors
Industry: High Tech


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Under the Hood - ANSYS Advantage - Article - V10 I1

The electronics in modern automobiles must operate in a high temperature, under-hood environment without sacrificing performance or reliability. The traditional approach to thermal design, which is based on the assumption that the entire integrated circuit (IC) is at a constant temperature, is fast becoming obsolete as higher power dissipation and shrinking form factors make thermal design more critical. NXP engineers use ANSYS tools to calculate temperature and current density throughout the device, making it possible to predict local junction temperatures more accurately and perform thermal-aware electromigration (EM) analysis.

Author: NXP Semiconductors Inc Type: Article Date:
Product Name: ANSYS Icepak, ANSYS Sentinel, ANSYS Totem, ANSYS RedHawk
Product Category: Fluids, Multiphysics, Semiconductors, Electronics - Cooling
Industry: Automotive, High Tech
Sub Industry: Car and Light Truck OEMs


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More Music, Less Noise - Article - ANSYS Advantage - V9 I2

Developing autonomous systems is a challenge without precedence. Whole new engineering fields – such as artificial intelligence (AI) – need to be developed, yet time-to-market is short and competition is intense. Engineering challenges can only be accomplished with the help of simulation. In this eBook you'll learn how, with engineering simulation, you can virtually test thousands or millions of operating scenarios and design parameters with precision, speed, cost economy and confidence in your products’ performance.

Author: NXP Semiconductor N.V. Type: Article Date:
Product Name: ANSYS RedHawk
Product Category: Electronics - Electromechanical
Industry: Automotive
Sub Industry: Car and Light Truck OEMs


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Managing IP Risks - Article - ANSYS Advantage - V8 I3

IP-aware SoC power noise and reliability analysis workflow is required in the FinFET era.

Author: ANSYS, Inc. Type: Article Date:
Product Name: ANSYS Totem, ANSYS RedHawk
Product Category: Electronics - Electromechanical
Industry: High Tech


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