ANSYS Icepak provides powerful electronic cooling solutions which utilize the industry-leading ANSYS Fluent computational fluid dynamics (CFD) solver for thermal and fluid flow analyses of integrated circuits (ICs), packages, printed circuit boards (PCBs) and electronic assemblies. The ANSYS Icepak CFD solver uses the ANSYS Electronics Desktop (AEDT) graphical user interface (GUI). This provides a CAD-centric solution for engineers who can leverage the easy-to-use ribbon interface to manage thermal issues within the same unified framework as ANSYS HFSS, ANSYS Maxwell and ANSYS Q3D Extractor. Electrical and mechanical engineers working in this environment will enjoy a completely automated design flow with seamless coupling from HFSS, Maxwell and Q3D Extractor into Icepak for steady-state or transient thermal analysis.

Engineers can rely on Icepak for an integrated electronics cooling solution for electronic applications ranging in scale from individual ICs to packages and PCBs, up to computer housings and entire data centers. The Icepak solver performs conduction, convection and radiation conjugate heat transfer analyses. It has many advanced capabilities to model laminar and turbulent flows, and species analysis including radiation and convection. Icepak provides a vast library of fans, heatsinks and materials to furnish solutions to everyday electronic cooling concerns.

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Capabilities

  • Comprehensive Multiphysics Design Flow

    Integration with the ANSYS engineering portfolio gives you an unequaled design flow to analyze difficult issues including PCB warping, motor cooling and more.

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  • ECAD-MCAD Import

    Lets you easily import MCAD and EDA geometries for an efficient workflow.

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  • Convenient Slider Bar Meshing

    Provides advanced, automatic mesh generation optimized for electronic and electromechanical components.

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  • Extensive Libraries for Thermal Physics

    Provides access to a vast library of standard components to quickly build cooling models for analysis.

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  • Optimization in Icepak

    Leverage parametric design, “what if” analyses and Design of Experiments for maximum temperature, current and power analyses.

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  • Visualization

    Powerful toolset lets you visualize 3-D flow animation, velocity vectors, temperature contours and more.

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  • Multidomain System Modeling

    Integrated modeling capability to analyze electromagnetic components within a systems environment

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  • Electronics Desktop

    Unified platform for electromagnetic, electromechanical, circuit and system simulation. HFSS, Maxwell, Q3D Extractor, Icepak and Simplorer are built into the Electronics Desktop, which serves as a universal pre- and post- processor for these tools.

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See how our customers are using our software:

Ruggedized Systems: Cool and Collected

Ruggedized Systems: Cool and Collected

To meet demanding military specifications for mobile and interconnected surveillance, communications and operational devices, Kontron uses sophisticated thermal simulation to balance size, weight, power and cooling (SWaP-C) trade-offs for 'ruggedized' modular chassis that support customized solutions for mission-critical operations.

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Keeping the Block Cool

Keeping the Block Cool

As cars become more complex, companies that manufacture the supporting electronic systems must make them reliable and safe. Automotive electronics system manufacturer Kyungshin improved the thermal management of its smart junction blocks while cutting production time by 80 percent and costs by over 50 percent.

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