Product Specs
Perform conduction, convection and radiation conjugate heat transfer analyses, with many advanced capabilities to model laminar and turbulent flows, and species analysis including radiation and convection.
Ansys Icepak
Cooling Simulation Software for Electronic Components
Ansys Icepak is a CFD solver for electronics thermal management. It predicts airflow, temperature and heat transfer in IC packages, PCBs, electronic assemblies/enclosures and power electronics.
Electronics Cooling & PCB Thermal Simulation and Analysis
Ansys Icepak provides powerful electronic cooling solutions that utilize the industry leading Ansys Fluent computational fluid dynamics (CFD) solver for thermal and fluid flow analyses of integrated circuits (ICs), packages, printed circuit boards (PCBs) and electronic assemblies. The Ansys Icepak CFD solver uses the Ansys Electronics Desktop (AEDT) graphical user interface (GUI).
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Unstructured, Body-fitted Meshing
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Comprehensive Thermal Reliability Solution
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High-fidelity CFD Solver
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Industry Leading Multiscale Multiphysics
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MCAD and ECAD Support -
Solar radiation -
Parametrics and Optimization -
Customization and Automation
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Network Modeling -
DC Joule Heating Analysis -
Electro-thermal and Thermo-Mechanical -
Extensive Libraries for Thermal
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Liquid Cooling -
Dynamic Thermal Management -
Varying Flow and Power ROM
Ruggedized Systems: Cool and Collected
Kontron uses sophisticated thermal simulation to balance size, weight, power and cooling (SWaP-C) for ‘ruggedized’ modular chassis.
Today’s military vehicles depend on state-of-the-art visualization, imaging and networking technologies to improve situational awareness and enable military leaders to make the best possible decisions. Vehicles such as Humvees, armored mine-resistant ambush protected vehicles (MRAPs) and unmanned aerial vehicles (UAVs) rely on advanced electronics in compact systems to support their critical missions.
The devices placed on vehicles such as battlefield sensor systems, military GPS and next generation communications equipment must be able to communicate and interact in extreme physical environments where they might be exposed to severe electromagnetic conditions. Military standards require that these devices withstand specified extremes of temperature, vibration, shock, salt spray, sand and chemical exposure. Size, weight, power and cooling (SWAP-C) requirements demand that the electronic systems that power these devices be small enough that they do not hinder mobility.
January 2021
What's New
Latest streamlined workflow to import designs from HFSS, Maxwell, Q3D into Icepak for quick thermal analysis.
The FEA solver from Ansys Mechanical is now available in the same environment as electromagnetic designs in HFSS, Maxwell, and Q3D. This allows the design engineers the ability to get quick thermal insights into a design without overly complicated setup and analysis.
Allows for transient control of component powers and fan speeds based upon localized temperature values. It works through Python scripts to simulated dynamic loading conditions in complex electronic systems.
Modern user experience with comprehensive 3D modeling capabilities, robust integration of PCB layouts, and extensive scripting and automation capabilities. Now fully compatible with direct submission of jobs to Ansys Cloud for the ultimate in flexibility.
Case Studies
Predict airflow, temperature and heat transfer for electronics assemblies and printed circuit boards
With CAD-centric (mechanical and electrical CAD) and multiphysics user interfaces, Icepak facilitates the solving of today’s most challenging thermal management problems in electronics products and assemblies. Icepak uses sophisticated CAD healing, simplification and metal fraction algorithms that reduce simulation times, while providing highly accurate solutions that have been validated against real-world products. The solution’s high degree of accuracy results from the highly automated, advanced meshing and solver schemes, which ensure a true representation of the electronics application.
Key Features
Icepak includes all modes of heat transfer — conduction, convection and radiation — for steadystate and transient electronics cooling applications.
- Electronics Desktop 3D layout GUI
- DC joule heating analysis
- Multiple-fluid analysis
- Reduced order flow and thermal
- Thermo-electric cooler modeling
- Package characterization
- Integrated graphical modeling environment
Power dissipation of ICs and power losses across the board are key inputs for thermal analysis.
You can also conduct thermomechanical stress analysis and airflow analysis to select the ideal heat sink or fan solution. Our integrated workflow enables you to conduct design trade-offs, resulting in improved reliability and performance.
Icepak users can easily assemble automated workflows within the Ansys ecosystem to complete multiphysics analyses for electromigration, dielectric breakdown and multi-axial solder joint fatigue.
Work Smarter with Product Bundles
Thermal Analysis Product Pairings
Improve wireless communications, boost signal coverage and maintain connectivity for antenna systems, predict product performance and establish safe operating temperatures with these product pairings.
| Electromagnetic Losses with Thermal Coupling For Temperature-Dependent Antenna Performance Assessment (Icepak & HFSS) |
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| Ensuring the thermal stability of antenna-enabled 5G infrastructure, automotive radar, IoT devices and mobile electronic devices is critical in producing expected behavior. Power hungry activity such as video calls, online-based games or varying environmental conditions causes significant swings in device temperatures. If a phone’s battery becomes too hot, it can lose charge or even create safety issues. Also, high temperatures can affect other electronic components within a phone and impact RF antenna performance. Breakdown of a phone’s connectivity with mobile carriers, Bluetooth or Wi-Fi is traceable to thermal problems. You can predict these issues before you build the hardware by simulating your design using Ansys tools. For example, electrical engineers can dynamically link Ansys HFSS and Ansys Icepak in the Electronics Desktop to simulate the temperature of the antenna. Based on the electromagnetic and thermal coupling solutions, they can modify antenna design and predict antenna efficiency and the overall thermal and EM performance of the product. These EM and thermal simulations help to improve wireless communications, boost signal coverage and maintain connectivity for antenna-enabled systems. |
| Board-Level Electrothermal Coupling (Icepak and SIwave) |
| Even a marginal rise in temperature can affect the performance and reliability of electronic components, leading to system-wide problems. Board-level power integrity simulations within SIwave can be combined with Icepak thermal simulations to get a complete picture of a PCB’s electrothermal performance. SIwave and Icepak automatically exchange DC power and temperature data to calculate Joule heating losses within PCBs and packages to obtain highly accurate temperature field and resistive loss distributions. These DC electrothermal solutions let you manage the heat produced by your designs and predict thermal performance and safe operating temperatures of chips, packages and boards. |
ICEPAK RESOURCES & EVENTS
Featured Webinars
On Demand Webinar
Thermal Management for Power Electronics
This webinar showcases Icepak’s solutions for power electronics.
On Demand Webinar
Ansys Icepak and Sherlock For Temperature Cycling
This webinar will demonstrate an automated process of thermal modeling of printed circuit boards.
Case Studies
Webinars on Demand
Blogs
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Importing ECAD Trace Data for Better Thermal and Vibrational Analysis -
Understanding 5G Infrastructure Benefits & Challenges -
How to Keep Electronic Components Cool with CFD and Thermal Network Modeling -
Low-voltage Drive Improves the Safety and Performance of Electric Vehicles -
Improve Thermal Reliability with Ansys Icepak -
Making Wireless Multigigabit Data Transfer Reliable with Simulation
Ready to make the impossible possible?
Ready to make the impossible possible?
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